Engineering topics

Sakamoto, Jeffrey

Publications and source records attributed to Sakamoto, Jeffrey.

13 records

DOE OSTI2024

3-D composite anodes for Li-ion batteries with high capacity and fast charging capability

A lithium-ion battery includes an electrode with a plurality of channels formed at least partially through its thickness. Each channel has a diameter in a range from 5 μm to 100 μm and/or is spaced apart from another channel by a distance in a range from 10 μm to 200 μm as measured between centerlines of the channels. The electrode may be an anode and includes carbonaceous material such as graphite and/or additional electrochemically active lithium host materials. The battery can be charged at a C-rate greater than 2 C.

Chen, Kuan-Hung↗

NASA NTRS2011

Metallization for Yb14MnSb11-Based Thermoelectric Materials

Thermoelectric materials provide a means for converting heat into electrical power using a fully solid-state device. Power-generating devices (which include individual couples as well as multicouple modules) require the use of ntype and p-type thermoelectric materials, typically comprising highly doped narrow band-gap semiconductors which are connected to a heat collector and electrodes. To achieve greater device efficiency and greater specific power will require using new thermoelectric materials, in more complex combinations. One such material is the p-type compound semiconductor Yb14MnSb11 (YMS), which has been demonstrated to have one of the highest ZT values at 1,000 C, the desired operational temperature of many space-based radioisotope thermoelectric generators (RTGs). Despite the favorable attributes of the bulk YMS material, it must ultimately be incorporated into a power-generating device using a suitable joining technology. Typically, processes such as diffusion bonding and/or brazing are used to join thermoelectric materials to the heat collector and electrodes, with the goal of providing a stable, ohmic contact with high thermal conductivity at the required operating temperature. Since YMS is an inorganic compound featuring chemical bonds with a mixture of covalent and ionic character, simple metallurgical diffusion bonding is difficult to implement. Furthermore, the Sb within YMS readily reacts with most metals to form antimonide compounds with a wide range of stoichiometries. Although choosing metals that react to form high-melting-point antimonides could be employed to form a stable reaction bond, it is difficult to limit the reactivity of Sb in YMS such that the electrode is not completely consumed at an operating temperature of 1,000 C. Previous attempts to form suitable metallization layers resulted in poor bonding, complete consumption of the metallization layer or fracture within the YMS thermoelement (or leg).

Firdosy, Samad↗

NASA NTRS2009

Composite Silica Aerogels Opacified with Titania

A further improvement has been made to reduce the high-temperature thermal conductivities of the aerogel-matrix composite materials described in Improved Silica Aerogel Composite Materials (NPO-44287), NASA Tech Briefs, Vol. 32, No. 9 (September 2008), page 50. Because the contribution of infrared radiation to heat transfer increases sharply with temperature, the effective high-temperature thermal conductivity of a thermal-insulation material can be reduced by opacifying the material to reduce the radiative contribution. Therefore, the essence of the present improvement is to add an opacifying constituent material (specifically, TiO2 powder) to the aerogel-matrix composites.

Paik, Jon-Ah↗

NASA NTRS2009

Further Development of Scaffolds for Regeneration of Nerves

Progress has been made in continuing research on scaffolds for the guided growth of nerves to replace damaged ones. The scaffolds contain pores that are approximately cylindrical and parallel, with nearly uniform widths ranging from tens to hundreds of microns. At the earlier stage of development, experimental scaffolds had been made from agarose hydrogel. Such a scaffold was made in a multistep process in which poly(methyl methacrylate) [PMMA] fibers were used as templates for the pores. The process included placement of a bundle of the PMMA fibers in a tube, filling the interstices in the tube with a hot agarose solution, cooling to turn the solution into a gel, and then immersion in acetone to dissolve the PMMA fibers. The scaffolds were typically limited to about 25 pores per scaffold, square cross sections of no more than about 1.5 by 1.5 mm, and lengths of no more than about 2 mm.

