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Hunter, Donald

Publications and source records attributed to Hunter, Donald.

Cold Survivable Electronics Motor Control Law Implementation

For the last seven years JPL has been developing motor control electronics for use on future missions to extreme environments such as Europa and Mars. The packaging technology developed will allow the electronics to survive the extremes seen on the surface. This packaging technology allows us to package everything to control a number of motors on a single card including the closed loop control. In order to improve the performance of the motor control we have developed FPGA code to close the position, velocity and current control loops of the motor controller. This code allowed for a significant improvement in loop rate allowing the control of the motors to be more accurate. This allows for more accurate control of descent engines, more precise control of robotic arm motors. In this paper we will present the design of the control algorithm, the performance of the sensors and the test results of the resulting system.

Cheng, Ben

Cold Survivable Distributed Motor Controller (CSDMC)

This paper presents the results of NASA’s COLDTECH development entitled “Cold Survivable Distributed Motor Controller (CSDMC)”. This work addresses the need to lower the mass, power and volume of the motor control electronics and its associated cabling. Landed payload mass of ocean world missions typically requires a spacecraft launch mass of 7-10x the landed mass due to the required propellant to get the payload to the surface. Reduction of landed mass leads to cheaper, more frequent missions and/or increased science return. This work addresses this need by developing a distributed electronics architecture, which places control and power electronics near or at actuators and instruments. The outcome of this effort will result in a 10X reduction in harness mass, enabling a significant increase in science payload which then enables more capable sample acquisition, delivery and analysis systems on these missions. Placing the control and power conversion electronics at or near the actuators or instruments is the cornerstone of our distributed architecture. To do this, we developed the technology necessary to distribute the electronics and place them on a shared interface and power bus. This enables a significant reduction in cable mass along with its associated complexity. This allows spacecraft designers to take advantage of volume at the extremities that would normally not be utilized. In this paper we discuss the technologies and system design to achieve these goals in support of ocean world missions. These technologies include the development of our motor control modules, a point of load regulator and isolated converter modules along with the packaging technology necessary to allow our electronics to survive the extreme temperatures.

Stell, Chris

Compact Low Power Avionics for the Europa Lander Concept and Other Missions to Ocean Worlds

This paper presents the results of NASA’s game-changing technology development entitled “Ultra Low Temperature Electronics” which represents a paradigm shift in spacecraft avionics development. The project has developed compact avionics technologies to address the Command & Data Handling (CDH), Power and Motor Control needs for mission concepts to ocean worlds such as a potential Europa Lander. We addressed this need by developing the key technologies necessary to develop a next generation compact avionics package. The key technologies that we developed significantly reduce the size, weight, power, and cost (SWAP-C) of the avionics package. These technologies will also allow extreme-environment missions to last longer in their environment by reducing the power and energy requirement to keep the avionics warm.

Bolotin, Gary

Advanced Packaging Materials and Techniques for High Power TR Module: Standard Flight vs. Advanced Packaging

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires advances in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and compared to standard technologies.

Deformation, Ecosystem Structure, and Dynamics of