Engineering topics
Jones, Steven
Publications and source records attributed to Jones, Steven.
Advanced Aerogel Technology
The JPL Aerogel Laboratory has made aerogels for NASA flight missions, e.g., Stardust, 2003 Mars Exploration Rovers and the 2011 Mars Science Laboratory, as well as NASA research projects for the past 14 years. During that time it has produced aerogels of a range of shapes, sizes, densities and compositions. Research is ongoing in the development of aerogels for future sample capture and return missions and for thermal insulation for both spacecraft and scientific instruments. For the past several years, the JPL Aerogel Laboratory has been developing, producing and testing a new composite material for use as the high temperature thermal insulation in the Advanced Sterling Radioisotope Generator (ASRG) being developed by Lockheed Martin and NASA. The composite is made up of a glass fiber felt, silica aerogel, Titania powder, and silica powder. The oxide powders are included to reduce irradiative heat transport at elevated temperatures. These materials have thermal conductivity values that are the same as the best commercially produced high temperature insulation materials, and yet are 40% lighter. By greatly reducing the amount of oxide powder in the composite, the density, and therefore for the value of the thermal conductivity, would be reduced. The JPL Aerogel Laboratory has experimented with using glass fiber felt, expanded glass fiber felt and loose fibers to add structural integrity to silica aerogels. However, this work has been directed toward high temperature applications. By conducting a brief investigation of the optimal combination of fiber reinforcement and aerogel density, a durable, extremely efficient thermal insulation material for ambient temperature applications would be produced. If a transparent thermal insulation is desired, then aerogel is an excellent candidate material. At typical ambient temperatures, silica aerogel prevents the transport of heat via convection and conduction due to its highly porous nature. To prevent irradiative thermal transport, silica aerogel can be used in conjunction with a transparent polymeric material that blocks infrared radiation. The transparency of silica aerogel is typically greater than 90% for visible wavelengths from 500 nm to 900 nm for a 5 mm long path length.
Composite Silica Aerogels Opacified with Titania
A further improvement has been made to reduce the high-temperature thermal conductivities of the aerogel-matrix composite materials described in Improved Silica Aerogel Composite Materials (NPO-44287), NASA Tech Briefs, Vol. 32, No. 9 (September 2008), page 50. Because the contribution of infrared radiation to heat transfer increases sharply with temperature, the effective high-temperature thermal conductivity of a thermal-insulation material can be reduced by opacifying the material to reduce the radiative contribution. Therefore, the essence of the present improvement is to add an opacifying constituent material (specifically, TiO2 powder) to the aerogel-matrix composites.
Hybrid Multifoil Aerogel Thermal Insulation
This innovation blends the merits of multifoil insulation (MFI) with aerogel-based insulation to develop a highly versatile, ultra-low thermally conductive material called hybrid multifoil aerogel thermal insulation (HyMATI). The density of the opacified aerogel is 240 mg/cm3 and has thermal conductivity in the 20 mW/mK range in high vacuum and 25 mW/mK in 1 atmosphere of gas (such as argon) up to 800 C. It is stable up to 1,000 C. This is equal to commercially available high-temperature thermal insulation. The thermal conductivity of the aerogel is 36 percent lower compared to several commercially available insulations when tested in 1 atmosphere of argon gas up to 800 C.
Improved Silica Aerogel Composite Materials
A family of aerogel-matrix composite materials having thermal-stability and mechanical- integrity properties better than those of neat aerogels has been developed. Aerogels are known to be excellent thermal- and acoustic-insulation materials because of their molecular-scale porosity, but heretofore, the use of aerogels has been inhibited by two factors: (1) Their brittleness makes processing and handling difficult. (2) They shrink during production and shrink more when heated to high temperatures during use. The shrinkage and the consequent cracking make it difficult to use them to encapsulate objects in thermal-insulation materials. The underlying concept of aerogel-matrix composites is not new; the novelty of the present family of materials lies in formulations and processes that result in superior properties, which include (1) much less shrinkage during a supercritical-drying process employed in producing a typical aerogel, (2) much less shrinkage during exposure to high temperatures, and (3) as a result of the reduction in shrinkage, much less or even no cracking.
