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Havens, Stephen J.

Publications and source records attributed to Havens, Stephen J..

At least 19 records

Electron Beam Cured Epoxy Resin Composites for High Temperature Applications

Electron beam curing of Polymer Matrix Composites (PMC's) is a nonthermal, nonautoclave curing process that has been demonstrated to be a cost effective and advantageous alternative to conventional thermal curing. Advantages of electron beam curing include: reduced manufacturing costs; significantly reduced curing times; improvements in part quality and performance; reduced environmental and health concerns; and improvement in material handling. In 1994 a Cooperative Research and Development Agreement (CRADA), sponsored by the Department of Energy Defense Programs and 10 industrial partners, was established to advance the electron beam curing of PMC technology. Over the last several years a significant amount of effort within the CRADA has been devoted to the development and optimization of resin systems and PMCs that match the performance of thermal cured composites. This highly successful materials development effort has resulted in a board family of high performance, electron beam curable cationic epoxy resin systems possessing a wide range of excellent processing and property profiles. Hundreds of resin systems, both toughened and untoughened, offering unlimited formulation and processing flexibility have been developed and evaluated in the CRADA program.

Janke, Christopher J.

Phenylethynyl amine

Four phenylethynyl amine compounds--3 and 4-aminophenoxy-4'-phenylethynylbenzophenone, and 3 and 4-amino-4'-phenylethynylbenzophenone--were readily prepared and were used to endcap imide oligomers. Phenylethynyl-terminated amide acid oligomers and phenylethynyl-terminated imide oligomers with various molecular weights and compositions were prepared and characterized. These oligomers were cured at 300.degree. C. to 400.degree. C. to provide crosslinked polyimides with excellent solvent resistance, high strength and modulus and good high temperature properties. Adhesive panels, composites, films and moldings from these phenylethynyl terminated imide oligomers gave excellent mechanical performance.

Hergenrother, Paul M.

Modified Polyimides Are More Compression Moldable

Offset stoichiometries and end-capping agents impart desired properties. Semicrystalline polyimides synthesized from 3,3',4,4' benzophenonetetracarboxylic dianhydride (BTDA) and 1,3-bis(4-aminophenoxy-4'-benzoyl)benzene (1,3-BABB) modified to increase melt flow. Modified versions more amenable to compression molding, processing to form adhesive bonds, and use as matrices in matrix/fiber composite materials.

Hergenrother, Paul M.

Phenylethynyl terminated imide oligomers

Four phenylethynyl amine compounds - 3 and 4-aminophenoxy-4'-phenylethynylbenzophenone, and 3 and 4-amino-4'-phenylethynylbenzophenone - were readily prepared and were used to endcap imide oligomers. Phenylethynyl-terminated amide acid oligomers and phenylethynyl-terminated imide oligomers with various molecular weights and compositions were prepared and characterized. These oligomers were cured at 300 to 400 C to provide crosslinked polyimides with excellent solvent resistance, high strength and modulus, and good high temperature properties. Adhesive panels, composites, films, and moldings from these phenylethynyl terminated imide oligomers gave excellent mechanical performance.

Hergenrother, Paul M.

Polyamideimides Containing Carbonyl And Ether Linkages

Polyamideimides of new class contain carbonyl and ether connecting groups. New polyamideimides more easily processable, stronger in tension, and more resistant to solvents (including water) than conventional polyamideimides. Improvements in mechanical and chemical properties attributable to semicrystallinity introduced into otherwise amorphous polymers by incorporation of carbonyl and ether linkages.

Hergenrother, Paul M.

Phenylethynyl terminated imide oligomers

Four phenylethynyl amine compounds - 3 and 4-aminophenoxy-4'-phenylethynylbenzophenone, and 3 and 4-amino-4'-phenylethynylbenzophenone - were readily prepared and were used to endcap imide oligomers. Phenylethynyl-terminated amide acid oligomers and phenylethynyl-terminated imide oligomers with various molecular weights and compositions were prepared and characterized. These oligomers were cured at 300 to 400 C to provide crosslinked polyimides with excellent solvent resistance, high strength and modulus, and good high temperature properties. Adhesive panels, composites, films, and moldings from these phenylethynyl terminated imide oligomers gave excellent mechanical performance.

Hergenrother, Paul M.

Polyimides with improved compression moldability

The semicrystalline polyimide prepared by reaction of 3,3',4,4' benzophenonetetracarboxylic (BTDA) and 1,3-bis(4-aminophenoxy 4' benzoyl) benzene (1,3-BABB) is modified so that it can be more readily processed to form adhesive bonds, moldings, and composites. The stoichiometric ratio of the two monomers, BTDA and 1,3-BABB is controlled so that the intermediate polyamide acid is of a calculated molecular weight. A polyimide acid with excess anhydride groups is then reacted with the stoichiometrically required amount of monofunctional aromatic or aliphatic amine required for complete endcapping. The stoichiometrically offset, encapped polyimide is processed at lower temperatures and pressures than the unmodified high molecular weight polyimide with the same repeat unit, and exhibits an improved melt stability.

Hergenrother, Paul M.

Polyimides with carbonyl and ether connecting groups between the aromatic rings

New polyimides have been prepared from the reaction of aromatic dianhydrides with novel aromatic diamines containing carbonyl and ether connecting groups between the aromatic rings. Several of these polyimides are shown to be semi-crystalline as evidenced by wide angle x ray diffraction and differential scanning calorimetry. Most of the polyimides form tough solvent resistant films with high tensile properties. Several of these materials can be thermally processed to form solvent and base resistant moldings.