Sakamoto, Jeffrey↗

NASA NTRS2009

Expansion Compression Contacts for Thermoelectric Legs

In a proposed alternative to previous approaches to making hot-shoe contacts to the legs of thermoelectric devices, one relies on differential thermal expansion to increase contact pressures for the purpose of reducing the electrical resistances of contacts as temperatures increase. The proposed approach is particularly applicable to thermoelectric devices containing p-type (positive-charge-carrier) legs made of a Zintl compound (specifically, Yb14MnSb11) and n-type (negative charge-carrier) legs made of SiGe. This combination of thermoelectric materials has been selected for further development, primarily on the basis of projected thermoelectric performance. However, it is problematic to integrate, into a practical thermoelectric device, legs made of these materials along with a metal or semiconductor hot shoe that is required to be in thermal and electrical contact with the legs. This is partly because of the thermal-expansion mismatch of these materials: The coefficient of thermal expansion (CTE) of SiGe is 4.5 x 10(exp -6) C (exp -1), while the CTE of Yb14MnSb11 is 20 x 10(exp -6) C(exp -1). Simply joining a Yb14MnSb11 and a SiGe leg to a common hot shoe could be expected to result in significant thermal stresses in either or both legs during operation. Heretofore, such thermal stresses have been regarded as disadvantageous. In the proposed approach, stresses resulting from the CTE mismatch would be turned to advantage.

Sakamoto, Jeffrey↗

NASA NTRS2008

Hybrid Multifoil Aerogel Thermal Insulation

This innovation blends the merits of multifoil insulation (MFI) with aerogel-based insulation to develop a highly versatile, ultra-low thermally conductive material called hybrid multifoil aerogel thermal insulation (HyMATI). The density of the opacified aerogel is 240 mg/cm3 and has thermal conductivity in the 20 mW/mK range in high vacuum and 25 mW/mK in 1 atmosphere of gas (such as argon) up to 800 C. It is stable up to 1,000 C. This is equal to commercially available high-temperature thermal insulation. The thermal conductivity of the aerogel is 36 percent lower compared to several commercially available insulations when tested in 1 atmosphere of argon gas up to 800 C.

Sakamoto, Jeffrey↗

NASA NTRS2008

Improved Silica Aerogel Composite Materials

A family of aerogel-matrix composite materials having thermal-stability and mechanical- integrity properties better than those of neat aerogels has been developed. Aerogels are known to be excellent thermal- and acoustic-insulation materials because of their molecular-scale porosity, but heretofore, the use of aerogels has been inhibited by two factors: (1) Their brittleness makes processing and handling difficult. (2) They shrink during production and shrink more when heated to high temperatures during use. The shrinkage and the consequent cracking make it difficult to use them to encapsulate objects in thermal-insulation materials. The underlying concept of aerogel-matrix composites is not new; the novelty of the present family of materials lies in formulations and processes that result in superior properties, which include (1) much less shrinkage during a supercritical-drying process employed in producing a typical aerogel, (2) much less shrinkage during exposure to high temperatures, and (3) as a result of the reduction in shrinkage, much less or even no cracking.

Paik, Jong-Ah↗

NASA NTRS2007

Coating Thermoelectric Devices To Suppress Sublimation

A technique for suppressing sublimation of key elements from skutterudite compounds in advanced thermoelectric devices has been demonstrated. The essence of the technique is to cover what would otherwise be the exposed skutterudite surface of such a device with a thin, continuous film of a chemically and physically compatible metal. Although similar to other sublimation-suppression techniques, this technique has been specifically tailored for application to skutterudite antimonides. The primary cause of deterioration of most thermoelectric materials is thermal decomposition or sublimation - one or more elements sublime from the hot side of a thermoelectric couple, changing the stoichiometry of the device. Examples of elements that sublime from their respective thermoelectric materials are Ge from SiGe, Te from Pb/Te, and now Sb from skutterudite antimonides. The skutterudite antimonides of primary interest are CoSb3 [electron-donor (n) type] and CeFe(3-x)Co(x)Sb12 [electron-acceptor (p) type]. When these compounds are subjected to typical operating conditions [temperature of 700 C and pressure <10(exp -5) torr (0.0013 Pa)], Sb sublimes from their surfaces, with the result that Sb depletion layers form and advance toward their interiors. As the depletion layer advances in a given device, the change in stoichiometry diminishes the thermal-to-electric conversion efficiency of the device. The problem, then, is to prevent sublimation, or at least reduce it to an acceptably low level. In preparation for an experiment on suppression of sublimation, a specimen of CoSb3 was tightly wrapped in a foil of niobium, which was selected for its chemical stability. In the experiment, the wrapped specimen was heated to a temperature of 700 C in a vacuum of residual pressure <10(exp -5) torr (0.0013 Pa), then cooled and sectioned. Examination of the sectioned specimen revealed that no depletion layer had formed, indicating the niobium foil prevented sublimation of antimony at 700 C. This was a considerable improvement, considering that uncoated CoSb3 had been found to decompose to form the lowest antimonide at the surface at only 600 C. Evidently, because the mean free path of Sb at the given temperature and pressure was of the order of tens of centimeters, any barrier closer than tens of centimeters (as was the niobium foil) would have suppressed transport of Sb vapor, thereby suppressing sublimation of Sb

