Engineering topics

Hunter, Don J.

Publications and source records attributed to Hunter, Don J..

9 records

NASA NTRS2020

An embedded planar-foil capacitor material, FPGA based interposer, aimed at improving system performance and reduced board size for space based electronics

This paper presents work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuits (ASIC). FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. The developed interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry.

Cheng, Ben↗

NASA NTRS2016

High Temperature Boost (HTB) Anode Power Supply for a Modular and Scalable Power Processing Unit

A concept of a modular and scalable 10kW to 80kW High Temperature Boost (HTB) Power Processing Unit (PPU) capable of operating at temperatures beyond the standard military temperature range was proposed for solar electric in-space propulsion. Within the PPU, the Anode Power Supply (APS) module is a 10kW modular power stage and is the key to the HTB PPU. This paper is to present the design, development, fabrication, testing and thermal demonstration of the 10kW HTB APS. The system architecture and the paradigm shift of the HTB PPU is also to be described. In addition, the extreme environments electronic and packaging technologies are addressed as the fundamental technology path. The HTB PPU is intended for power processing in the area of space solar electric propulsion, where reduction of in-space mass and volume are desired, and sometimes even critical, to achieve the goals of future space flight missions. The concept of the HTB PPU can also be applied to other extreme environment applications, such as geothermal and petroleum deep-well drilling, where higher temperature operation is required.

Carr, Gregory A.↗

NASA NTRS2016

Conceive, Believe and Achieve; A Path to Miniaturization, COTS Infusion, and Size Weight and Power Realization for Flight

JPL along with other aerospace agencies such as the US Air Force Space Pro-grams and a packaging technology innovator, i3 Electronics, Inc., are evaluating the use of state-of-the-art (SOA) commercial off-the-shelf (COTS) and alternative packaging technologies for future high performance and high reliability space applications. Utilization of SOA COTS technologies have resulted in large scale reduction in electronics volume, weight, power, cost and schedule with outstanding electrical performance and high reliability. We will share JPL’s joint design, architectural approach, alternative substrate materials selection, associated processes, and mission assurance role in identifying reliability and qualification risks, as part of the three year Heterogeneous Packaging/Device Integration effort under the guidance and leadership of JPL’s Mission Assurance Directorate.

Hunter, Don J.↗

NASA NTRS2013

A Motor Drive Electronics Assembly for Mars Curiosity Rover: An Example of Assembly Qualification for Extreme Environments

This paper describes the technology development and infusion of a motor drive electronics assembly for Mars Curiosity Rover under space extreme environments. The technology evaluation and qualification as well as space qualification of the assembly are detailed and summarized. Because of the uncertainty of the technologies operating under the extreme space environments and that a high level reliability was required for this assembly application, both component and assembly board level qualifications were performed.

Kolawa, Elizabeth↗

NASA NTRS2013

Extreme Environment Capable, Modular and Scalable Power Processing Unit for Solar Electric Propulsion

This paper is to present a concept of a modular and scalable High Temperature Boost (HTB) Power Processing Unit (PPU) capable of operating at temperatures beyond the standard military temperature range. The various extreme environments technologies are also described as the fundamental technology path to this concept. The proposed HTB PPU is intended for power processing in the area of space solar electric propulsion, where the reduction of in-space mass and volume are desired, and sometimes even critical, to achieve the goals of future space flight missions. The concept of the HTB PPU can also be applied to other extreme environment applications, such as geothermal and petroleum deep-well drilling, where higher temperature operation is required.

Electronics↗

NASA NTRS2013

Extreme Environment Capable, Modular and Scalable Power Processing Unit for Solar Electric Propulsion

This paper is to present a concept of a modular and scalable High Temperature Boost (HTB) Power Processing Unit (PPU) capable of operating at temperatures beyond the standard military temperature range. The various extreme environments technologies are also described as the fundamental technology path to this concept. The proposed HTB PPU is intended for power processing in the area of space solar electric propulsion, where reduction of in-space mass and volume are desired, and sometimes even critical, to achieve the goals of future space flight missions. The concept of the HTB PPU can also be applied to other extreme environment applications, such as geothermal and petroleum deep-well drilling, where higher temperature operation is required.

Carr, Gregory A.↗

NASA NTRS2013

High Temperature Boost (HTB) Power Processing Unit (PPU) Formulation Study

This technical memorandum is to summarize the Formulation Study conducted during fiscal year 2012 on the High Temperature Boost (HTB) Power Processing Unit (PPU). The effort is authorized and supported by the Game Changing Technology Division, NASA Office of the Chief Technologist. NASA center participation during the formulation includes LaRC, KSC and JPL. The Formulation Study continues into fiscal year 2013. The formulation study has focused on the power processing unit. The team has proposed a modular, power scalable, and new technology enabled High Temperature Boost (HTB) PPU, which has 5-10X improvement in PPU specific power/mass and over 30% in-space solar electric system mass saving.

Chen, Yuan↗

NASA NTRS2001

Modular electronics packaging system

A modular electronics packaging system includes multiple packaging slices that are mounted horizontally to a base structure. The slices interlock to provide added structural support. Each packaging slice includes a rigid and thermally conductive housing having four side walls that together form a cavity to house an electronic circuit. The chamber is enclosed on one end by an end wall, or web, that isolates the electronic circuit from a circuit in an adjacent packaging slice. The web also provides a thermal path between the electronic circuit and the base structure. Each slice also includes a mounting bracket that connects the packaging slice to the base structure. Four guide pins protrude from the slice into four corresponding receptacles in an adjacent slice. A locking element, such as a set screw, protrudes into each receptacle and interlocks with the corresponding guide pin. A conduit is formed in the slice to allow electrical connection to the electronic circuit.

Hunter, Don J.↗

NASA NTRS1999

Integrated Avionics System (IAS), Integrating 3-D Technology On A Spacecraft Panel

As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

Hunter, Don J.↗