Engineering topics
Publications and source records attributed to Ghaffarian, R..
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size, though they may be considered to be an interim solution.
Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
Ball Grid Array (BGA) is an important technology for utilizing higher pin counts, without the attendant handling and processing problems of the peripheral leaded packages. They are also robust in processing because of their higher pitch (0.050 inches typical), better lead rigidity, and self-alignment characteristics during reflow processing.
Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
This paper will compare three different CSP concepts as well as their assembly reliability.
(view graphs) QA Proactive Approach, SM Package Trends, Introduction on Ball Grid Array, Environmental Test.
Different aspects of advanced surface mount package technology have been investigated for aerospace applications.
Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
Spacecraft electronics including those used at the Jet Propulsion Laboratory (JPL), demand production of highly reliable assemblies. JPL has recently completed an extensive study, funded by NASA's code Q, of the interplay between manufacturing defects and reliability of ball grid array (BGA) and surface mount electronic components.
The Jet Propulsion Laboratory (JPL) is currently assessing the use of Ball Grid Arrays (BGAs) for National Aeronautics and Space Administration (NASA) spaceflight applications. This work is being funded through NASA Headquarters, Code Q. The objectives are to demonstrate the robustness, quality and reliability of BGAs technology, and to assist in the solicited industrial, academic and other related consortia to work together to leverage the related efforts into a synergistic effort. Initial results of these activities will be summarized and presented in this paper.
Jet Propulsion Laboratory (JPL) is currently assessing the use of Ball Grid Arrays (BGAs) for National Aeronautics and Space Administration (NASA) spaceflight applications. This work is being funded through NASA Headquarters, Code Q. The objectives are to demonstrate the robustness, quality and reliability of BGAs technology, and to assist in the development of the repidly growing infastructure for this technology.
Spacecraft electronics including those used at the Jet Propulsion Laboratory (JPL), demand production of highly reliable assemblies. More than 400 test vehicles were assembled using ceramic and plastic ball grid arrays (BGAs), LCCs, J-leads, and gull wing components.