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Mital, Subodh K.

Publications and source records attributed to Mital, Subodh K..

61 records · Page 4

Microfracture in high temperature metal matrix laminates

Computational simulation procedures are described to evaluate the composite microfracture behavior, establish the hierarchy/sequence of fracture modes, and the influence of compliant layers and partial debonding on composite properties and microfracture initiation. These procedures are based upon three-dimensional finite element analysis and composite micromechanics equations. Typical results for the effects of compliant layers and partial debonding, microfracture initiation, and propagation and the thermomechanical cyclic loading on a SiC/Ti15 composite system are presented and discussed. The results show that interfacial debonding follows fiber or matrix fracture, and the thermomechanical cyclic loading severely degrades the composite integrity.

Mital, Subodh K.↗

Thermally-driven microfracture in high temperature metal matrix composites

Microfracture (fiber/matrix fracture, interphase debonding and interply delamination) in high temperature metal matrix composites (HTMMC), subjected to thermal loading, is computationally simulated. Both unidirectional and crossply SiC/Ti15 composites are evaluated for microfracture driven by thermal loads, using multicell finite element models. Results indicate that under thermal loads alone, microfracture propagation is not as sensitive as it is under mechanical loads.

Mital, Subodh K.↗

Computational simulation of microfracture in high temperature metal matrix composites

A computational simulation procedure, using three-dimensional finite element method and global strain energy release rates, is described to predict the microfracture process and identify/quantify the hierarchy of respective fracture modes in metal matrix composites. The procedure is used to predict the microfracture in unidirectional composites under longitudinal loads and accounts for the interphase strength in the in situ state. A novel procedure to computationally simulate the fiber pushthrough process is also described. In this simulation, the interface material is replaced by an anisotropic material with greatly reduced shear modulus in order to simulate the fiber pushthrough process using a linear analysis. Such a procedure is easily implemented and is computationally very effective.

Mital, Subodh K.↗

Microfracture in high temperature metal matrix crossply laminates

Microfracture (fiber/matrix fracture, interphase debonding and inter-ply delamination) in high temperature metal matrix composites (HTMMC), subjected to both mechanical and thermal loading, is computationally simulated. A crossply 0.3 fiber volume ratio SiC/Ti15 composite with 0/90/0 layup is evaluated for microfracture using a multicell finite element model. A computational simulation procedure based on strain energy release rates is used to predict the fracture process and establish the hierarchy of fracture modes. Microfracture results for various loading cases are presented and discussed.

Mital, Subodh K.↗

Thermally-driven microfracture in high temperature metal matrix composites

Microfracture (fiber/matrix fracture, interphase debonding and interply delamination) in high temperature metal matrix composites (HTMMC), subjected to thermal loading, is computationally simulated. Both unidirectional and crossply SiC/Ti15 composites are evaluated for microfracture driven by thermal loads, using multicell finite element models. Results indicate that under thermal loads alone, microfracture propagation is not as sensitive as it is under mechanical loads.

Mital, Subodh K.↗

Fiber pushout test: A three-dimensional finite element computational simulation

A fiber pushthrough process was computationally simulated using three-dimensional finite element method. The interface material is replaced by an anisotropic material with greatly reduced shear modulus in order to simulate the fiber pushthrough process using a linear analysis. Such a procedure is easily implemented and is computationally very effective. It can be used to predict fiber pushthrough load for a composite system at any temperature. The average interface shear strength obtained from pushthrough load can easily be separated into its two components: one that comes from frictional stresses and the other that comes from chemical adhesion between fiber and the matrix and mechanical interlocking that develops due to shrinkage of the composite because of phase change during the processing. Step-by-step procedures are described to perform the computational simulation, to establish bounds on interfacial bond strength and to interpret interfacial bond quality.

Mital, Subodh K.↗

Metal matrix composites microfracture: Computational simulation

Fiber/matrix fracture and fiber-matrix interface debonding in a metal matrix composite (MMC) are computationally simulated. These simulations are part of a research activity to develop computational methods for microfracture, microfracture propagation and fracture toughness of the metal matrix composites. The three-dimensional finite element model used in the simulation consists of a group of nine unidirectional fibers in three by three unit cell array of SiC/Ti15 metal matrix composite with a fiber volume ration of 0.35. This computational procedure is used to predict the fracture process and establish the hierarchy of fracture modes based on strain energy release rate. It is also used to predict stress redistribution to surrounding matrix-fibers due to initial and progressive fracture of fiber/matrix and due to debonding of fiber-matrix interface. Microfracture results for various loading cases such as longitudinal, transverse, shear and bending are presented and discussed. Step-by-step procedures are outlined to evaluate composite microfracture for a given composite system.

Mital, Subodh K.↗