Engineering topics

Henderson, H. Thurman

Publications and source records attributed to Henderson, H. Thurman.

3 records

NASA NTRS1995

Improved Solid-State Microanemometer

Improved solid-state microanemometer suitable for measuring flows in variety of biomedical, industrial, and other applications. Small size, unique design, and one-piece construction provides combination of short response time, structural rigidity, optimal dissipation of heat, and versatility in application. Device includes four integral sensing resistors exposed to flow measured and serves as hot-film anemometer subunits. Sensing resistors connected to external excitation-and-measurement circuits operating in any of standard hot-film-anemometer modes; constant input voltage, constant input current, or constant resistance with feedback.

Henderson, H. Thurman↗

NASA NTRS1991

An integrated eddy current detection and imaging system on a silicon chip

Eddy current probes have been used for many years for numerous sensing applications including crack detection in metals. However, these applications have traditionally used the eddy current effect in the form of a physically wound single or different probe pairs which of necessity must be made quite large compared to microelectronics dimensions. Also, the traditional wound probe can only take a point reading, although that point might include tens of individual cracks or crack arrays; thus, conventional eddy current probes are beset by two major problems: (1) no detailed information can be obtained about the crack or crack array; and (2) for applications such as quality assurance, a vast amount of time must be taken to scan a complete surface. Laboratory efforts have been made to fabricate linear arrays of single turn probes in a thick film format on a ceramic substrate as well as in a flexible cable format; however, such efforts inherently suffer from relatively large size requirements as well as sensitivity issues. Preliminary efforts to fully extend eddy current probing from a point or single dimensional level to a two dimensional micro-eddy current format on a silicon chip, which might overcome all of the above problems, are presented.

Henderson, H. Thurman↗

NASA NTRS1990

A silicon micromachined piezoresistive accelerometer for health and condition monitoring

Silicon micromachining etching techniques were utilized to batch-fabricate hundreds of general purpose microaccelerometers on a single silicon substrate. Piezoresistive sensing elements were aligned to the back-side patterns using an IR mask aligner and then diffused into the areas of maximum stress. Capping of the two-arm cantilever beam structure was achieved using a combination of electrostatic bonding and low temperature glass films. Overrange protection, critical damping, and overall protection from the outside environment are achieved by controlling the cavity depths of the top and bottom covers. Temperature compensation, amplification, and filtering are performed by a companion LSI chip that is interfaced to the accelerometer by conventional wire-bonding techniques.

Walsh, Kevin M.↗