Flexible foam masking for parylene coating
Hybrid-microcircuit masking technique improved to prevent unwanted parylene coating of lead packages.
Engineering topics
Publications and source records attributed to Oberin, F. W..
Hybrid-microcircuit masking technique improved to prevent unwanted parylene coating of lead packages.
Inexpensive internal coating improves reliability of plastic-packaged parts. Coating protects device from effects of humidity and heat and acts as barrier between device and harmful substances generated by plastic-packaging material.
A practical method of applying a parylene (paraxylene) coating to hybrid microcircuit devices was developed for the prevention of circuit malfunctions existing prior to package sealing or formed upon exposure to the service environment. It was found that paralene and an associated primer (if used) had generally little or no adverse effect on the active and passive elements of typical hybrid microcircuits. Exceptions were related to high frequency circuitry, low resistivity thick film resistors, and highly sensitive PIN diodes. Advantages of the use of the coating included increased dielectric strength and increased interconnection bond strength. Coating service life in nitrogen or nitrogen with low levels of oxygen as a contaminant is shown to be in excess of 1000 hours at 150 C and can be projected to be in excess of 5000 hours at 125 C.