Engineering topics

Lamb, James L.

Publications and source records attributed to Lamb, James L..

12 records

NASA NTRS2012

Bump Bonding Using Metal-Coated Carbon Nanotubes

Bump bonding hybridization techniques use arrays of indium bumps to electrically and mechanically join two chips together. Surface-tension issues limit bump sizes to roughly as wide as they are high. Pitches are limited to 50 microns with bumps only 8-14 microns high on each wafer. A new process uses oriented carbon nanotubes (CNTs) with a metal (indium) in a wicking process using capillary actions to increase the aspect ratio and pitch density of the connections for bump bonding hybridizations. It merges the properties of the CNTs and the metal bumps, providing enhanced material performance parameters. By merging the bumps with narrow and long CNTs oriented in the vertical direction, higher aspect ratios can be obtained if the metal can be made to wick. Possible aspect ratios increase from 1:1 to 20:1 for most applications, and to 100:1 for some applications. Possible pitch density increases of a factor of 10 are possible. Standard capillary theory would not normally allow indium or most other metals to be drawn into the oriented CNTs, because they are non-wetting. However, capillary action can be induced through the ability to fabricate oriented CNT bundles to desired spacings, and the use of deposition techniques and temperature to control the size and mobility of the liquid metal streams and associated reservoirs. This hybridization of two technologies (indium bumps and CNTs) may also provide for some additional benefits such as improved thermal management and possible current density increases.

Lamb, James L.↗

NASA NTRS2012

Carbon Nanotube Bonding Strength Enhancement Using Metal "Wicking" Process

Carbon nanotubes grown from a surface typically have poor bonding strength at the interface. A process has been developed for adding a metal coat to the surface of carbon nano tubes (CNTs) through a wicking process, which could lead to an enhanced bonding strength at the interface. This process involves merging CNTs with indium as a bump-bonding enhancement. Classical capillary theory would not normally allow materials that do not wet carbon or graphite to be drawn into the spacings by capillary action because the contact angle is greater than 90 degrees. However, capillary action can be induced through JPL's ability to fabricate oriented CNT bundles to desired spacings, and through the use of deposition techniques and temperature to control the size and mobility of the liquid metal streams and associated reservoirs. A reflow and plasma cleaning process has also been developed and demonstrated to remove indium oxide, and to obtain smooth coatings on the CNT bundles.

Lamb, James L.↗

NASA NTRS1995

Thin Semiconductor/Metal Films For Infrared Devices

Spectral responses of absorbers and reflectors tailored. Thin cermet films composites of metals and semiconductors undergoing development for use as broadband infrared reflectors and absorbers. Development extends concepts of semiconductor and dielectric films used as interference filters for infrared light and visible light. Composite films offer advantages over semiconductor films. Addition of metal particles contributes additional thermal conductivity, reducing thermal gradients and associated thermal stresses, with resultant enhancements of thermal stability. Because values of n in composite films made large, same optical effects achieved with lesser thicknesses. By decreasing thicknesses of films, one not only decreases weights but also contributes further to reductions of thermal stresses.

Lamb, James L.↗

NASA NTRS1995

Switch Box For Controlling Flows Of Four Gases

Switch box designed for use in simultaneously controlling flows of as many as four out of total of six available gases into semiconductor-processing chamber. Contains switches, relays, logic circuitry, display devices, and other circuitry for connecting each of as many as four gas controllers to any one of as many as six available mass-flow controllers. Front panel of switch box apprises technician of statuses of flows of various gases.

Wishard, James R.↗

NASA NTRS1994

Semiconductor-metal graded-index composite thin films for infrared applications

Theoretical/experimental studies have been carried out on germanium:silver (Ge:Ag) graded-index composite thin films which demonstrate that graded coatings, consisting of varied concentrations of Ag with respect to the Ge film thickness, exhibit different optical properties ranging from selective infrared (IR) reflectance to broadband IR absorptance. The graded coatings have been produced by dc magnetron cosputtering of Ge and Ag and the spectral properties are found to be stable against temperature. The coatings have been applied to an infrared tunnel sensor (micro-Golay cell) to improve the device performance.

