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Lipton, R.

Publications and source records attributed to Lipton, R..

At least 19 records

Muon Collider Forum report

A multi-TeV muon collider offers a spectacular opportunity in the direct exploration of the energy frontier. Offering a combination of unprecedented energy collisions in a comparatively clean leptonic environment, a high energy muon collider has the unique potential to provide both precision measurements and the highest energy reach in one machine that cannot be paralleled by any currently available technology. The topic generated a lot of excitement in Snowmass meetings and continues to attract a large number of supporters, including many from the early career community. In light of this very strong interest within the US particle physics community, Snowmass Energy, Theory and Accelerator Frontiers created a cross-frontier Muon Collider Forum in November of 2020. The Forum has been meeting on a monthly basis and organized several topical workshops dedicated to physics, accelerator technology, and detector R&D. Findings of the Forum are summarized in this report.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

3D Integrated Sensing Solutions

We will present the proposed research project to develop 3D-integrated sensors using advanced manufacturing capability for novel sensors, heterogeneously integrated with energy efficient readout circuits. The lack of precision timing in particle tracking detectors and the absence of low power, high throughput communications solutions to read them out limits progress in multiple fields of fundamental science. The aim of the project is to develop technology to enable large-scale particle detectors with 3D-integrated ASIC designs to simultaneously achieve 10 μm position resolution and 10 ps precision timing, with low-power consumption and high throughput rates. This research program leverages the unique combination of facilities and cross-disciplinary expertise of scientists and engineers at SLAC, FNAL, and LLNL and industrial partners.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Development of CMOS Sensors for HEP with a US-based foundry

We will present a program to establish the first development and manufacturing of HEP-specific sensors monolithically integrated into a standard CMOS process using a US-based foundry. In collaboration with several US universities the project aims to develop Monolithic Active Pixel Sensors (MAPS) designs implemented in the 90 nm technology node, including simple test structures and multi-pixel arrays, and monolithic CMOS sensors with readout integrated circuits, perform detailed characterization of the detector prototypes and quantify their performance for HEP applications.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Smart Pixels: towards on-sensor inference of charged particle track parameters and uncertainties

The combinatorics of track seeding has long been a computational bottleneck for triggering and offline computing in High Energy Physics (HEP), and remains so for the HL-LHC. Next-generation pixel sensors will be sufficiently fine-grained to determine angular information of the charged particle passing through from pixel-cluster properties. This detector technology immediately improves the situation for offline tracking, but any major improvements in physics reach are unrealized since they are dominated by lowest-level hardware trigger acceptance. We will demonstrate track angle and hit position prediction, including errors, using a mixture density network within a single layer of silicon as well as the progress towards and status of implementing the neural network in hardware on both FPGAs and ASICs.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

Electronics for Fast Timing

Picosecond-level timing will be an important component of the next generation of particle physics detectors. The ability to add a 4$^{th}$ dimension to our measurements will help address the increasing complexity of events at hadron colliders and provide new tools for precise tracking and calorimetry for all experiments. Detectors are described in detail on other whitepapers. In this note, we address challenges in electronics design for the new generations of fast timing detectors

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Integration and Packaging

Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled by the fine pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. In this white paper a discussion will be presented on 3D integration advantages, ongoing projects and prospects in high energy physics and beyond.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

Enabling U.S. participation in Future Higgs Factories

Exciting proposals for a new Higgs factory collider, aimed at the search for new physics and precision studies of particles and forces, especially measurement of the Higgs boson couplings at the loop level, will be evaluated as part of the Snowmass process. Potential facilities include (among others) ILC, FCC-ee, C3, CEPC, CLIC, muon collider and advanced accelerator concepts being investigated by Snowmass topical group AF6, potentially located in Asia, Europe, or the United States. The European Strategy has endorsed an electron-positron Higgs factory as its highest priority after HL-LHC. Much of the detector, software, and physics preparative studies needed for these machines is in common, and is currently being implemented by physicists world-wide. In this white paper for the 2021 Snowmass process we look at current global activity on future Higgs factories and give examples of investments that could be made in these common areas over the next five years to establish a leadership role for the U.S. in a future Higgs factory, wherever it is built. The U.S. high energy physics program confronts a number of challenges that a strong role in the study of the Higgs boson can address. These include, in addition to the scientific results, maintaining leading roles in international partnerships, nurturing and advancing world-leading capabilities and expert resources, and maintaining and attracting talent. The international effort would benefit from increased U.S. participation, and the U.S., in turn, would maintain stature through the partnership.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

