Engineering topics

Malarik, Diane C.

Publications and source records attributed to Malarik, Diane C..

11 records

NASA NTRS2005

Glenn's Telescience Support Center Provided Around-the-Clock Operations Support for Space Experiments on the International Space Station

NASA Glenn Research Center s Telescience Support Center (TSC) allows researchers on Earth to operate experiments onboard the International Space Station (ISS) and the space shuttles. NASA s continuing investment in the required software, systems, and networks provides distributed ISS ground operations that enable payload developers and scientists to monitor and control their experiments from the Glenn TSC. The quality of scientific and engineering data is enhanced while the long-term operational costs of experiments are reduced because principal investigators and engineering teams can operate their payloads from their home institutions.

Malarik, Diane C.↗

NASA NTRS2000

Microscope-Based Fluid Physics Experiments in the Fluids and Combustion Facility on ISS

At the NASA Glenn Research Center, the Microgravity Science Program is planning to conduct a large number of experiments on the International Space Station in both the Fluid Physics and Combustion Science disciplines, and is developing flight experiment hardware for use within the International Space Station's Fluids and Combustion Facility. Four fluids physics experiments that require an optical microscope will be sequentially conducted within a subrack payload to the Fluids Integrated Rack of the Fluids and Combustion Facility called the Light Microscopy Module, which will provide the containment, changeout, and diagnostic capabilities to perform the experiments. The Light Microscopy Module is planned as a fully remotely controllable on-orbit microscope facility, allowing flexible scheduling and control of experiments within International Space Station resources. This paper will focus on the four microscope-based experiments, specifically, their objectives and the sample cell and instrument hardware to accommodate their requirements.

Doherty, Michael P.↗

NASA NTRS1999

Third and Final Shuttle Mission of the Isothermal Dendritic Growth Experiment Conducted: Highest Supercooling Ever Recorded Achieved

Dendrites describe the treelike crystal morphology commonly assumed in metals and alloys that freeze from supercooled or supersaturated melts. There remains a high level of engineering interest in dendritic solidification because the size, shape, and orientation of the dendrites determine the final microstructure of a material. It is the microstructure that then determines the physical properties of cast or welded products. Although it is well known that dendritic growth is controlled by the transport of latent heat from the moving solid-liquid interface, an accurate and predictive model has not yet been developed. The effects of gravity-induced convection on the transfer of heat from the interface have prevented adequate testing, under terrestrial conditions, of solidification models. The Isothermal Dendritic Growth Experiment (IDGE) constituted a series of three microgravity experiments flown aboard the Space Shuttle Columbia. The apparatus was used to grow and record dendrite solidification in the absence of gravity-induced convective heat transfer, thereby producing a wealth of benchmark-quality data for testing solidification models and theories.

Glicksman, Martin E.↗

NASA NTRS1997

Isothermal Dendritic Growth Experiment (IDGE) Is the First United States Microgravity Experiment Controlled From the Principal Investigator's University

The scientific objective of the Isothermal Dendritic Growth Experiment (IDGE) is to test fundamental assumptions about dendritic solidification of molten materials. IDGE is a microgravity materials science experiment using apparatus that was designed, built, tested, and operated by people from the NASA Lewis Research Center. The IDGE experiment was conceived by the principal investigator, Professor Martin E. Glicksman from Rensselaer Polytechnic Institute in Troy, New York. This experiment was a team effort of civil servants from the NASA Lewis Research Center, contractors from Aerospace Design & Fabrication, Inc. (ADF), and personnel at Rensselaer.

Malarik, Diane C.↗

NASA NTRS1994

More About V-CAP Polyimides

V-CAP polyimides are processible matrix resins extending continuous-use temperature of composite materials. Under contract to NASA, General Electric used VCAP to fabricate and successfully test hot section of forward exhaust fairing on their F110 engine. Also used in other components of jet engines and airframes, including vanes, fan frames, cowls, and wing panels. Nonaerospace applications include brake linings, bearings, grinding wheels and slip seals, commutators in electric motors, and parts of motors in refrigerator compressors. Future applications include printed-circuit boards and components of nacelles in jet engines.

