Solder-circuitry separation problems associated with plated printed circuit boards
Investigation of soldered component failure in plated printed circuit boards consisting of tinned laminate copper, plated copper, and gold overplate
Pasciak, A. M.↗
Engineering topics
Publications and source records attributed to Pasciak, A. M..
Investigation of soldered component failure in plated printed circuit boards consisting of tinned laminate copper, plated copper, and gold overplate