Lamb, James L.↗

NASA NTRS1993

Semiconductor- Metal Graded Index Composite Thin Films for Infrared Applications

Theoretical/experimental studies have been carried out on Germanium:Silver (Ge:Ag) graded index composite thin films, which demonstrate that graded coatings, consisting of varied concentrations of Ag with respect to the Ge film thickness, exhibit different optica properties ranging from selective infrared (IR) reflectance to broadband IR absorptance.

Inhomogeneous↗

NASA NTRS1993

The JPL Microdevices Laboratory: Capabilities and Access

The Microdevices Laboratory (MDL) at JPL is a world-class microdevice and microinstrument research and advanced development center. It houses processing facilities for end-to-end device fabrication based on Si, GaAs, and superconductors down to 0.1 (micro)m feature size. MDL's charter is to develop and demonstrate new microdevice technologies, and to transfer these technologies to NASA users and to industry. In full operation since 1990, MDL has demonstrated rapid prototyping of several new microdevices and technologies.

microdevices microtechnology fabrication prototypi↗

NASA NTRS1993

Optical Properties of Semiconductor-Metal Composite Thin Films in the Infrared Region

Germanium:Silver (Ge:Ag) composite thin films having different concentrations of Ag, ranging from 7% to 40% have been prepared by dc co-sputtering of Ge an Ag and the films' surface morphology and optical properties have been characterized using transmission electron microscopy (TEM) and infrared spectrophotometry. It is seen that while the films containing lower concentrations of Ag have island-like morphology (i.e. Ag particles distributed in a Ge matrix), the higher metallic concentration films tend to have symmetric distribution of Ag and Ge.

Films Germanium Silver↗

NASA NTRS1990

Quantized-"Gray-Scale" Electronic Synapses

Proposed array of programmable synaptic connections for electronic neural network applications offers multiple quantized levels of connection strength using only simple, two-terminal, binary microswitch devices. Subgrids in fine grid of programmable resistive connections connected externally in parallel to form coarser synaptic grid. By selection of pattern of connections in each subgrid, connection strength of synaptic node represented by that subgrid set at quantized "gray level". Device structures promise implementations of quantized-"gray-scale" synaptic arrays with very high density.

Lamb, James L.↗

NASA NTRS1989

Electrodes For Alkali-Metal Thermoelectric Converters

Combination of thin, porous electrode and overlying collector grid reduces internal resistance of alkali-metal thermoelectric converter cell. Low resistance of new electrode and grid boosts power density nearly to 1 W/cm2 of electrode area at typical operating temperatures of 1,000 to 1,300 K. Conductive grid encircles electrode film on alumina tube. Bus wire runs along tube to collect electrical current from grid. Such converters used to transform solar, nuclear, and waste heat into electric power.

Williams, Roger M.↗

NASA NTRS1989

Thin metal electrode for AMTEC

An electrode having higher power output is formed of a thin, porous film (less than 1 micrometer) applied to a beta-alumina solid electrolyte (BASE). The electrode includes an open grid, current collector such as a series of thin, parallel, grid lines applied to the thin film and a plurality of cross-members such as loop of metal wire surrounding the BASE tube. The loops are electrically connected by a bus wire. The overall impedance of the electrode considering both the contributions from the bulk BASE and the porous electrode BASE interface is low, about 0.5 OHM/cm.sup.2 and power densities of over 0.3 watt/cm.sup.2 for extended periods.

Williams, Roger M.↗

NASA NTRS1988

Method of producing high T(subc) superconducting NBN films

Thin films of niobium nitride with high superconducting temperature (T sub c) of 15.7 K are deposited on substrates held at room temperature (approx 90 C) by heat sink throughout the sputtering process. Films deposited at P sub Ar 12.9 + or - 0.2 mTorr exhibit higher T sub c with increasing P sub N2,I with the highest T sub c achieved at P sub n2,I= 3.7 + or - 0.2 mTorr and total sputtering pressure P sub tot = 16.6 + or - 0.4. Further increase of N2 injection starts decreasing T sub c.

Thakoor, Sarita↗