Reliable, Low-Cost Low-Weigh, Non-Hermetic Coatings for MCM Applications
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packaging MCMs cost↗
Engineering topics
Licari, J.
Publications and source records attributed to Licari, J..
Standards for Epoxies Used in Microelectronics
Improved qualification standards and test procedures for epoxy adhesives used in assembly of high-reliability hybrid microcircuits listed in new report. Objective of standards to resolve problems in areas of outgassing, bond shear strength, corrosivity, volume resistivity, ionic impurities, electrical stability, and frequency of qualification testing. pp
Caruso, S. V.↗