Advances in Reliability Monitoring and Failure Analysis in 3D Microsystems
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Jordan, Matthew↗
Engineering topics
Jarzembski, Amun
Publications and source records attributed to Jarzembski, Amun.
Frequency domain thermoreflectance measurements of semiconductors with no metal transducer layer
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Hodges, Wyatt Lea↗
Substrate dependence of heat dissipation in GaN p-n diodes bonded to SiC, AlN direct-bonded Cu, and diamond
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Meyers, Vincent Evan↗
Wide-Field, Subsurface Bond Health Evaluation of Heterogeneously-Integrated Microelectronics Using Frequency Domain Thermoreflectance
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Jarzembski, Amun↗
Simultaneous Thermo-mechanical Mapping via Optical Pumping for Subsurface Defect Identification
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Jarzembski, Amun↗
Measuring Thermal Boundary Conductance of Subsurface and Angled Interfaces
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Hodges, Wyatt Lea↗