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Ruggles, T. J.

Publications and source records attributed to Ruggles, T. J..

A flexible polymer-based luminescent ink for combined thermographic phosphors and digital image correlation (TP+DIC)

Recent work on the development of integrated thermographic phosphors and digital image correlation (TP+DIC) for combined thermal–mechanical measurements has revealed the need for a flexible, stretchable phosphor coating for metal surfaces. Herein, we coat stainless steel substrates with a polymer-based phosphor ink in a DIC speckle pattern and demonstrate that the ink remains well bonded under substrate deformation. In contrast, a binderless phosphor DIC coating produced via aerosol deposition (AD) partially debonded from the substrate. DIC calculations reveal that the strain on the ink coating matches the strain on the substrate within 4% error at the highest substrate loads (0.05 mm/mm applied substrate strain), while the strain on the AD coating remains near 0 mm/mm as the substrate deforms. Spectrally resolved emission from the phosphor is measured through the transparent binder throughout testing, and the ratio method is used to infer temperature with an uncertainty of 1.7 °C. In conclusion, this phosphor ink coating will allow for accurate, non-contact strain and temperature measurements of a deforming surface.

36 MATERIALS SCIENCE↗

Correlating results from high resolution EBSD with TEM- and ECCI-based dislocation microscopy: Approaching single dislocation sensitivity via noise reduction

High resolution electron backscatter diffraction (HREBSD), an SEM-based diffraction technique, may be used to measure the lattice distortion of a crystalline material and to infer the geometrically necessary dislocation content. Uncertainty in the image correlation process used to compare diffraction patterns leads to an uneven distribution of measurement noise in terms of the lattice distortion, which results in erroneous identification of dislocation type and density. This work presents a method of reducing noise in HREBSD dislocation measurements by removing the effect of the most problematic components of the measured distortion. The method is then validated by comparing with TEM analysis of dislocation pile-ups near a twin boundary in austenitic stainless steel and with ECCI analysis near a nano-indentation on a tantalum oligocrystal. Finally, the HREBSD dislocation microscopy technique is able to resolve individual dislocations visible in TEM and ECCI and correctly identify their Burgers vectors.

36 MATERIALS SCIENCE↗

Investigation of Optimal Digital Image Correlation Patterns for Deformation Measurement

Digital image correlation (DIC) relies on the surface texture of a specimen to measure deformation. When the specimen itself has little or no texture, a pattern is applied to the surface which deforms with the specimen and acts as an artificial surface texture. Because the applied pattern has an effect on the accuracy of DIC, an ideal pattern is sought for which the error introduced into DIC measurements is minimal. In this work, a study is performed in which several DIC pattern quality metrics from the literature are correlated to DIC measurement error. The resulting correlations give insight on the optimality of DIC patterns in general. Optimizations are then performed to produce patterns which are well suited for DIC. These patterns are tested to show their relative benefits. Chief among these benefits are a reduction in error of approximately 30 with respect to a randomly generated pattern.

Bomarito, G. F.↗