Sakamoto, Jeffrey↗

NASA NTRS2007

Mo/Ti Diffusion Bonding for Making Thermoelectric Devices

An all-solid-state diffusion bonding process that exploits the eutectoid reaction between molybdenum and titanium has been developed for use in fabricating thermoelectric devices based on skutterudite compounds. In essence, the process is one of heating a flat piece of pure titanium in contact with a flat piece of pure molybdenum to a temperature of about 700 C while pushing the pieces together with a slight pressure [a few psi (of the order of 10 kPa)]. The process exploits the energy of mixing of these two metals to form a strong bond between them. These two metals were selected partly because the bonds formed between them are free of brittle intermetallic phases and are mechanically and chemically stable at high temperatures. The process is a solution of the problem of bonding hot-side metallic interconnections (denoted hot shoes in thermoelectric jargon) to titanium-terminated skutterudite n and p legs during the course of fabrication of a unicouple, which is the basic unit cell of a thermoelectric device (see figure). The hot-side operating temperature required for a skutterudite thermoelectric device is 700 C. This temperature precludes the use of brazing to attach the hot shoe; because brazing compounds melt at lower temperatures, the hot shoe would become detached during operation. Moreover, the decomposition temperature of one of the skutterudite compounds is 762 C; this places an upper limit on the temperature used in bonding the hot shoe. Molybdenum was selected as the interconnection metal because the eutectoid reaction between it and the titanium at the ends of the p and n legs has characteristics that are well suited for this application. In addition to being suitable for use in the present bonding process, molybdenum has high electrical and thermal conductivity and excellent thermal stability - characteristics that are desired for hot shoes of thermoelectric devices. The process takes advantage of the chemical potential energy of mixing between molybdenum and titanium. These metals have a strong affinity for each other. They are almost completely soluble in each other and remain in the solid state at temperatures above the eutectoid temperature of 695 C. As a result, bonds formed by interdiffusion of molybdenum and titanium are mechanically stable at and well above the original bonding temperature of about 700 C. Inasmuch as the bonds are made at approximately the operating temperature, thermomechanical stresses associated with differences in thermal expansion are minimized.

Sakamoto, Jeffrey↗

NASA NTRS2006

Aerogel/Particle Composites for Thermoelectric Devices

Optimizing solution chemistry and the addition of titania and fumed silica powder reduces shrinkage. These materials would serve to increase thermal efficiency by providing thermal insulation to suppress lateral heat leaks. They would also serve to prolong operational lifetime by suppressing sublimation of certain constituents of thermoelectric materials (e.g., sublimation of Sb from CoSb3) at typical high operating temperatures. [The use of pure silica aerogels as cast-in-place thermal-insulation and sublimation-suppression materials was described in "Aerogels for Thermal Insulation of Thermoelectric Devices" (NPO-40630), NASA Tech Briefs, Vol. 30, No. 7 (July 2006), page 50.] A silica aerogel is synthesized in a solgel process that includes preparation of a silica sol, gelation of the sol, and drying of the gel in a solvent at a supercritical temperature and pressure. The utility of pure silica aerogel is diminished by a tendency to shrink (and, therefore, also to crack) during the gelation and supercritical-drying stages. Moreover, to increase suppression of sublimation, it is advantageous to make an aerogel having greater density, but shrinkage and cracking tend to increase with density. A composite material of the type under investigation consists mostly of titania oxide powder particles and a small addition of fumed silica powder, which are mixed into the sol along with other ingredients prior to the gelation stage of processing. The silica aerogel and fumed silica act as a binder, gluing the titania particles together. It is believed that the addition of fumed silica stiffens the aerogel network and reduces shrinkage during the supercritical-drying stage. Minimization of shrinkage enables establishment of intimate contact between thermoelectric legs and the composite material, thereby maximizing the effectiveness of the material for thermal insulation and suppression of sublimation. To some extent, the properties of the composite can be tailored via the proportions of titania and other ingredients. In particular (see figure), the addition of a suitably large proportion of titania (e.g., 0.6 g/cu cm) along with a 10-percent increase in the amount of tetraethylorthosilicate [TEOS (an ingredient of the sol)] to an aerogel component having a density 40 mg/cm3makes it possible to cast a high-average-density (>0.1 g/cm3) aerogel/particle composite having low shrinkage (2.3 percent).

