Engineering topics
Noell, Philip J.
Publications and source records attributed to Noell, Philip J..
Interlocking metasurfaces
Abstract Interlocking metasurfaces (ILMs) are architected arrays of mating features that enable joining of two bodies. Complementary to traditional joining technologies such as bolts, adhesives, and welds, ILMs combine ease of assembly, removal, and reassembly with robust mechanical properties. Structural in nature, they act in a quasi-continuous manner across a surface and enable joining of complex surfaces, e.g., lattices. In this perspective, we define an ILM, begin exploring the design domain and illustrate its breath, and pragmatically evaluate mechanical performance and manufacturability. ILMs will find applications in various fields from aerospace to micro-robotics, civil engineering, and prosthetics.
Ductile failure and damage localization in Al6061-T6 characterized by in situ X-ray computed tomography and neural network segmentation
Damage initiation and localization in uniaxial tension tests of an Al6061-T6 alloy are evaluated and quantified using in situ X-ray computed tomography and a neural network segmentation strategy. This segmentation strategy offers significant advantages over traditional thresholding in quantifying microstructural and damage evolution metrics. Void nucleation was observed to occur throughout the deformation process, whereas void volume did not grow significantly until later stages of deformation. Localized analysis determined that void nucleation begins in and around the necked region during the early stages of deformation, whereas limited damage nucleation occurs outside of the neck until late stages of deformation. Lastly, inhomogeneities in void and particle spacing in the initial undeformed state of the material are observed to correlate well with the location of damage localization and necking during deformation. These results provide new insights into the ductile failure of Al alloys and how preexisting defects influence damage and rupture.
Super-Resolution Approaches in Three-Dimensions for Classification and Screening of Commercial-Off-The-Shelf Components
X-ray computed tomography is generally a primary step in characterization of defective electronic components, but is generally too slow to screen large lots of components. Super-resolution imaging approaches, in which higher-resolution data is inferred from lower-resolution images, have the potential to substantially reduce collection times for data volumes accessible via x-ray computed tomography. Here we seek to advance existing two-dimensional super-resolution approaches directly to three-dimensional computed tomography data. Multiple scan resolutions over a half order of magnitude of resolution were collected for four classes of commercial electronic components to serve as training data for a deep-learning, super-resolution network. A modular python framework for three-dimensional super-resolution of computed tomography data has been developed and trained over multiple classes of electronic components. Initial training and testing demonstrate the vast promise for these approaches, which have the potential for more than an order of magnitude reduction in collection time for electronic component screening.
Identifying the microstructural features associated with void nucleation during elevated–temperature deformation of copper
The microstructural-scale mechanisms that produce cracks in metals during deformation at elevated temperatures are relevant to applications that involve thermal exposure. Prior studies of cavitation during high-temperature deformation, for example, creep, suffered from an inability to directly observe the microstructural evolution that occurs during deformation and leads to void nucleation. Here the current study takes advantage of modern high-speed electron backscatter diffraction (EBSD) detectors to observe cavitation in oxygen-free, high-conductivity copper in situ during deformation at 300°C. Most voids formed at the triple junction between a twin boundary and a high-angle grain boundary (HAGB). This finding does not contradict previous studies that suggested that twins are resistant to cracking—it reveals that cracks in HAGBs originate at twin/HAGB triple junctions and that cracks preferentially grow along HAGBs rather than the accompanying twins. Atomistic simulations explored the origins of this observation and suggest that twin/HAGB triple junctions are microstructural weak points.