Vannucci, Raymond D.↗

NASA NTRS1991

Vinyl capped addition polyimides

Polyimide resins (PMR) are generally useful where high strength and temperature capabilities are required (at temperatures up to about 700 F). Polyimide resins are particularly useful in applications such as jet engine compressor components, for example, blades, vanes, air seals, air splitters, and engine casing parts. Aromatic vinyl capped addition polyimides are obtained by reacting a diamine, an ester of tetracarboxylic acid, and an aromatic vinyl compound. Low void materials with improved oxidative stability when exposed to 700 F air may be fabricated as fiber reinforced high molecular weight capped polyimide composites. The aromatic vinyl capped polyimides are provided with a more aromatic nature and are more thermally stable than highly aliphatic, norbornenyl-type end-capped polyimides employed in PMR resins. The substitution of aromatic vinyl end-caps for norbornenyl end-caps in addition polyimides results in polymers with improved oxidative stability.

Vannucci, Raymond D.↗

NASA NTRS1991

High molecular weight first generation PMR polyimides for 343 C applications

The effect of molecular weight on 343 C thermo-oxidative stability (TOS), mechanical properties, and processability, of the first generation PMR polyimides was studied. Graphite fiber reinforced PMR-15, PMR-30, PMR-50, and PMR-75 composites (corresponding to formulated molecular weights of 1500, 3000, 5000, and 7500, respectively) were fabricated using a simulated autoclave process. The data reveals that while alternate autoclave cure schedules are required for the high molecular weight resins, low void laminates can be fabricated which have significantly improved TOS over PMR-15, with only a small sacrifice in mechanical properties.

Malarik, Diane C.↗

NASA NTRS1991

Viscoelastic properties of addition-cured polyimides used in high temperature polymer matrix composites

Viscoelastic properties of the addition cured polyimide, PMR-15, were studied using dynamic mechanical and stress relaxation tests. For temperatures below the glass transition temperature, T sub g, the dynamic mechanical properties measured using a temperature scan rate of 10 C/min were strongly affected by the presence of absorbed moisture in the resin. Dynamic mechanical properties measured as a function of time during an isothermal hold provided an indication of chemical changes occurring in the resin. For temperatures above (T sub g + 20 C), the storage modulus increased continuously as a function of time indicating that additional crosslinking is occurring in the resin. Because of these changes in chemical structures, the stress relaxation modulus could not be measured over any useful time interval for temperatures above T sub g. For temperatures below T sub g, dynamic mechanical properties appeared to be unaffected by chemical changes for times exceeding 1 hr. Since the duration of the stress relaxation tests was less than 1 hr, the stress relaxation modulus could be measured. As long as the moisture content of the resin was less than 2 pct, stress relaxation curves measured at different temperatures could be superimposed using horizontal shifts along the log(time) axis with only small shifts along the vertical axis.

Roberts, Gary D↗

NASA NTRS1991

Viscoelastic properties of addition-cured polyimides used in high temperature polymer matrix composites

The viscoelastic properties of an addition-cured polyimide, PMR-15, were evaluated through dynamic mechanical and stress relaxation testing. Below the glass transition temperature, the dynamic mechanical properties of the composites are strongly affected by the absorbed moisture in the resin. At temperature 20 C and more above the glass transition temperature, the storage modulus increases continuously with time, indicating that additional crosslinking is occurring in the resin. For resin moisture contents less than 2 percent, stress relaxation curves measured at different temperatures can be superimposed using horizontal shifts along the log(time) axis with only small shifts along the vertical axis.

Roberts, Gary D.↗

NASA NTRS1990

Vinyl capped addition polyimides

Polyimide resins having improved thermo-oxidative stability are provided having aromatic vinyl end-caps. The polyimides are prepared by the reaction of a mixture of monomers comprising (1) a diamine, (2) an ester of tetracarboxylic acid and (3) an aromatic vinyl compound in a molar ratio of 1:2:3 of n: (n + 1):2 when the aromatic vinyl compound contains nitrogen and in a ratio of (n + 1):n:2 when the aromatic vinyl compound does not contain nitrogen, wherein n ranges from about 5 to about 20.

Vannucci, Raymond D.↗

NASA NTRS1990

High-Temperature Polyimide Resin

Improved polyimide resin used at continuous temperatures up to 700 degrees F (371 degrees C). PMR-II-50, serves as matrix for fiber-reinforced composites. Material combines thermo-oxidative stability with autoclave processability. Used in such turbine engine components as air-bypass ducts, vanes, bearings, and nozzle flaps. Other potential applications include wing and fuselage skins on high-mach-number aircraft and automotive engine blocks and pistons.

Vanucci, Raymond D.↗