Engineering topics

Pereira, J. Michael

Publications and source records attributed to Pereira, J. Michael.

59 records · Page 4

NASA NTRS1997

High-Temperature Adhesive Strain Gage Developed

Researchers at the NASA Lewis Research Center have developed a unique strain gage and adhesive system for measuring the mechanical properties of polymers and polymer composites at elevated temperatures. This system overcomes some of the problems encountered in using commercial strain gages and adhesives. For example, typical commercial strain gage adhesives require a postcure at temperatures substantially higher than the maximum test temperature. The exposure of the specimen to this temperature may affect subsequent results, and in some cases may be higher than the glass-transition temperature of the polymer. In addition, although typical commercial strain gages can be used for short times at temperatures up to 370 C, their long-term use is limited to 230 C. This precludes their use for testing some high-temperature polyimides near their maximum temperature capability. Lewis' strain gage and adhesive system consists of a nonencapsulated, unbacked gage grid that is bonded directly to the polymer after the specimen has been cured but prior to the normal postcure cycle. The gage is applied with an adhesive specially formulated to cure under the specimen postcure conditions. Special handling, mounting, and electrical connection procedures were developed, and a fixture was designed to calibrate each strain gage after it was applied to a specimen. A variety of tests was conducted to determine the performance characteristics of the gages at elevated temperatures on PMR-15 neat resin and titanium specimens. For these tests, which included static tension, thermal exposure, and creep tests, the gage and adhesive system performed within normal strain gage specifications at 315 C. An example of the performance characteristics of the gage can be seen in the figure, which compares the strain gage measurement on a polyimide specimen at 315 C with an extensometer measurement.

Pereira, J. Michael↗

NASA NTRS1993

Stress distribution in composite flatwise tension test specimens

A finite element analysis was conducted to determine the stress distribution in typical graphite/epoxy composite flat wise tension (FWT) specimens under normal loading conditions. The purpose of the analysis was to determine the relationship between the applied load and the stress in the sample to evaluate the validity of the test as a means of measuring the out-of-plane strength of a composite laminate. Three different test geometries and three different material lay ups were modeled. In all cases, the out-of-plane component of stress in the test section was found to be uniform, with no stress concentrations, and very close to the nominal applied stress. The stress in the sample was found to be three-dimensional, and the magnitude of in-plane normal and shear stresses varied with the anisotropy of the test specimen. However, in the cases considered here, these components of stress were much smaller than the out-of-plane normal stress. The geometry of the test specimen had little influence on the results. It was concluded that the flat wise tension test provides a good measure of the out-of-plane strength for the representative materials that were studied.

Scott, Curtis A.↗

NASA NTRS1993

Graphite/epoxy Composite Laminates with Co-cured Interlaminar Damping Layers

Damped composite laminates were fabricated by co-curing viscoelastic damping film with graphite/epoxy prepreg plies. The dynamic response of the damped plates was measured using an impulse response technique and compared with the response of similar undamped laminates. Modal damping was computed from the frequency response data. Micrographs of the damped laminates showed that the damping layers retained their integrity during the fabrication process. The layers significantly increased the damping in the composite laminates. The use of the constrained viscoelastic film as an integral part of composite structures appears to be a feasible approach to passive vibration control. Composite plates manufactured with co-cured damping layers may have commercial applications in cases where light weight, strength, and vibration and noise reduction are important considerations.

Pereira, J. Michael↗

NASA NTRS1992

Ultrasonic Detection Of Transverse Cracks In Composites

Conventional ultrasonic C scan used to detect flaws in graphite/epoxy composite panels modified to enhance sensitivity to transverse cracks. Modification involves reorientation and repositioning of ultrasonic transmitter and receiver to take advantage of mode-conversion phenomena at interfaces between liquid couplant and panel to be probed. Angle of incidence chosen so only shear waves propagate obliquely through panel. Although mode-conversion equations solved to take full advantage of technique somewhat complicated, they are straightforward, and technique implemented easily in practice.

Pereira, J. Michael↗

NASA NTRS1990

Improved Transverse Crack Detection in Composites

A modified ultrasonic C-scan technique was implemented for improving the detection of a certain type of damage in composite specimens. The type of damage being studied is transverse (through the thickness) cracking of unidirectional off-axis graphite-epoxy specimens. These cracks are difficult to detect using standard through-transmission C-scan techniques. The modification is based on mode conversion to produce transmitted shear waves from incident longitudinal waves. While mode conversion is used extensively with isotropic materials, its use with composites is more limited. This is largely because the computation of wave propagation parameters is significantly more complicated with highly anisotropic materials than with isotropic materials. The appropriate incident angles to produce the desired mode conversion were computed based on the mechanical properties of the composite. Once the angles were computed the technique was simple to implement and resulted in marked improvement in detection of the transverse cracks being studied.

Pereira, J. Michael↗