Simulations of Silicon Radiation Detectors for High Energy Physics Experiments

Silicon radiation detectors are an integral component of current and planned collider experiments in high energy physics. Simulations of these detectors are essential for deciding operational configurations, for performing precise data analysis, and for developing future detectors. In this white paper, we briefly review the existing tools and discuss challenges for the future that will require research and development to be able to cope with the foreseen extreme radiation environments of the High Luminosity runs of the Large Hadron Collider and future hadron colliders like FCC-hh and SPPC.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

200 mm sensor development using bonded wafers

Sensors fabricated from high resistivity, float zone, silicon material have been the basis of vertex detectors and trackers for the last 30 years. The areas of these devices have increased from a few square cm to > 200m 2 for the existing CMS tracker. High Luminosity Large Hadron Collider (HL-LHC), CMS and ATLAS tracker upgrades will each require more than 200 m 2 of silicon and the CMS High Granularity Calorimeter (HGCAL) will require more than 600 m 2 . The cost and complexity of assembly of these devices is related to the area of each module, which in turn is set by the size of the silicon sensors. In addition to large area, the devices must be radiation hard, which requires the use of sensors thinned to 200 microns or less. The combination of wafer thinning and large wafer diameter is a significant technical challenge, and is the subject of this work. In this paper we describe work on development of thin sensors on 200 mm wafers using wafer bonding technology. Results of development runs with float zone, Silicon-on-Insulator and Silicon-Silicon bonded wafer technologies are reported.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Charge collection and electrical characterization of neutron irradiated silicon pad detectors for the CMS High Granularity Calorimeter

The replacement of the existing endcap calorimeter in the Compact Muon Solenoid (CMS) detector for the high-luminosity LHC (HL-LHC), scheduled for 2027, will be a high granularity calorimeter. It will provide detailed position, energy, and timing information on electromagnetic and hadronic showers in the immense pileup of the HL-LHC. The High Granularity Calorimeter (HGCAL) will use 120-, 200-, and 300-$\mu\textrm{m}$ thick silicon (Si) pad sensors as the main active material and will sustain 1-MeV neutron equivalent fluences up to about $10^{16}~\textrm{n}_\textrm{eq}\textrm{cm}^{-2}$. In order to address the performance degradation of the Si detectors caused by the intense radiation environment, irradiation campaigns of test diode samples from 8-inch and 6-inch wafers were performed in two reactors. Characterization of the electrical and charge collection properties after irradiation involved both bulk polarities for the three sensor thicknesses. Since the Si sensors will be operated at -30 $^\circ$C to reduce increasing bulk leakage current with fluence, the charge collection investigation of 30 irradiated samples was carried out with the infrared-TCT setup at -30 $^\circ$C. TCAD simulation results at the lower fluences are in close agreement with the experimental results and provide predictions of sensor performance for the lower fluence regions not covered by the experimental study. All investigated sensors display 60$\%$ or higher charge collection efficiency at their respective highest lifetime fluences when operated at 800 V, and display above 90$\%$ at the lowest fluence, at 600 V. The collected charge close to the fluence of $10^{16}~\textrm{n}_\textrm{eq}\textrm{cm}^{-2}$ exceeds 1 fC at voltages beyond 800 V.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Temperature Dependence of Infrared Laser Charge Deposition in Silicon

We report on the observation of signicant temperature dependance of the charge collected in a silicon detector when using an infrared laser to simulate energy deposition by charged particles. We provide a qualitative explanation of this eect by the strong variation of absorption length of infrared light with temperature in the region of 1060 nm.

43 PARTICLE ACCELERATORS↗

New Technologies for Discovery

For the field of high energy physics to continue to have a bright future, priority within the field must be given to investments in the development of both evolutionary and transformational detector development that is coordinated across the national laboratories and with the university community, international partners and other disciplines. While the fundamental science questions addressed by high energy physics have never been more compelling, there is acute awareness of the challenging budgetary and technical constraints when scaling current technologies. Furthermore, many technologies are reaching their sensitivity limit and new approaches need to be developed to overcome the currently irreducible technological challenges. This situation is unfolding against a backdrop of declining funding for instrumentation, both at the national laboratories and in particular at the universities. This trend has to be reversed for the country to continue to play a leadership role in particle physics, especially in this most promising era of imminent new discoveries that could finally break the hugely successful, but limited, Standard Model of fundamental particle interactions. In this challenging environment it is essential that the community invest anew in instrumentation and optimize the use of the available resources to develop new innovative, cost-effective instrumentation, as this is our best hope to successfully accomplish the mission of high energy physics. This report summarizes the current status of instrumentation for high energy physics, the challenges and needs of future experiments and indicates high priority research areas.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

First beam tests of prototype silicon modules for the CMS High Granularity Endcap Calorimeter