Aerogel/Particle Composites for Thermoelectric Devices
Optimizing solution chemistry and the addition of titania and fumed silica powder reduces shrinkage. These materials would serve to increase thermal efficiency by providing thermal insulation to suppress lateral heat leaks. They would also serve to prolong operational lifetime by suppressing sublimation of certain constituents of thermoelectric materials (e.g., sublimation of Sb from CoSb3) at typical high operating temperatures. [The use of pure silica aerogels as cast-in-place thermal-insulation and sublimation-suppression materials was described in "Aerogels for Thermal Insulation of Thermoelectric Devices" (NPO-40630), NASA Tech Briefs, Vol. 30, No. 7 (July 2006), page 50.] A silica aerogel is synthesized in a solgel process that includes preparation of a silica sol, gelation of the sol, and drying of the gel in a solvent at a supercritical temperature and pressure. The utility of pure silica aerogel is diminished by a tendency to shrink (and, therefore, also to crack) during the gelation and supercritical-drying stages. Moreover, to increase suppression of sublimation, it is advantageous to make an aerogel having greater density, but shrinkage and cracking tend to increase with density. A composite material of the type under investigation consists mostly of titania oxide powder particles and a small addition of fumed silica powder, which are mixed into the sol along with other ingredients prior to the gelation stage of processing. The silica aerogel and fumed silica act as a binder, gluing the titania particles together. It is believed that the addition of fumed silica stiffens the aerogel network and reduces shrinkage during the supercritical-drying stage. Minimization of shrinkage enables establishment of intimate contact between thermoelectric legs and the composite material, thereby maximizing the effectiveness of the material for thermal insulation and suppression of sublimation. To some extent, the properties of the composite can be tailored via the proportions of titania and other ingredients. In particular (see figure), the addition of a suitably large proportion of titania (e.g., 0.6 g/cu cm) along with a 10-percent increase in the amount of tetraethylorthosilicate [TEOS (an ingredient of the sol)] to an aerogel component having a density 40 mg/cm3makes it possible to cast a high-average-density (>0.1 g/cm3) aerogel/particle composite having low shrinkage (2.3 percent).
Aerogels for Thermal Insulation of Thermoelectric Devices
Silica aerogels have been shown to be attractive for use as thermal-insulation materials for thermoelectric devices. It is desirable to thermally insulate the legs of thermoelectric devices to suppress lateral heat leaks that degrade thermal efficiency. Aerogels offer not only high thermal- insulation effectiveness, but also a combination of other properties that are especially advantageous in thermoelectric- device applications. Aerogels are synthesized by means of sol-gel chemistry, which is ideal for casting insulation into place. As the scale of the devices to be insulated decreases, the castability from liquid solutions becomes increasingly advantageous: By virtue of castability, aerogel insulation can be made to encapsulate devices having any size from macroscopic down to nanoscopic and possibly having complex, three-dimensional shapes. Castable aerogels can permeate voids having characteristic dimensions as small as nanometers. Hence, practically all the void space surrounding the legs of thermoelectric devices could be filled with aerogel insulation, making the insulation highly effective. Because aerogels have the lowest densities of any known solid materials, they would add very little mass to the encapsulated devices. The thermal-conductivity values of aerogels are among the lowest reported for any material, even after taking account of the contributions of convection and radiation (in addition to true thermal conduction) to overall effective thermal conductivities. Even in ambient air, the contribution of convection to effective overall thermal conductivity of an aerogel is extremely low because of the highly tortuous nature of the flow paths through the porous aerogel structure. For applications that involve operating temperatures high enough to give rise to significant amounts of infrared radiation, opacifiers could be added to aerogels to reduce the radiative contributions to overall effective thermal conductivities. One example of an opacifier is carbon black, which absorbs infrared radiation. Another example of an opacifier is micron- sized metal flakes, which reflect infrared radiation. Encapsulation in cast aerogel insulation also can help prolong the operational lifetimes of thermoelectric devices that must operate in vacuum and that contain SiGe or such advanced skutterudite thermoelectric materials as CoSb3 and CeFe3.5Co0.5Sb12. The primary cause of deterioration of most thermoelectric materials is thermal decomposition or sublimation (e.g., sublimation of Sb from CoSb3) at typical high operating temperatures. Aerogel present near the surface of CoSb3 can impede the outward transport of Sb vapor by establishing a highly localized, equilibrium Sb vapor atmosphere at the surface of the CoSb3.