Engineering topics
Publications and source records attributed to Marzek, R. A..
Self-alining slide assembly improves air flow. Alinement accuracy is incorporated into assembly at time of fabrication, reducing requirement for mounting-hole location accuracy. Amount of labor needed for installation, necessary machining, hardware, and number of mounting points are reduced from previous support system. Load-bearing capability is built into mounting platform.
Tool operates by applying force perpendicularly to socket plane. Tool can be operated in cramped or confined quarters and can effect integrated circuit removal without damage. It may also be useful to hold nut or bolt in confined space while tightening, when it is not possible to use conventional tool.
A tool for use in lifting a pin-supported, electronic package mounted in juxtaposition with the surface of an electronic circuit board is described. The tool is configured to be received beneath a pin-supported package and is characterized by a manually operable linkage, including an elongated, rigid link is supported for axial reciprocation and a pivotal link pinned to the body and supported for oscillation induced in response to axial motion imparted to the rigid link. A lifting plate is pivotally coupled to the distal end of the pivotal link so that oscillatory motion imparted to the pivotal link serves to move the plate vertically for elevating the plate into lifting engagement with the electronic package positioned thereabove.