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Mandel, H.

Publications and source records attributed to Mandel, H..

Medium-resolution far-ultraviolet spectroscopy of PKS 2155-304

Using the Berkeley spectrometer of the Orbiting Retrievable Far and Extreme Ultraviolet Spectrometer (ORFEUS) we observed the 87-117 nm UV spectrum of the BL Lac object PKS 2155-304 with about 0.5 A resolution. In addition to the expected interstellar lines we detected higher quantum number counterparts of the intergalactic Lyman alpha lines discovered earlier with IUE and the Hubble Space Telescope (HST) in the direction of PKS 2155-304. The Lyman discontinuities indicate for three of the redshifted clouds a combined H I column density of 2-5 x 10(exp 16)/sq cm, while the column density for another cloud appears to be well below 5 x 10(exp 15)/sq cm. No siginificant O VI absorption in the galactic halo toward PKS 2155-304 could be detected from our data. Assuming that saturation effects are negligible for these weak features, we obtain for the O VI column density toward PKS 2155-304 a 3 sigma upper limit of 2.7 x 10(exp 14)/sq cm.

Appenzeller, I.↗

Solder Bonding for Power Transistors

Indium solder boosts power rating and facilitates circuit changes. Efficient heat conduction from power transistor to heat sink provided by layer of indium solder. Low melting point of indium solder (141 degrees C) allows power transistor to be removed, if circuit must be reworked, without disturbing other components mounted with ordinary solder that melts at 181 degrees C. Solder allows devices operated at higher power levels than does conventional attachment by screws.

Snytsheuvel, H. A.↗

Shaping Transistor Leads for Better Solder Joints

Special lead-forming tool puts step in leads of microwave power transistors without damaging braze joints that fasten leads to package. Stepped leads are soldered to circuit boards more reliably than straight leads, and stress on brazes is relieved. Lead-forming hand-tool has two parts: a forming die and an actuator. Spring-loaded saddle is adjusted so that when transistor package is placed on it, leads rest on forming rails.

Mandel, H.↗

Cooling/grounding mount for hybrid circuits

Extremely short input and output connections, adequate grounding, and efficient heat removal for hybrid integrated circuits are possible with mounting. Rectangular clamp holds hybrid on printed-circuit board, in contact with heat-conductive ground plate. Clamp is attached to ground plane by bolts.

Bagstad, B.↗

Vibration-resistant PC board feedthrough

New fabrication method uses annealed-nickel ribbon loop to interface coaxial input (or output) connector to printed-wiring board. Inexpensive ribbon interface cuts vibration-induced failure between coaxial cable and printed-wiring board.

Mandel, H.↗