Engineering topics
Publications and source records attributed to McKinney, Colin.
We will present the steps taken to derive the thermally-resilient electronics packaging design of the Mars2020 EECAM detector. We will highlight analyses and empirical test results that lead to a wide-temperature-survivable COTS component packaging design. Details of thermal cycle testing, in-process inspections, and final packaging design will be presented.
We have developed an adaptable camera platform that takes advantage of screened and qualified commercial off the shelf (COTS) components (CMOS sensor, rad-tolerant microcircuits, lenses) to significantly shorten development time of space-borne visible imaging systems while reducing the overall cost and risk of the development. This modular camera platform is implemented as a suite of two visible-light cameras for the Orbiting Carbon Observatory 3 (OCO-3) instrument at NASA’s Jet Propulsion Laboratory (JPL). The Internal Context Camera (ICC) and External Context Camera (ECC) provide contextual engineering imaging support for the calibration of the OCO-3 instrument, intended to significantly reduce the duration of the mission’s calibration campaign. The OCO-3 mission has taken advantage of the design and qualification work performed by JPL’s Mars 2020 Enhanced Engineering Camera (EECam) team in reusing the qualified COTS CMOS imaging sensor, proven electronic designs, and scalable field-programmable gate array (FPGA) firmware to meet OCO-3’s mission requirements and resource availability. We will be presenting the steps taken by JPL to design, build, and test the Context Cameras for the OCO-3 mission. We will highlight the design deviations from the Mars2020 EECams and discuss the methodology of tailoring the EECam design for the OCO-3 requirements. Camera imaging capabilities, including focal plane and optical performance, will be presented, as well as a summary of the calibration and environmental test results. Finally, we will discuss the potential for future applications for the Context Cameras.
No abstract available
Previous robotic sample return missions lacked in situ sample verification/ quantity measurement instruments. Therefore, the outcome of the mission remained unclear until spacecraft return. In situ sample verification systems such as this Distributed Capacitive (DisC) sensor would enable an unmanned spacecraft system to re-attempt the sample acquisition procedures until the capture of desired sample quantity is positively confirmed, thereby maximizing the prospect for scientific reward. The DisC device contains a 10-cm-diameter pressure-sensitive elastic membrane placed at the bottom of a sample canister. The membrane deforms under the weight of accumulating planetary sample. The membrane is positioned in close proximity to an opposing rigid substrate with a narrow gap. The deformation of the membrane makes the gap narrower, resulting in increased capacitance between the two parallel plates (elastic membrane and rigid substrate). C-V conversion circuits on a nearby PCB (printed circuit board) provide capacitance readout via LVDS (low-voltage differential signaling) interface. The capacitance method was chosen over other potential approaches such as the piezoelectric method because of its inherent temperature stability advantage. A reference capacitor and temperature sensor are embedded in the system to compensate for temperature effects. The pressure-sensitive membranes are aluminum 6061, stainless steel (SUS) 403, and metal-coated polyimide plates. The thicknesses of these membranes range from 250 to 500 m. The rigid substrate is made with a 1- to 2-mm-thick wafer of one of the following materials depending on the application requirements glass, silicon, polyimide, PCB substrate. The glass substrate is fabricated by a microelectromechanical systems (MEMS) fabrication approach. Several concentric electrode patterns are printed on the substrate. The initial gap between the two plates, 100 m, is defined by a silicon spacer ring that is anodically bonded to the glass substrate. The fabricated proof-of-concept devices have successfully demonstrated tens to hundreds of picofarads of capacitance change when a simulated sample (100 g to 500 g) is placed on the membrane.
An optical alignment mirror mechanism (AMM) has been developed with angular positioning accuracy of +/-0.2 arcsec. This requires the mirror s linear positioning actuators to have positioning resolutions of +/-112 nm to enable the mirror to meet the angular tip/tilt accuracy requirement. Demonstrated capabilities are 0.1 arc-sec angular mirror positioning accuracy, which translates into linear positioning resolutions at the actuator of 50 nm. The mechanism consists of a structure with sets of cross-directional flexures that enable the mirror s tip and tilt motion, a mirror with its kinematic mount, and two linear actuators. An actuator comprises a brushless DC motor, a linear ball screw, and a piezoelectric brake that holds the mirror s position while the unit is unpowered. An interferometric linear position sensor senses the actuator s position. The AMMs were developed for an Astrometric Beam Combiner (ABC) optical bench, which is part of an interferometer development. Custom electronics were also developed to accommodate the presence of multiple AMMs within the ABC and provide a compact, all-in-one solution to power and control the AMMs.
This paper describes the development of a proof of-concept sample verification system (SVS) for in-situ mass measurement of planetary rock and soil sample in future robotic sample return missions. Our proof-of-concept SVS device contains a 10 cm diameter pressure sensitive elastic membrane placed at the bottom of a sample canister. The membrane deforms under the weight of accumulating planetary sample. The membrane is positioned in proximity to an opposing substrate with a narrow gap. The deformation of the membrane makes the gap to be narrower, resulting in increased capacitance between the two nearly parallel plates. Capacitance readout circuitry on a nearby printed circuit board (PCB) transmits data via a low-voltage differential signaling (LVDS) interface. The fabricated SVS proof-of-concept device has successfully demonstrated approximately 1pF/gram capacitance change