Engineering topics
Publications and source records attributed to Mayne, R. C..
Packaging technique seals electronic modules as effectively as potting in epoxy, yet permits removal of encapsulant when component change necessary. Technique encloses module in thin, rigid epoxy/fiberglass shell containing lightweight syntactic foam.
Using vacuum-soldering method, attachments that are 85 to 95 percent void free can be made. Method is useful for various large scale substrate attachment processes in microelectronic industry.
Mount includes metallic cup and support ring placed in mold fixture. Viscoelastic material is injected between these parts by means of large hypodermic needle. Circular projections on cup and ring extend into material and are kept in place without dependence on quality of adhesion between material and metal.
A shock mount for installing electrical components on circuit boards is described. The shock absorber is made of viscoelastic material which interconnects the electrical components. With this system, shocks imposed on one component of the circuit are not transmitted to other components. A diagram of a typical circuit is provided.