The High Luminosity phase of the Large Hadron Collider will deliver 10 times more integrated luminosity than the existing collider, posing significant challenges for radiation tolerance and event pileup on detectors, especially for forward calorimetry. As part of its upgrade program, the Compact Muon Solenoid collaboration is designing a high-granularity calorimeter (HGCAL) to replace the existing endcap calorimeters. It will feature unprecedented transverse and longitudinal readout and triggering segmentation for both electromagnetic and hadronic sections. The electromagnetic section and a large fraction of the hadronic section will be based on hexagonal silicon sensors of 0.5–1 cm 2 cell size, with the remainder of the hadronic section being based on highly-segmented scintillators with silicon photomultiplier readout. The intrinsic high-precision timing capabilities of the silicon sensors will add an extra dimension to event reconstruction, especially in terms of pileup rejection. First hexagonal silicon modules, using the existing Skiroc2 front-end ASIC developed for CALICE, have been tested in beams at Fermilab and CERN in 2016. Here, we present results from these tests, in terms of system stability, calibration with minimum-ionizing particles and resolution (energy, position and timing) for electrons, and the comparisons of these quantities with GEANT4-based simulation.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Data Analysis and Detector Troubleshooting for the Silicon Muon Scanner

Muon tomography is the calculation of the density distribution of a material from the probable angles of muon Coulomb scattering in a sampled object. This allows the probing of internal object structures that cannot otherwise be observed. It has many important applications for both national security and other fields, such as archaeology and geology. Its uses range from detecting radioactive material intended for nuclear weaponry to searching for hidden chambers in the Egyptian pyramids. In this project we intend to demonstrate the capability of a tomographic system which uses cosmic rays as the muon source and tracks each muon's initial and final trajectories to ascertain information about their scattering pattern. This method can be used to determine the structure or composition of an object, such as testing to see if a nuclear fuel cask is empty or full. We intend this as an early R&D exploration into the practicality of implementing silicon microstrip sensors in border scans for radioactive contraband, as an alternative to existing drift tube technology.

43 PARTICLE ACCELERATORS↗

A compressed sensing X-ray camera with a multilayer architecture

Recent advances in compressed sensing theory and algorithms offer new possibilities for high-speed X-ray camera design. In many CMOS cameras, each pixel has an independent on-board circuit that includes an amplifier, noise rejection, signal shaper, an analog-to-digital converter (ADC), and optional in-pixel storage. When X-ray images are sparse, i.e., when one of the following cases is true: (a.) The number of pixels with true X-ray hits is much smaller than the total number of pixels; (b.) The X-ray information is redundant; or (c.) Some prior knowledge about the X-ray images exists, sparse sampling may be allowed. In this work, we first illustrate the feasibility of random on-board pixel sampling (ROPS) using an existing set of X-ray images, followed by a discussion about signal to noise as a function of pixel size. Next, we describe a possible circuit architecture to achieve random pixel access and in-pixel storage. The combination of a multilayer architecture, sparse on-chip sampling, and computational image techniques, is expected to facilitate the development and applications of high-speed X-ray camera technology.

47 OTHER INSTRUMENTATION↗

Random On-Board Pixel Sampling (ROPS) X-Ray Camera

Recent advances in compressed sensing theory and algorithms offer new possibilities for high-speed X-ray camera design. In many CMOS cameras, each pixel has an independent on-board circuit that includes an amplifier, noise rejection, signal shaper, an analog-to-digital converter (ADC), and optional in-pixel storage. When X-ray images are sparse, i.e., when one of the following cases is true: (a.) The number of pixels with true X-ray hits is much smaller than the total number of pixels; (b.) The X-ray information is redundant; or (c.) Some prior knowledge about the X-ray images exists, sparse sampling may be allowed. Here we first illustrate the feasibility of random on-board pixel sampling (ROPS) using an existing set of X-ray images, followed by a discussion about signal to noise as a function of pixel size. Next, we describe a possible circuit architecture to achieve random pixel access and in-pixel storage. The combination of a multilayer architecture, sparse on-chip sampling, and computational image techniques, is expected to facilitate the development and applications of high-speed X-ray camera technology.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

3D IC for Future HEP Detectors

Three dimensional integrated circuit technologies offer the possibility of fabricating large area arrays of sensors integrated with complex electronics with minimal dead area, which makes them ideally suited for applications at the LHC upgraded detectors and other future detectors. Here we describe ongoing R&D efforts to demonstrate functionality of components of such detectors. This also includes the study of integrated 3D electronics with active edge sensors to produce "active tiles" which can be tested and assembled into arrays of arbitrary size with high yield.

24 POWER TRANSMISSION AND DISTRIBUTION↗