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Kolawa, Elizabeth A.

Publications and source records attributed to Kolawa, Elizabeth A..

13 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2008

Mission Architecture and Technology Options for a Flagship Class Venus In Situ Mission

Venus, as part of the inner triad with Earth and Mars, represents an important exploration target if we want to learn more about solar system formation and evolution. Comparative planetology could also elucidate the differences between the past, present, and future of these three planets, and can help with the characterization of potential habitable zones in our solar system and, by extension, extrasolar systems. A long lived in situ Venus mission concept, called the Venus Mobile Explorer, was prominently featured in NASA's 2006 SSE Roadmap and supported in the community White Paper by the Venus Exploration Analysis Group (VEXAG). Long-lived in situ missions are expected to belong to the largest (Flagship) mission class, which would require both enabling and enhancing technologies beside mission architecture options. Furthermore, extreme environment mitigation technologies for Venus are considered long lead development items and are expected to require technology development through a dedicated program. To better understand programmatic and technology needs and the motivating science behind them, in this fiscal year (FY08) NASA is funding a Venus Flaghip class mission study, based on key science and technology drivers identified by a NASA appointed Venus Science and Technology Definition Team (STDT). These mission drivers are then assembled around a suitable mission architecture to further refine technology and cost elements. In this paper we will discuss the connection between the final mission architecture and the connected technology drivers from this NASA funded study, which - if funded - could enable a future Flagship class Venus mission and potentially drive a proposed Venus technology development program.

Balint, Tibor S.↗
NASA NTRS2008

Extreme Environment Technologies for Space and Terrestrial Applications

Over the next decades, NASA's planned solar system exploration missions are targeting planets, moons and small bodies, where spacecraft would be expected to encounter diverse extreme environmental (EE) conditions throughout their mission phases. These EE conditions are often coupled. For instance, near the surface of Venus and in the deep atmospheres of giant planets, probes would experience high temperatures and pressures. In the Jovian system low temperatures are coupled with high radiation. Other environments include thermal cycling, and corrosion. Mission operations could also introduce extreme conditions, due to atmospheric entry heat flux and deceleration. Some of these EE conditions are not unique to space missions; they can be encountered by terrestrial assets from the fields of defense,oil and gas, aerospace, and automotive industries. In this paper we outline the findings of NASA's Extreme Environments Study Team, including discussions on state of the art and emerging capabilities related to environmental protection, tolerance and operations in EEs. We will also highlight cross cutting EE mitigation technologies, for example, between high g-load tolerant impactors for Europa and instrumented projectiles on Earth; high temperature electronics sensors on Jupiter deep probes and sensors inside jet engines; and pressure vessel technologies for Venus probes and sea bottom monitors. We will argue that synergistic development programs between these fields could be highly beneficial and cost effective for the various agencies and industries. Some of these environments, however, are specific to space and thus the related technology developments should be spear headed by NASA with collaboration from industry and academia.

extreme environments↗
NASA NTRS2007

Radiation Hardened Electronics for Space Environments (RHESE)

Radiation Environmental Modeling is crucial to proper predictive modeling and electronic response to the radiation environment. When compared to on-orbit data, CREME96 has been shown to be inaccurate in predicting the radiation environment. The NEDD bases much of its radiation environment data on CREME96 output. Close coordination and partnership with DoD radiation-hardened efforts will result in leveraged - not duplicated or independently developed - technology capabilities of: a) Radiation-hardened, reconfigurable FPGA-based electronics; and b) High Performance Processors (NOT duplication or independent development).

Keys, Andrew S.↗
NASA NTRS2007

Developments in Radiation-Hardened Electronics Applicable to the Vision for Space Exploration

The Radiation Hardened Electronics for Space Exploration (RHESE) project develops the advanced technologies required to produce radiation hardened electronics, processors, and devices in support of the anticipated requirements of NASA's Constellation program. Methods of protecting and hardening electronics against the encountered space environment are discussed. Critical stages of a spaceflight mission that are vulnerable to radiation-induced interruptions or failures are identified. Solutions to mitigating the risk of radiation events are proposed through the infusion of RHESE technology products and deliverables into the Constellation program's spacecraft designs.

