Engineering topics

Poulton, John W.

Publications and source records attributed to Poulton, John W..

10 records

DOE OSTI2018

Balanced charge-recycling repeater link

A balanced, charge-recycling repeater link is disclosed. The link includes a first set of segments operating in a first voltage domain and a second set of segments operating in a second voltage domain. The link is configured to transmit a first signal over at least one segment in the first set of segments and at least one other segment in the second set of segments. Each segment of the link includes at least one active circuit element configured to charge or discharge one or more corresponding interconnects within the link and a level shifter configured to shift the level of a signal on a last interconnect of the segment from the first voltage domain to the second voltage domain or the second voltage domain to the first voltage domain.

Wilson, John Michael↗

DOE OSTI2018

Balanced charge-recycling repeater link

Wilson, John Michael↗

DOE OSTI2016

Sense amplifier with transistor threshold compensation

One embodiment provides, in a sense amplifier for an electronic memory array in which a selected memory cell drives a developing voltage differential according to a logic state of the memory cell, a method to store the logic state. The method includes poising source voltages of first and second transistors at levels offset, respectively, by threshold voltages of the first and second transistors. The method also includes applying the voltage differential between a gate of the first transistor and a gate of the second transistor, the first and second transistors configured to oppose each other in a cross-coupled inverter stage of the sense amplifier.

Sinangil, Mahmut E.↗

DOE OSTI2016

High-density latch arrays

A system and device are provided for implementing memory arrays using high-density latch cells. The device includes an array of cells arranged into columns and rows. Each cell comprises a latch cell that includes a transmission gate, a pair of inverters, and an output buffer. Each row of latch cells is connected to at least one common node for addressing the row of latch cells, and each column of latch cells is connected to a particular bit of an input signal and a particular bit of an output signal. A register file may be implemented using one or more arrays of the high-density latch cells to replace any or all of the banks of SRAM cells typically used to implement the register file.

Sinangil, Mahmut Ersin↗

DOE OSTI2015

Ground-referenced single-ended signaling connected graphics processing unit multi-chip module

A system of interconnected chips comprising a multi-chip module (MCM) includes a processor chip, a system functions chip, and an MCM package configured to include the processor chip, the system functions chip, and an interconnect circuit. The processor chip is configured to include a first ground-referenced single-ended signaling interface circuit. A first set of electrical traces manufactured within the MCM package and configured to couple the first single-ended signaling interface circuit to the interconnect circuit. The system functions chip is configured to include a second single-ended signaling interface circuit and a host interface. A second set of electrical traces manufactured within the MCM package and configured to couple the host interface to at least one external pin of the MCM package. In one embodiment, each single-ended signaling interface advantageously implements ground-referenced single-ended signaling.

Dally, William J.↗

DOE OSTI2015

Ground-referenced single-ended system-on-package

A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a system function chip, and an MCM package configured to include the first processor chip and the system function chip. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. The system function chip is configured to include a second GRS interface circuit. A first set of electrical traces are fabricated within the MCM package and coupled to the first GRS interface circuit and to the second GRS interface circuit. The first GRS interface circuit and second GRS interface circuit together provide a communication channel between the first processor chip and the system function chip.

Dally, William J.↗

DOE OSTI2015

Ground-referenced single-ended signaling connected graphics processing unit multi-chip module

A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a graphics processing cluster (GPC) chip, and an MCM package configured to include the first processor chip, the GPC chip, and an interconnect circuit. The first processor chip is configured to include a first ground-referenced single-ended signaling interface circuit. A first set of electrical traces fabricated within the MCM package and configured to couple the first single-ended signaling interface circuit to the interconnect circuit. The GPC chip is configured to include a second single-ended signaling interface circuit and to execute shader programs. A second set of electrical traces fabricated within the MCM package and configured to couple the second single-ended signaling interface circuit to the interconnect circuit. In one embodiment, each single-ended signaling interface advantageously implements ground-referenced single-ended signaling.

Dally, William J.↗

DOE OSTI2015

Ground-referenced single-ended memory interconnect

A system is provided for transmitting signals. The system comprises a first processing unit, a memory subsystem, and a package. The first processing unit is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. The memory subsystem is configured to include a second GRS interface circuit. The package is configured to include one or more electrical traces that couple the first GRS interface to the second GRS interface, where the first GRS interface circuit and the second GRS interface circuit are each configured to transmit a pulse along one trace of the one or more electrical traces by discharging a capacitor between the one trace and a ground network.

Dally, William J.↗

DOE OSTI2015

Multi-phase ground-referenced single-ended signaling

A system includes a control circuit and first, second, and third ground-referenced single-ended signaling (GRS) driver circuits that are each coupled to an output signal. The control circuit is configured to generate a first, second, and third set of control signals that are each based on a respective phase of a clock signal. Each GRS driver circuit is configured to pre-charge a capacitor to store a charge based on the respective set of control signals during at least one phase of the clock signal and drive the output signal relative to a ground network by discharging the charge during a respective phase of the clock signal.

42 ENGINEERING↗

DOE OSTI2014

On-package multiprocessor ground-referenced single-ended interconnect

A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a second processor chip, and an MCM package configured to include the first processor chip, the second processor chip, and an interconnect circuit. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. A first set of electrical traces fabricated within the MCM package and configured to couple the first GRS interface circuit to the interconnect circuit. The second processor chip is configured to include a second GRS interface circuit. A second set of electrical traces fabricated within the MCM package and configured to coupled the second GRS interface circuit to the interconnect circuit.

Dally, William J.↗