Engineering topics
Publications and source records attributed to Lister, J. L..
Development of polymers with improved heat transfer coefficients for use in encapsulating electronic modules is discussed. Chemical reactions for synthesizing the polymers are described and thermodynamic and physical properties are analyzed.
A thermally conductive polymer is provided having physical and chemical properties suited to use as a medium for potting electrical components. The polymer is prepared from hydroquinone, phenol, and formaldehyde, by conventional procedures employed for the preparation of phenol-formaldehyde resins. While the proportions of the monomers can be varied, a preferred polymer is formed from the monomers in a 1:1:2.4 molar or ratio of hydroquinone:phenol:formaldehyde.
New polymeric material exhibits excellent physical shock protection, high electrical resistance, and thermal conductivity. It is especially useful for electronic circuitry, such as subminiaturization of components and modular construction of circuits.