Engineering topics
Publications and source records attributed to Katehi, Linda P. B..
The paper demonstrates a nearly square patch antenna integrated with a novel microelectromechanical systems (MEMS) actuator for reconfiguring the polarization. Experimental results demonstrate that at a fixed frequency, the polarization can be reconfigured, from circular to linear.
In this paper, novel low loss, wide-band coplanar stripline technology for radio frequency (RF)/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth, and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semi-conductor devices and microelectromechanical systems (MEMS).
In this paper, novel low loss, wide-band coplanar stripline technology for RF/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semiconductor devices and microelectromechanical systems (MEMS).
The paper demonstrates a patch antenna integrated with a novel microelectromechanical systems (MEMS) actuator for reconfiguring the operating frequency. Experimental results demonstrate that the center frequency can be reconfigured by as much as 1.6 percent of the nominal operating frequency at K-Band In addition, a novel on-wafer antenna pattern measurement technique is demonstrated.
A novel microelectromechanical systems (MEMS) actuator for patch antenna reconfiguration, is presented for the first time. A key feature is the capability of multi-band operation without greatly increasing the antenna element dimensions. Experimental results demonstrate that the center frequency can be reconfigured from few hundred MHz to few GHz away from the nominal operating frequency.
Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior three-dimensional-finite element method (3-D-FEM) electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually Increases coupling between the lines: however, if the top of the via posts are connected by a metal strip, coupling is reduced. In this paper, experimental verification of the 3-D-FEM simulations is demonstrated for commercially fabricated low temperature cofired ceramic (LTCC) packages. In addition, measured attenuation of microstrip lines surrounded by the shielding structures is presented and shows that shielding structures do not change the attenuation characteristics of the line.
This paper presents the measured characteristics of lumped elements in coplanar waveguide with narrow width ground planes. It is shown for the first time that lumped elements may be placed in the ground planes of the Finite Ground Coplanar waveguide (FGC) to obtain enhanced electrical characteristics.
The paper presents the numerically simulated input impedance of a cavity backed circular aperture antenna with suspended substrate stripline probe feed. The simulation is based on the finite element method. The results show the input impedance or the return loss as a function of the frequency with the probe dimensions as parameters. The simulated results are validated by measurements at millimeter-wave frequencies.
A micromachined structure with reduced parasitics is proposed to enhance the resonant frequency and the quality factor (Q) of a spiral inductor. Inductors with various etch depths have been fabricated on a high resistivity Si substrate. Two-port S-parameters measurement is taken to characterize the performance of the inductors. With an etch depth of 20 micron, a fabricated 1.8 nH spiral inductor achieves a maximum resonant frequency of 25.6 GHz and a maximum Q of 20.2 at 14.5 GHz. This technology is compatible with SiGe/Si HBT technology, and the spiral inductors are especially suitable for Si-based monolithic microwave integrated circuit (MMIC) applications.
In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are presented. In addition, measured and numerically modeled results of the performance of the interconnects have been shown. The results indicate that the proposed technology has tremendous potential applications in integrated circuit technology. C,
Si RFICs on standard, 2 Omega-cm. Si wafers require novel transmission lines to reduce the loss caused by the resistive substrate. One such transmission line is commonly called Thin Film Microstrip (TFMS), which is created by depositing a metallic ground plane, thin insulating layers, and the microstrip lines on the Si wafer. Thus, the electric fields are isolated from the Si wafer. In this paper, it is shown through experimental results that the ground plane of TFMS may be finite width and comparable to the strip width in size while still achieving low loss on 2 Omega-cm Si. Measured effective permittivity shows that the field interaction with the Si wafer is small.
Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior 3D-FEM electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually increases coupling between the lines; however, if the top of the via posts are connected by a metal Strip, coupling is reduced. In this paper, experimental verification of the 3D-FEM simulations Is demonstrated for commercially fabricated LTCC packages.
LTCC MCMs (Low Temperature Cofired Ceramic MultiChip Module) for RF and wireless systems often use metal filled via holes to improve isolation between the stripline and microstrip interconnects. In this paper, results from a 3D-FEM electromagnetic characterization of microstrip and stripline interconnects with metal filled via fences for isolation are presented. It is shown that placement of a via hole fence closer than three times the substrate height to the transmission lines increases radiation and coupling. Radiation loss and reflections are increased when a short via fence is used in areas suspected of having high radiation. Also, via posts should not be separated by more than three times the substrate height for low radiation loss, coupling, and suppression of higher order modes in a package.
A new version of coplanar waveguide (CPW) with electrically narrow ground strips 14 has been developed for microwave integrated circuits. This transmission line, referred to by Finite Ground Coplanar (FGC) waveguide, has several advantages over conventional coplanar waveguide. Since the ground strips are narrow, parasitic resonances that develop when the CPW is placed on a carrier or in a package are eliminated. In addition, the narrow ground strips permit the integration of lumped and distributed circuit elements in the ground strips as well as in the center strip to reduce the circuit size and improve its performance. Finally, the coupling between adjacent FGC transmission lines is lower than the coupling between CPW lines for the same spacing between the lines. All of these attributes of FGC are presented in this paper.
In this paper a new transmission line for microwave applications, referred to here as the Micro-Coplanar Stripline (MCPS), is introduced. The propagation characteristics, such as, characteristic impedance (Z(sub 0) and effective dielectric constant (epsilon eff) for a range of MCPS geometries have been modeled using the Finite Difference Time Domain (FDTD) Technique and presented here. Also, preliminary experimental results on the performance of an MCP-Microstrip transition and an MCPS-fed patch antenna are presented. The results indicate several potential applications of the MCPS line in microwave integrated circuit technology.
With recent advance in the epitaxial growth of silicon-germanium heterojunction, Si/SiGe HBTs with high f(sub max) and f(sub T) have received great attention in MMIC applications. In the past year, technologies for mesa-type Si/SiGe HBTs and other lumped passive components with high resonant frequencies have been developed and well characterized for circuit applications. By integrating the micromachined lumped passive elements into HBT fabrication, multi-stage amplifiers operating at 20 GHz have been designed and fabricated.
To solve many of the problems encountered when using conventional coplanar waveguide (CPW) with its semi-infinite ground planes, a new version of coplanar waveguide with electrically narrow ground planes has been developed. This new transmission line which we call Finite Ground Coplanar (FGC) waveguide has several advantages which make it a better transmission line for RF and wireless circuits. Since the ground planes are electrically narrow, spurious resonances created by the CPW ground planes and the metal carrier or package base are eliminated. In addition, lumped and distributed circuit elements may now be integrated into the ground strips in the same way as they traditionally have been integrated into the center conductor to realize novel circuit layouts that are smaller and have less parasitic reactance. Lastly, FGC is shown to have lower coupling between adjacent transmission lines than conventional CPW.
Reduced coupling between adjacent striplines in LTCC packages is commonly accomplished by walls made of plated via holes. In this paper, a 3D-FEM electromagnetic simulation of stripline with filled via fences on both sides is presented. It is shown that the radiation loss of the stripline and the coupling between striplines increases if the fence is placed too close to the stripline.