Engineering topics
Peterson, Kenneth A.
Publications and source records attributed to Peterson, Kenneth A..
Maintaining Low Voiding SolderDie Attach for Power Die While Minimizing Die Tilt.
Abstract not provided.
Electromagnetic isolation structure
The various technologies presented herein relate to isolating an integrated circuit from electromagnetic radiation/interference. The integrated circuit can be encapsulated in a coating (e.g., a conformal coating). A conductive layer can be formed over the coating, where the conductive layer is deposited to connect with an electromagnetic shielding layer included in a substrate upon which the integrated circuit is located thereby forming a Faraday cage around the integrated circuit. Hollow spheres can be included in the coating to improve the dielectric constant of the coating. The conductive layer can be formed from at least one of metallic material or a polymer coating which includes conductive material. The integrated circuit can be utilized in conjunction with a heat sink and further, the integrated circuit can be of a flip chip configuration.
Ceramic substrate including thin film multilayer surface conductor
A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms electrically conductive features on an upper surface of each ceramic sheet excluding the top ceramic sheet. The vias are formed in each of the ceramic sheets with each via being filled with electrically conductive material. The upper conductive layer includes electrically conductive material that forms electrically conductive features on an upper surface of the top ceramic sheet. The upper conductive layer is constructed from a stack of four sublayers. A first sublayer is formed from titanium. A second sublayer is formed from copper. A third sublayer is formed from platinum. A fourth sublayer is formed from gold.
Monolithic LTCC seal frame and lid
A method for forming a monolithic seal frame and lid for use with a substrate and electronic circuitry comprises the steps of forming a mandrel from a ceramic and glass based material, forming a seal frame and lid block from a ceramic and glass based material, creating a seal frame and lid by forming a compartment and a plurality of sidewalls in the seal frame and lid block, placing the seal frame and lid on the mandrel such that the mandrel fits within the compartment, and cofiring the seal frame and lid block.
Enhanced Software for Scheduling Space-Shuttle Processing
The Ground Processing Scheduling System (GPSS) computer program is used to develop streamlined schedules for the inspection, repair, and refurbishment of space shuttles at Kennedy Space Center. A scheduling computer program is needed because space-shuttle processing is complex and it is frequently necessary to modify schedules to accommodate unanticipated events, unavailability of specialized personnel, unexpected delays, and the need to repair newly discovered defects. GPSS implements constraint-based scheduling algorithms and provides an interactive scheduling software environment. In response to inputs, GPSS can respond with schedules that are optimized in the sense that they contain minimal violations of constraints while supporting the most effective and efficient utilization of space-shuttle ground processing resources. The present version of GPSS is a product of re-engineering of a prototype version. While the prototype version proved to be valuable and versatile as a scheduling software tool during the first five years, it was characterized by design and algorithmic deficiencies that affected schedule revisions, query capability, task movement, report capability, and overall interface complexity. In addition, the lack of documentation gave rise to difficulties in maintenance and limited both enhanceability and portability. The goal of the GPSS re-engineering project was to upgrade the prototype into a flexible system that supports multiple- flow, multiple-site scheduling and that retains the strengths of the prototype while incorporating improvements in maintainability, enhanceability, and portability.