Morphological stability of solid-liquid interfaces under additive manufacturing conditions
Not Available
36 MATERIALS SCIENCE↗
Engineering topics
Karma, Alain (ORCID:0000000170329862)
Publications and source records attributed to Karma, Alain (ORCID:0000000170329862).
Cell invasion during competitive growth of polycrystalline solidification patterns
Abstract Spatially extended cellular and dendritic array structures forming during solidification processes such as casting, welding, or additive manufacturing are generally polycrystalline. Both the array structure within each grain and the larger scale grain structure determine the performance of many structural alloys. How those two structures coevolve during solidification remains poorly understood. By in situ observations of microgravity alloy solidification experiments onboard the International Space Station, we have discovered that individual cells from one grain can unexpectedly invade a nearby grain of different misorientation, either as a solitary cell or as rows of cells. This invasion process causes grains to interpenetrate each other and hence grain boundaries to adopt highly convoluted shapes. Those observations are reproduced by phase-field simulations further demonstrating that invasion occurs for a wide range of misorientations. Those results fundamentally change the traditional conceptualization of grains as distinct regions embedded in three-dimensional space.
36 MATERIALS SCIENCE↗
Microstructural Pattern Formation during Far-from-Equilibrium Alloy Solidification
We introduce a new phase-field formulation of rapid alloy solidification that quantitatively in- corporates non-equilibrium effects at the solid-liquid interface over a very wide range of interface velocities. Simulations identify a new dynamical instability of dendrite tip growth driven by solute trapping at velocities approaching the absolute stability limit. They also reproduce the formation of the widely observed banded microstructures, revealing how this instability triggers transitions between dendritic and microsegregation-free solidification. Predicted band spacings agree quantita- tively with observations in rapidly solidified Al-Cu thin films.
36 MATERIALS SCIENCE↗
Topological control of liquid-metal-dealloyed structures
Abstract The past few years have witnessed the rapid development of liquid metal dealloying to fabricate nano-/meso-scale porous and composite structures with ultra-high interfacial area for diverse materials applications. However, this method currently has two important limitations. First, it produces bicontinuous structures with high-genus topologies for a limited range of alloy compositions. Second, structures have a large ligament size due to substantial coarsening during dealloying at high temperature. Here we demonstrate computationally and experimentally that those limitations can be overcome by adding to the metallic melt an element that promotes high-genus topologies by limiting the leakage of the immiscible element during dealloying. We further interpret this finding by showing that bulk diffusive transport of the immiscible element in the liquid melt strongly influences the evolution of the solid fraction and topology of the structure during dealloying. The results shed light on fundamental differences in liquid metal and electrochemical dealloying and establish a new approach to produce liquid-metal-dealloyed structures with desired size and topologies.
36 MATERIALS SCIENCE↗