Engineering topics

Mesch, H. G.

Publications and source records attributed to Mesch, H. G..

7 records

NASA NTRS1986

Development of flight ready fifty-micron-thick silicon solar cell array module technology

The development of ultrathin silicon solar cell array modules from initial design to flight testing is discussed. Three 80-cell modules were subjected to the thermal soak test, the LEO thermal cycle test, and the solar array flight experiment, and six 48-cell welded modules were evaluated in the geosynchronous orbit thermal cycle test. It is observed that the electrical performance of the modules was not affected by the different environmental conditions. The automatic assembly of the cell modules, in particular the welding and solar cell glassing operation, is described. The specific power capabilities of Kapton, Kapton-Kevlar-Kapton, Kapton-graphite-Kapton, and Kapton-graphite-aluminum honeycomb-graphite solar array designs are assessed.

Patterson, R. E.↗

NASA NTRS1984

Automated assembly of Gallium Arsenide and 50-micron thick silicon solar cell modules

The TRW automated solar array assembly equipment was used for the module assembly of 300 GaAs solar cells and 300 50 micron thick silicon solar cells (2 x 4 cm in size). These cells were interconnected with silver plated Invar tabs by means of welding. The GaAs cells were bonded to Kapton graphite aluminum honeycomb graphite substrates and the thin silicon cells were bonded to 0.002 inch thick single layer Kapton substrates. The GaAs solar cell module assembly resulted in a yield of 86% and the thin cell assembly produced a yield of 46% due to intermittent sticking of weld electrodes during the front cell contact welding operation. (Previously assembled thin cell solar modules produced an overall assembly yield of greater than 80%).

Mesch, H. G.↗

NASA NTRS1984

Progress in developing ultrathin solar cell blanket technology

A program was conducted to develop technologies for welding interconnects to three types of 50-micron-thick, 2 by 2-cm solar cells. Parallel-gap resistance welding was used for interconnect attachment. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Six 48-cell modules were assembled with 50-micron (nominal) thick cells, frosted fused-silica covers, silver-plated Invar interconnectors, and four different substrate designs. Three modules (one for each cell type) have single-layer Kapton (50-micron-thick) substrates. The other three modules each have a different substrate (Kapton-Kevlar-Kapton, Kapton-graphite-Kapton, and Kapton-graphite-aluminum honeycomb-graphite). All six modules were subjected to 4112 thermal cycles from -175 to 65 C (corresponding to over 40 years of simulated geosynchronous orbit thermal cycling) and experienced only negligible electrical degradation (1.1 percent average of six 48-cell modules).

Patterson, R. E.↗

NASA NTRS1983

Welding interconnects to 50-micron silicon solar cells

A program was conducted to develop technologies for welding interconnects to 50-micron thick, 2 by 2 cm solar cells obtained from three suppliers. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 deg to -180 deg C) were performed on 16-cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48-cell modules (one for each cell type) were assembled with 50-micron thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.

Patterson, R. E.↗

NASA NTRS1979

High temperature - low mass solar blanket

Interconnect materials and designs for use with ultrathin silicon solar cells are discussed, as well as the results of an investigation of the applicability of parallel-gap resistance welding for interconnecting these cells. Data relating contact pull strength and cell electrical degradation to variations in welding parameters such as time, voltage and pressure are presented. Methods for bonding ultrathin cells to flexible substances and for bonding thin (75 micrometers) covers to these cells are described. Also, factors influencing fabrication yield and approaches for increasing yield are discussed. The results of vacuum thermal cycling and thermal soak tests on prototype ultrathin cell test coupons and one solar module blanket are presented.

Mesch, H. G.↗

NASA NTRS1979

High temperature, low mass solar blanket development

This paper presents methods of incorporating ultrathin silicon solar cells into photovoltaic blankets for space applications. This type of cell has the highest power-to-mass ratio and best performance under space radiation of any silicon solar cell. Interconnect materials and designs, and the results of the investigation of the applicability of parallel-gap resistance welding for interconnecting ultrathin cells are discussed. Data relating contact pull strength and cell electrical degradation to welding parameters such as time, voltage, and pressure are presented. Methods for bonding ultrathin cells to flexible substrates and for bonding thin covers to these cells are described, and the results of vacuum thermal cycling and thermal soak tests on prototype ultrathin cell test coupons are included.

Mesch, H. G.↗

NASA NTRS1976

Solar cell electrical connections

Study was conducted to find best methods of attaching pure silver and silver plated Kovar (trademark) interconnect ribbons to silicon solar cells with titanium-silver solderless contacts. Investigations include thermocompression bonding, parallel-gap welding, and ultrasonic welding.

Rauschenbach, H. S.↗