Engineering topics

Lee, Sheng Yen

Publications and source records attributed to Lee, Sheng Yen.

7 records

NASA NTRS1991

A new antifoaming agent for epoxy material processing

It has been found that fluorodiepoxides are effective antifoaming agents for epoxy processing when applied at a level as low as 0.1 to 0.2 percent, and there is no adverse effect on the properties of the cured products. The novelty of the fluorodiepoxide is that it is reactive and can copolymerize with a conventional epoxy resin at the same time in the same way in forming an inter-crosslinked polymer network. However, when applied at a high level, compatibility problems may prevail.

Lee, Sheng Yen↗

NASA NTRS1991

Unique applications of fluoroepoxy materials

The following subject areas are covered: (1) fluoroepoxy and curing agents; (2) an excellent moisture vapor barrier coating; (3) as adhesives to bond Teflon without any surface treatment; (4) a new method to make thermosetting fluoropolymer foam; and (5) as a new antifoaming agent for epoxy material manufacturing and processing.

Lee, Sheng Yen↗

NASA NTRS1990

Thermomechanical properties of polymeric materials and related stresses

The thermomechanical properties of a number of widely used polymeric materials were determined by thermomechanical analysis and dynamic mechanical analysis. A combined profile of the coefficient of thermal expansion and the modulus change over a wide temperature range obtained by the analyses shows clearly the drastic effect of the glass transition on both the CTE and the modulus of a polymer, and the damaging potential due to such effect.

Lee, Sheng Yen↗

NASA NTRS1990

Thermomechanical properties of polymeric materials and related stresses

The thermomechanical analysis (TMA) and dynamic mechanical analysis characterizations of a polymeric material yield useful data relating to the thermomechanical stresses of eight widely used polymeric materials. The materials encompass Lexan, Plexiglass, Epon, Conap, Uralane, Solithane, and Humiseal. A combined profile of the coefficient of thermal expansion (CTE) and the modulus change over a wide temperature range obtained by these analytical methods indicates the drastic effects of glass transition on both the CTE and the modulus of a polymer. TMA can also detect secondary transitions, and provides a convenient means for the study of a polymer's toughness.

Lee, Sheng Yen↗

NASA NTRS1989

Fluoroepoxy Adhesives Bond Fluoroplastics

Etching or other special preparation unnecessary. Experiments show fluoroepoxy compounds of high fluorine content adhere to fluoroplastics, without prior etching or other treatment of fluoroplastic surfaces. Compounds mixed with each other in approximately stoichiometric amounts and react to produce fluoroepoxy compounds adhering to fluoroplastics. Advantageous in bonding polymers having fluorine contents of 55 percent or more.

Lee, Sheng Yen↗

NASA NTRS1988

The use of fluoroepoxy compounds as adhesives to bond fluoroplastics without any surface treatment

The use of fluoroepoxy compounds as adhesives to bond fluoroplastics was investigated. Fluoroepoxy compounds with a F-content higher than 46 percent were able to bond a highly fluorinated plastic such as Teflon PTFE (76 percent F) to give a respectable bond strength without any surface treatment. The advantage of the fluoroepoxy adhesive vanished when applied to a less fluorinated plastic such as Tefzel which contains 55 percent fluorine. Among the curing agents explored, octafluorooctamethylenediamine showed its potential as a cocuring agent for improving both the viscosity of the compound and the flexibility of the cured product.

Lee, Sheng Yen↗

NASA NTRS1987

Thermosetting Fluoropolymer Foams

New process makes fluoropolymer foams with controllable amounts of inert-gas fillings in foam cells. Thermosetting fluoropolymers do not require foaming additives leaving undesirable residues and do not have to be molded and sintered at temperatures of about 240 to 400 degree C. Consequently, better for use with electronic or other parts sensitive to high temperatures or residues. Uses include coatings, electrical insulation, and structural parts.

Lee, Sheng Yen↗