The ability to integrate ceramics with other materials has been limited by the high temperature s (>800C) associated with ceramic processing. A novel process, known as aerosol deposition (AD), capable of preparing ceramic films at room temperature (RT) has been the subject of recent interest in the thermal spray and microelectronics communities. In this process, ceramic particles are accelerated using pressurized gas, impacted on a substrate and form a dense film under vacuum. This revolutionary process eliminates high temperature processing, enabling new coatings and microelectronic device integration as a back end of line process, in which ceramics can be deposited on metals, plastics, and glasses . Future impact s of this technology on Sandia's mission could include improved ceramic integration, miniaturized magnetic circulators in radar applications, new RF communication products, modification of commercial - off - the - shelf electronics, fabrication of conformal capacitors, thin batteries, glass - to - metal seals, and transparent electronics. Currently, optimization for RT solid - state deposition of ceramics is achieved empirically and fundamental mechanisms for ceramic particle - particle bonding are not well understood. Obtaining this knowledge will allow process - microstructure - property relation ship realization and will enable a differentiating ceramic integration capability. This LDRD leveraged Sandias existing equipment and capabilities in simulation, experimentation, and materials characterization to discover the fundamental mechanisms for ceramic particle deformation, particle - substrate bonding, and particle - particle bonding in RT consolidated films. RT deformation of individual Al 2 O 3 particles was examined computationally and experimentally as a model system for understanding the complex dynamics associated with in vacuo RT deposition conditions associated with AD. Subsequently, particle - substrate bonding and particle - particle bonding in AD Al 2 O 3 consolidated films were examined computationally and experimentally. Fundamental mechanisms behind the AD process were proposed.

36 MATERIALS SCIENCE↗

DOE OSTI2015