Engineering topics
Sampson, Michael J.
Publications and source records attributed to Sampson, Michael J..
Electrical, Electronic and Electromechanical (EEE) Parts for Spaceflight Applications: A NASA Electronic Parts and Packaging Historical Perspective
This presentation provides a brief NASA-perspective of the major historical milestones in the development of space quality electrical, electronic, and electromechanical (EEE) components in the USA from the dawn of the space age through present.
NASA Electronic Parts and Packaging (NEPP) Program: Overview and Technology Focus Areas - Responsive Technology Assurance for Civil Space
NASA Electronic Parts and Packaging (NEPP) Program Overview and Technology Highlights – The NEPP Program provides NASA's leadership for developing and maintaining guidance for the screening, qualification, test, and reliable use of electrical, electronic, and electromechanical parts by NASA, in collaboration with other government agencies and industry. The NASA Electronic Parts Assurance Group (NEPAG) is a core portion of NEPP. This presentation highlights key focus areas for 2019.
Class Y status and update on JEDEC JC-13 and SAE SSTC CE-12 related tasks
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Electrical, Electronic and Electromechanical (EEE) Parts in the New Space Paradigm: When is Better the Enemy of Good Enough?
As the space business rapidly evolves to accommodate a lower cost model of development and operation via concepts such as commercial space and small spacecraft (aka, CubeSats), traditional EEE parts screening and qualification methods are being scrutinized under a risk-reward trade space. In this presentation, two basic concepts will be the overarching theme: 1) The movement from complete risk aversion EEE parts methods to managing andor accepting risk via alternate approaches; and, 2) A discussion of over-design focusing on both electrical design performance and bounding margins.
NASA Feedback to DLA Land & Maritime Moratorium on Wafer Fab Audits
On September 29, 2017 the Defense Logistics Agency (DLA), Land and Maritime, announced that on September 1, 2017 they had begun a moratorium on the auditing of wafer fabrication facilities (fabs) used in the production of semiconductor die for military (MIL) qualified integrated circuits and discrete semiconductors (transistors and diodes). The announcement said the moratorium would last for six months initially and would apply to all wafer fabs qualified to MIL-PRF-19500 (discretes) and MIL-PRF-38535 (ICs) located, onshore or offshore. The stated rationale behind this action was to give DLA time to evaluate the risk of modifying current surveillance practices across 70+ Federal Stock Classes (FSC) under the jurisdiction of the DLA Qualifying Activity (VQ). The objective was to free up the resources used in these audits so they could be redirected towards audits of other commodities which were under resourced, notably connectors. In the announcement letter, DLA-VQ requested data from the community to assist with decisions on wafer fab re-audit cycle modifications. NASA used available information on current and historical audit schedules to gather such data and analyzed it to provide an in-depth understanding of the impact of locations, part types, in-house or out-of-house fabs on those schedules over time. This presentation provides the results of NASA's data analysis and suggest some changes to auditing practices that could increase efficient use of resources without significant increases in risk.
NASA EEE Parts and NASA Electronic Parts and Packaging (NEPP) Program Update 2018
NASA Electronic Parts and Packaging (NEPP) Program and NASA Electronic Parts Assurance Group (NEPAG) are NASAs point-of-contacts for reliability and radiation tolerance of EEE parts and their packages. This presentation includes an FY18 program overview.
Electrical, Electronic and Electromechanical (EEE) Parts in the New Space Paradigm: When is Better the Enemy of Good Enough?
As the space business rapidly evolves to accommodate a lower cost model of development and operation via concepts such as commercial space and small spacecraft (aka, CubeSats and swarms), traditional EEE parts screening and qualification methods are being scrutinized under a risk-reward trade space. In this presentation, two basic concepts will be discussed: (1) The movement from complete risk aversion EEE parts methods to managing and/or accepting risk via alternate approaches; and, (2) A discussion of emerging assurance methods to reduce overdesign as well emerging model based mission assurance (MBMA) concepts. center dot Example scenarios will be described as well as consideration for trading traditional versus alternate methods.
NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance, An Overview
This presentation will cover NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance Structure, NASA Electronic Parts and Packaging (NEPP) Program, NASA Electronic Parts Assurance Group (NEPAG), examples of assurance challenges, and future challenges.
The NASA Electronic Parts Assurance Group (NEPAG) - An Overview
This presentation will discuss in detail NASA Government Working Group government topics from NASA Electronic Parts Assurance Group (NEPAG) which require additional in-depth technical solutions.
NASA Electronic Parts and Packaging (NEPP) Program - Technology
This presentation provides an overview of the NEPP Program.
Echoes of the Past, Glimpses of the Future - Ongoing Trends in Assurance of EEE Parts for Spaceflight
This presentation will review some past NASA presentations that had identified challenges and future trends in the assurance of Electrical, Electronic and Electromechanical (EEE) parts for spaceflight applications. It will contrast the concerns expressed in those presentations with the challenges of today and identify trends that give insight into the future. Common themes include the use of commercial parts, limited technical and physical resources, the pace of technology change and the difficulties in handling and testing individual parts as they become smaller and more complex. Some options for dealing with these challenges will be suggested to accommodate increasing numbers of smallsats, cubesats, constellations and other disruptive concepts, as space becomes more and more commercialized.
The NASA Electronic Parts and Packaging (NEPP) Program - NASA Items of Interest
This presentation provides a background summary of the NEPP Program, its origins and operating principles followed by examples of issues and opportunities that NEPP is currently pursuing. These examples include Electrostatic Discharge protection procedures that are not being properly applied, one reason for which is the confusion caused by the numerous, different standards covering this topic. Updates are provided for key activities in radiation hardness assurance, and the evaluation of automotive grade electronic parts for use in space applications. Some recent examples of part problems experienced by NASA are briefly described and the latest trending of incidences of counterfeit electronic parts is shown graphically. Finally some forward actions are identified and the time, place and typical topics is provided for the next NEPP Electronic Technology Workshop (ETW).
Update on NASA Microelectronics Activities
Mission Statement: The NASA Electronic Parts and Packaging (NEPP) Program provides NASA's leadership for developing and maintaining guidance for the screening, qualification, test. and usage of EEE parts by NASA as well as in collaboration with other government Agencies and industry. NASA Space Technology Mission Directorate (STMD) "STMD rapidly develops, demonstrates, and infuses revolutionary, high-payoff technologies through transparent, collaborative partnerships, expanding the boundaries of the aerospace enterprise." Mission Statement: The Space Environments Testing Management Office (SETMO) will identify, prioritize, and manage a select suite of Agency key capabilities/assets that are deemed to be essential to the future needs of NASA or the nation, including some capabilities that lack an adequate business base over the budget horizon. NESC mission is to perform value-added independent testing, analysis, and assessments of NASA's high-risk projects to ensure safety and mission success. NASA Space Environments and Avionics Fellows as well as Radiation and EEE Parts Community of Practice (CoP) leads.
NASA Electronic Parts and Packaging (NEPP) Program, Discussion of Highly Accelerated Life Testing (HALT) of Capacitors
Highly Accelerated Life Testing (HALT) testing holds promise for affordable efficient acceptance testing of multi-layer ceramic chip capacitors (MLCCs) especially for commercial off the shelf (COTS).