Position Sensor with Integrated Signal-Conditioning Electronics on a Printed Wiring Board
A position sensor, such as a rotary position sensor, includes the signal-conditioning electronics in the housing. The signal-conditioning electronics are disposed on a printed wiring board, which is assembled with another printed wiring board including the sensor windings to provide a sub-assembly. A mu-metal shield is interposed between the printed wiring boards to prevent magnetic interference. The sub-assembly is disposed in the sensor housing adjacent to an inductor board which turns on a shaft. The inductor board emanates an internally or externally generated excitation signal that induces a signal in the sensor windings. The induced signal represents the rotary position of the inductor board relative to the sensor winding board.