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Holloway, Nancy

Publications and source records attributed to Holloway, Nancy.

Materials, Structures and Manufacturing: An Integrated Approach to Develop Expandable Structures

Membrane dominated space structures are lightweight and package efficiently for launch; however, they must be expanded (deployed) in-orbit to achieve the desired geometry. These expandable structural systems include solar sails, solar power arrays, antennas, and numerous other large aperture devices that are used to collect, reflect and/or transmit electromagnetic radiation. In this work, an integrated approach to development of thin-film damage tolerant membranes is explored using advanced manufacturing. Bio-inspired hierarchical structures were printed on films using additive manufacturing to achieve improved tear resistance and to facilitate membrane deployment. High precision, robust expandable structures can be realized using materials that are both space durable and processable using additive manufacturing. Test results show this initial work produced higher tear resistance than neat film of equivalent mass. Future research and development opportunities for expandable structural systems designed using an integrated approach to structural design, manufacturing, and materials selection are discussed.

Belvin, W. Keith

Development of Flexible Multilayer Circuits and Cables

A continuing program addresses the development of flexible multilayer electronic circuits and associated flexible cables. This development is undertaken to help satisfy aerospace-system-engineering requirements for efficient, lightweight electrical and electronic subsystems that can fit within confined spaces, adhere to complexly shaped surfaces, and can be embedded within composite materials. Heretofore, substrate layers for commercial flexible circuitry have been made from sheets of Kapton (or equivalent) polyimide and have been bonded to copper conductors and to other substrate layers by means of adhesives. The substrates for the present developmental flexible circuitry are made from thin films of a polyimide known as LaRC(TM)-SI. This polyimide is thermoplastic and, therefore, offers the potential to eliminate delamination and the need for adhesives. The development work undertaken thus far includes experiments in the use of several techniques of design and fabrication (including computer-aided design and fabrication) of representative flexible circuits. Anticipated future efforts would focus on multilayer bonding, fabrication of prototypes, and overcoming limitations.

Barnes, Kevin N.