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Sampson, Michael

Publications and source records attributed to Sampson, Michael.

8 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2019

NASA Electronic Parts and Packaging (NEPP) Program Status and Technology Investments Overview

The presentation provides an updated, high-level overview of the NEPP Program. The latest organizational chart is presented that shows the names of the Program and Assistant Program Managers. Additionally, the recent work that is on-going with the updating of several NASA NPDs, NPRs and technical standards is reviewed. Internal and external organizational interfaces are described. Finally, the current technology focus areas are described. These areas include passives, wide-band gap power devices, processor units (CPUs and GPUs), 2.5D and 3D device architectures, memories, and data analytics.

NEPAG↗
NASA NTRS2019

NASA Electronic Parts and Packaging (NEPP) Program Focus, Strategic Collaborations, and Our Path to the Future

NASA Electronic Parts and Packaging (NEPP) Program Overview Mission Statement: Provide NASA's leadership for developing and maintaining guidance for the screening, qualification, test, and reliable use of EEE parts by NASA, in collaboration with other government agencies and industry. The NASA Electronic Parts Assurance Group (NEPAG) is a core portion of NEPP.

NASA Electronic Parts and Packaging (NEPP) Program↗
NASA NTRS2017

Parametric Failures in COTS Capacitors

Insertion of COTS components into hi-rel systems require extensive environmental testing of the parts that often results in parametric failures. Based on experience with commercial and hi-rel PME and BME ceramic capacitors and polymer and MnO2 cathode tantalum capacitors, this presentation discusses two major reasons for parametric failures. One is due to the marketing pressure that forces manufacturers to squeeze performance of COTS components thus leaving insufficient margin between the rated and actual characteristics. Another, and probably a more serious reason is degradation of characteristics caused by physico-chemical processes in materials under environmental stresses. Reliability assessment requires development of models to predict behavior of the parts during applications based on accelerated testing that might be outside the specified conditions and target applications. Examples of models developed to simulate and predict wear-out failures are presented. Risks associated with overstressing during HALT are discussed.

Teverovsky, Alexander↗
NASA NTRS2017

Development of Stable, Low Resistance Solder Joints for a Space-Flight HTS Lead Assemblies

The solder joints in spaceflight high temperature superconductor (HTS) lead assemblies for certain astrophysics missions have strict constraints on size and power dissipation. In addition, the joints must tolerate years of storage at room temperature, many thermal cycles, and several vibration tests between their manufacture and their final operation on orbit. As reported previously, solder joints between REBCO coated conductors and normal metal traces for the Astro-H mission showed low temperature joint resistance that grew approximately as log time over the course of months. Although the assemblies worked without issue in orbit, for the upcoming X-ray Astrophysics Recovery Mission we are attempting to improve our solder process to give lower, more stable, and more consistent joint resistance. We produce numerous sample joints and measure time- and thermal cycle-dependent resistance, and characterize the joints using x-ray and other analysis tools. For a subset of the joints, we use SEMEDS to try to understand the physical and chemical processes that effect joint behavior.

high temperature superconductivity↗
NASA NTRS2017

NEPP Program Task 17-294 Government Working Group

This presentation will discuss in detail NASA Government Working Group government topics from NASA Electronic Parts Assurance Group (NEPAG) which require additional in-depth technical solutions.

Quality Assurance and Reliability - Government Wor↗
NASA NTRS2016

Electrical, Electronic, and Electromechanical (EEE) Parts Management and Control Requirements for Space Flight Hardware and Critical Ground Support Equipment...aka... The NASA EEE Parts Standard, NASA-STD 8739.10

Describes development and content of a new NASA Standard for Electrical Electronic and Electromechanical (EEE) parts. This Standard reflects current practices, instead of changing them. Most NASA Centers utilize local documents, but there is minimal consistency across the Agency. A gap analysis clearly shows the differences that exist among the different centers and with respect to the NASA Parts Policy. Once approved, the new standard can be referenced in contracts and agreements with organizations outside of NASA.

Electronic↗
NASA NTRS2003

Could Zinc Whiskers Be Impacting Your Electronic Systems? Raise Your Awareness

During the past several decades electrical short circuits induced by "Zinc Whiskers" have been cited as the root cause of failure for various electronic systems (e.g., apnea monitors, telecom switches). These tiny filaments of zinc that may grow from some zinc-coated items (especially those coated by electroplating processes) have the potential to induce electrical shorts in exposed circuitry. Through this article, the authors describe a particular failure scenario attributed to zinc whiskers that has affected many facilities (including some NASA facilities) that utilized zinc-coated raised "access" floor tiles and support structures. Zinc whiskers that may be growing beneath your raised floor have the potential to wreak havoc on electronic systems operating above the floor.

Sampson, Michael↗