Hergenrother, Paul M.

Methyl substituted polyimides containing carbonyl and ether connecting groups

Polyimides were prepared from the reaction of aromatic dianhydrides with novel aromatic diamines having carbonyl and ether groups connecting aromatic rings containing pendant methyl groups. The methyl substituent polyimides exhibit good solubility and form tough, strong films. Upon exposure to ultraviolet irradiation and/or heat, the methyl substituted polyimides crosslink to become insoluble.

Hergenrother, Paul M.

New Cross-Linkable Polyimides

Methyl groups cross-link in air at 275 degrees C or upon ultraviolet irradiation to form insoluble polyimides. New materials particularly useful in electronics and microelectronics. Also useful as films, adhesives, and composite matrices.

Hergenrother, Paul M.

Imide/arylene ether copolymers with pendent trifluoromethyl groups

A series of imide/arylene ether block copolymers were prepared using an arylene ether block containing a hexafluoroisopropylidene group and an imide block containing a hexafluoroisopropylidene and a trifluoromethyl group in the polymer backbone. The copolymers were characterized and mechanical properties were determined and compared to the homopolymers.

Jensen, Brian J.

Chemistry and properties of controlled molecular weight end-capped LaRC-CPI

As part of a program on structural resins for high temperature aerospace applications, a controlled molecular weight end-capped semi-crystalline polyimide, designated LaRC-CPI, was evaluated. Neat resin moldings, adhesive specimens and composites were fabricated at temperatures of 365-375 C under pressures of 200-500 psi. Adhesive and composite specimens provided good mechanical properties at temperatures as high as 232 C.

Hergenrother, Paul M.

Polyimides Containing Carbonyl And Ether Connecting Groups

Polyimides of new class made from chemical reactions of aromatic dianhydrides with novel aromatic diamines in which carbonyl and ether groups connect aromatic rings. New polyimides melt-processable, strong, resistant to impacts, and resistant to solvents and other chemicals. Useful as adhesives, coatings, films, membranes, and composite matrices.

Hergenrother, Paul M.

N-(3-ethynylphenyl)maleimide

Acetylene terminated aspartimides are prepared using two methods. In the first, an amino-substituted aromatic acetylene is reacted with an aromatic bismaleimide in a solvent of glacial acetic acid and/or m-cresol. In the second method, an aromatic diamine is reacted with an ethynyl containing maleimide, such as N-(3-ethynylphenyl) maleimide, in a solvent of glacial acetic acid and/or m-cresol. In addition, acetylene terminated aspartimides are blended with various acetylene terminated oligomers and polymers to yield composite materials exhibiting improved mechanical properties.

Hergenrother, Paul M.

Process for crosslinking methylene-containing aromatic polymers with ionizing radiation

A process for crosslinking aromatic polymers containing radiation-sensitive methylene groups (-CH2-) by exposing the polymers to ionizing radiation thereby causing crosslinking of the polymers through the methylene groups is described. Crosslinked polymers are resistant to most organic solvents such as acetone, alcohols, hydrocarbons, methylene, chloride, chloroform, and other halogenated hydrocarbons, to common fuels and to hydraulic fluids in contrast to readily soluble uncrosslinked polymers. In addition, the degree of crosslinking of the polymers depends upon the percentage of the connecting groups which are methylene which ranges from 5 to 50 pct and preferably from 25 to 50 pct of the connecting groups, and is also controlled by the level of irradiation which ranges from 25 to 1000 Mrads and preferably from 25 to 250 Mrads. The temperature of the reaction conditions ranges from 25 to 200 C and preferably at or slightly above the glass transition temperature of the polymer. The crosslinked polymers are generally more resistant to degradation at elevated temperatures such as greater than 150 C, have a reduced tendency to creep under load, and show no significant embrittlement of parts fabricated from the polymers.

Bell, Vernon L.

Acetylene terminated aspartimides and resins therefrom

Acetylene terminated aspartimides are prepared using two methods. In the first, an amino-substituted aromatic acetylene is reacted with an aromatic bismaleimide in a solvent of glacial acetic acid and/or m-cresol. In the second method, an aromatic diamine is reacted with an ethynyl containing maleimide, such an N-(3-ethynyl phenyl) maleimide, in a solvent of glacial acetic acid and/or m-cresol. In addition, acetylene terminated aspartimides are blended with various acetylene terminated oligomers and polymers to yield composite materials exhibiting improved mechanical properties.

Hergenrother, Paul M.

Acetylene-Terminated Aspartimides And Derived Resins

New polymers and derived blends exhibit improved processability and properties. New toughened epoxies exhibit excellent properties, but use temperatures limited. Bismaleimide resins are some base materials formulated to develop materials having moderate use temperatures. Work conducted on use of acetylenic (ethynyl) group to cross-link and extend chains of oligomers and polymers to obtain materials to perform at higher temperatures. Extended to include acetylene-terminated aspartimides (ATA's).

Hergenrother, Paul M.

Polyarylene Ethers With Improved Properties

Series of new polyarylene ethers (PAE's) prepared from reaction of activated dihalo compounds with various bisphenols. Compounds exhibit excellent processability by compression molding, plus good mechanical properties. All PAE's prepared suitable for use as adhesives, coatings, films, membranes, and composite matrices. Potentially useful for spacecraft and aircraft applications.

Hergenrother, Paul M.