Keys, Andrew S.↗
NASA NTRS2007

High-Performance, Radiation-Hardened Electronics for Space Environments

The Radiation Hardened Electronics for Space Environments (RHESE) project endeavors to advance the current state-of-the-art in high-performance, radiation-hardened electronics and processors, ensuring successful performance of space systems required to operate within extreme radiation and temperature environments. Because RHESE is a project within the Exploration Technology Development Program (ETDP), RHESE's primary customers will be the human and robotic missions being developed by NASA's Exploration Systems Mission Directorate (ESMD) in partial fulfillment of the Vision for Space Exploration. Benefits are also anticipated for NASA's science missions to planetary and deep-space destinations. As a technology development effort, RHESE provides a broad-scoped, full spectrum of approaches to environmentally harden space electronics, including new materials, advanced design processes, reconfigurable hardware techniques, and software modeling of the radiation environment. The RHESE sub-project tasks are: SelfReconfigurable Electronics for Extreme Environments, Radiation Effects Predictive Modeling, Radiation Hardened Memory, Single Event Effects (SEE) Immune Reconfigurable Field Programmable Gate Array (FPGA) (SIRF), Radiation Hardening by Software, Radiation Hardened High Performance Processors (HPP), Reconfigurable Computing, Low Temperature Tolerant MEMS by Design, and Silicon-Germanium (SiGe) Integrated Electronics for Extreme Environments. These nine sub-project tasks are managed by technical leads as located across five different NASA field centers, including Ames Research Center, Goddard Space Flight Center, the Jet Propulsion Laboratory, Langley Research Center, and Marshall Space Flight Center. The overall RHESE integrated project management responsibility resides with NASA's Marshall Space Flight Center (MSFC). Initial technology development emphasis within RHESE focuses on the hardening of Field Programmable Gate Arrays (FPGA)s and Field Programmable Analog Arrays (FPAA)s for use in reconfigurable architectures. As these component/chip level technologies mature, the RHESE project emphasis shifts to focus on efforts encompassing total processor hardening techniques and board-level electronic reconfiguration techniques featuring spare and interface modularity. This phased approach to distributing emphasis between technology developments provides hardened FPGA/FPAAs for early mission infusion, then migrates to hardened, board-level, high speed processors with associated memory elements and high density storage for the longer duration missions encountered for Lunar Outpost and Mars Exploration occurring later in the Constellation schedule.

Keys, Andrew S.↗
NASA NTRS2007

Extreme Environments Technologies for Probes to Venus and Jupiter

This viewgraph presentation reviews the technologies that are used to mitigate extreme environments for probes at Venus and Jupiter. The contents include: 1) Extreme environments at Venus and Jupiter; 2) In-situ missions to Venus and Jupiter (past/present/future); and 3) Approaches to mitigate conditions of extreme environments for probes with systems architectures and technologies.

probe↗
NASA NTRS2006

Mitigating Extreme Environments for In-Situ Jupiter and Venus Missions

In response to the recommendations by the National Research Council (NRC), NASA's Solar System Exploration (SSE) Roadmap identified the in situ exploration of Venus and Jupiter as high priority science objectives. For Jupiter, deep entry probes are recommended, which would descend to approx.250 km - measured from the 1 bar pressure depth. At this level the pressure would correspond to approx.100 bar and the temperature would reach approx.500(deg)C. Similarly, at the surface of Venus the temperature and pressure conditions are approx.460(deg)C and approx.90 bar. Lifetime of the Jupiter probes during descent can be measured in hours, while in{situ operations at and near the surface of Venus are envisioned over weeks or months. In this paper we discuss technologies, which share commonalities in mitigating these extreme conditions over proposed mission lifetimes, specially focusing on pressure and temperature environments.

Venus↗
NASA NTRS2006

Sensor Amplifier for the Venus Ground Ambient

Previous Venus Landers employed high temperature pressure vessels, with thermally protected electronics, to achieve successful missions, with a maximum surface lifetime of 127 minutes. Extending the operating range of electronic systems to the temperatures (480 C) and pressures (90 bar) of the Venus ground ambient would significantly increase the science return of future missions. Toward that end, the current work describes the innovative design of a sensor preamplifier, capable of working in the Venus ground ambient and designed using commercial components (thermionic vacuum tubes, wide band gap transistors, thick film resistors, advanced high temperature capacitors, and monometallic interfaces) To identify commercial components and electronic packaging materials that are capable of operation within the specified environment, a series of active devices, passive components, and packaging materials were screened for operability at 500C, assuming a 10x increase in the mission lifetime. In addition. component degradation as a function of time at 500(deg)C was evaluated. Based on the results of these preliminary evaluations, two amplifiers were developed.

Venus electronics↗
NASA NTRS2004

Microfabricated thermoelectric power-generation devices

A device for generating power to run an electronic component. The device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with a high temperature region. During operation, heat flows from the high temperature region into the heat-conducting substrate, from which the heat flows into the electrical power generator. A thermoelectric material (e.g., a BiTe alloy-based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. A low temperature region is located on the side of the thermoelectric material opposite that of the high temperature region. The thermal gradient generates electrical power and drives an electrical component.

Fleurial, Jean-Pierre↗
NASA NTRS2002

Microfabricated thermoelectric power-generation devices

A device for generating power to run an electronic component. The device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with a high temperature region. During operation, heat flows from the high temperature region into the heat-conducting substrate, from which the heat flows into the electrical power generator. A thermoelectric material (e.g., a BiTe alloy-based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. A low temperature region is located on the side of the thermoelectric material opposite that of the high temperature region. The thermal gradient generates electrical power and drives an electrical component.

Fleurial, Jean-Pierre↗
NASA NTRS1999

Die Attachment for -120 C to +20 C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview

Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future Rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of approximately equal -90 C to a high of approximately equal +20 C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional--even high-reliability electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars Rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately I year. Our conclusion, from a review of literature and personal contacts. is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars Rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus from the standpoint of die attachment. it appears feasible to eliminate thermal control for Rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars Rovers.

Kirschman, Randall K.↗