Paik, Jong-Ah↗

NASA NTRS2006

Vaporizable Scaffolds for Fabricating Thermoelectric Modules

A process for fabricating thermoelectric modules with vacuum gaps separating the thermoelectric legs has been conceived, and the feasibility of some essential parts of the process has been demonstrated. The vacuum gaps are needed to electrically insulate the legs from each other. The process involves the use of scaffolding in the form of sheets of a polymer to temporarily separate the legs by the desired distance, which is typically about 0.5 mm. During a bonding subprocess that would take place in a partial vacuum at an elevated temperature, the polymer would be vaporized, thereby creating the vacuum gaps.

Sakamoto, Jeffrey↗

NASA NTRS2006

Aerogels for Thermal Insulation of Thermoelectric Devices

Silica aerogels have been shown to be attractive for use as thermal-insulation materials for thermoelectric devices. It is desirable to thermally insulate the legs of thermoelectric devices to suppress lateral heat leaks that degrade thermal efficiency. Aerogels offer not only high thermal- insulation effectiveness, but also a combination of other properties that are especially advantageous in thermoelectric- device applications. Aerogels are synthesized by means of sol-gel chemistry, which is ideal for casting insulation into place. As the scale of the devices to be insulated decreases, the castability from liquid solutions becomes increasingly advantageous: By virtue of castability, aerogel insulation can be made to encapsulate devices having any size from macroscopic down to nanoscopic and possibly having complex, three-dimensional shapes. Castable aerogels can permeate voids having characteristic dimensions as small as nanometers. Hence, practically all the void space surrounding the legs of thermoelectric devices could be filled with aerogel insulation, making the insulation highly effective. Because aerogels have the lowest densities of any known solid materials, they would add very little mass to the encapsulated devices. The thermal-conductivity values of aerogels are among the lowest reported for any material, even after taking account of the contributions of convection and radiation (in addition to true thermal conduction) to overall effective thermal conductivities. Even in ambient air, the contribution of convection to effective overall thermal conductivity of an aerogel is extremely low because of the highly tortuous nature of the flow paths through the porous aerogel structure. For applications that involve operating temperatures high enough to give rise to significant amounts of infrared radiation, opacifiers could be added to aerogels to reduce the radiative contributions to overall effective thermal conductivities. One example of an opacifier is carbon black, which absorbs infrared radiation. Another example of an opacifier is micron- sized metal flakes, which reflect infrared radiation. Encapsulation in cast aerogel insulation also can help prolong the operational lifetimes of thermoelectric devices that must operate in vacuum and that contain SiGe or such advanced skutterudite thermoelectric materials as CoSb3 and CeFe3.5Co0.5Sb12. The primary cause of deterioration of most thermoelectric materials is thermal decomposition or sublimation (e.g., sublimation of Sb from CoSb3) at typical high operating temperatures. Aerogel present near the surface of CoSb3 can impede the outward transport of Sb vapor by establishing a highly localized, equilibrium Sb vapor atmosphere at the surface of the CoSb3.

Sakamoto, Jeffrey↗

NASA NTRS2006

Templates for Fabricating Nanowire/Nanoconduit-Based Devices

An effort is underway to develop processes for making templates that could be used as deposition molds and etching masks in the fabrication of devices containing arrays of nanowires and/or nanoconduits. Highly-ordered, optical-fiber arrays consisting of dissimilar polymers comprise the template technology. The selective removal of the fiber cores in specific solvents creates the porous templates to be filled with a "top-down" deposition process such as electrochemical deposition, sputter deposition, molecular beam epitaxy, and the like. Typically, the fiber bundles consist of polystyrene (PS) fiber cores, which are clad with varying thickness poly(methyl methacrylate) (PMMA). When arranged in hexagonal, close-packed configuration and pulled, the fibers form highly-ordered arrays comprised of PS fiber cores surrounded by a continuous matrix of PMMA. The ratio of PMMA cladding thickness to PS core diameter determines the spacing between PS fiber cores and typically ranges from 3:1 to 1:1. Essentially, the simultaneous heating and drawing or pulling in the longitudinal direction of polymer-fiber arrays fuses the fibers together.

Sakamoto, Jeffrey↗