Impact of Thermomechanical Texture on the Superelastic Response of Nitinol Implants
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Engineering topics
Publications and source records attributed to Mehta, A..
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The NASA Goddard Earth Sciences Data Information Services Center (GES DISC) is home of Tropical Rainfall Measuring Mission (TRMM) data archive. The global merged IR product also known as the NCEP/CPC 4-km Global (60 degrees N - 60 degrees S) IR Dataset, is one of TRMM ancillary datasets. They are globally merged (60 degrees N - 60 degrees S) pixel-resolution (4 km) IR brightness temperature data (equivalent blackbody temperatures), merged from all available geostationary satellites (GOES-8/10, METEOSAT-7/5 and GMS). The availability of data from METEOSAT-5, which is located at 63E at the present time, yields a unique opportunity for total global (60 degrees N- 60 degrees S) coverage. The GES DISC has collected over 8 years of the data beginning from February of 2000. This high temporal resolution dataset can not only provide additional background information to TRMM and other satellite missions, but also allow observing a wide range of meteorological phenomena from space, such as, mesoscale convection systems, tropical cyclones, hurricanes, etc. The dataset can also be used to verify model simulations. Despite that the data can be downloaded via ftp, however, its large volume poses a challenge for many users. A single file occupies about 70 MB disk space and there is a total of approximately 73,000 files (approximately 4.5 TB) for the past 8 years. In order to facilitate data access, we have developed a web prototype to allow users to conduct online visualization and analysis of this dataset. With a web browser and few mouse clicks, users can have a full access to over 8 year and over 4.5 TB data and generate black and white IR imagery and animation without downloading any software and data. In short, you can make your own images! Basic functions include selection of area of interest, single imagery or animation, a time skip capability for different temporal resolution and image size. Users can save an animation as a file (animated gif) and import it in other presentation software, such as, Microsoft PowerPoint. The prototype will be integrated into GIOVANNI and existing GIOVANNI capabilities, such as, data download, Google Earth KMZ, etc will be available. Users will also be able to access other data products in the GIOVANNI family.
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This paper presents data collected from a recent NASA project that focuses specifically on finding suitable altematives to eutectic tin-lead solders, especially in solder paste applications.
This paper examines some of these alternative solders for their suitability in replacing tin/lead solder in high-reliability applications.
This paper describes the fabrication of a rugged, laser-welded package for a 200mW, monolithic diode-pumped solid state Nd:YAG laser operating at 1319nm.
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This paper addresses a centrifugal cleaning system used in conjunction with a water-based cleaning medium to achieve optimally low levels of contaminants on PWAs.
A 472 dimpled ball grid array (D-BGA) package has not been used in past space flight environments, therefore it was necessary to develop a process that would yield robust and reliable solder joints. The process developing assembly, inspection and rework techniques, were verified by conducting environmental tests. Since the 472 D-BGA packages passed the above environmental tests within the specifications, the process was successfully developed for space flight electronics.
The JPL-led CSP Consortium of enterprises representing government agencies and private companies has joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
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The 472 Dimpled Ball Grid Array (D-BGA) package has not been used in past space flight environments, therefore it is necessary to determine the robustness and reliability of the solder joints. The 472 D-BGA packages passed the above environmental tests within the specifications and are now qualified for use on space flight electronics.
The Electronic Fabrication Section at the Jet Propulsion Laboratories (JPL) has been studying ways to improve Printed Wiring Assembly (PWA) processes. The PWA study described here contained typical surface mount devices including 20 mil fine pitch devices and various BGAs.
Ball grid arrays (BGAs), and other area array packages, are becoming more prominent as a way to increase component pin count while avoiding the manufacturing difficulties inherent in processing quad flat packs (QFPs)...Cleaning printed wiring assemblies (PWAs) with BGA components mounted on the surface is problematic...Currently, a low flash point semi-aqueous material, in conjunction with a batch cleaning unit, is being used to clean PWAs. The approach taken at JPL was to investigate the use of (1) semi-aqueous materials having a high flash point and (2) aqueous cleaning involving a saponifier.
This study focuses on improving the SMT assembly process in a low-volume, high-reliability environment with emphasis on fine pitch and BGA packages. Before a process improvement is carried out, it is important to evaluate where the process stands in terms of process capability.