Engineering topics

Fox, Robert L.

Publications and source records attributed to Fox, Robert L..

45 records · Page 3

NASA NTRS1992

Toroid Joining Gun For Fittings And Couplings

Hand-held gun used to join metal heat-to-shrink couplings. Uses magnetic induction (eddy currents) to produce heat in metal coupling, and thermocouple to measure temperature and signals end of process. Gun, called "toroid joining gun" concentrates high levels of heat in localized areas. Reconfigured for use on metal heat-to-shrink fitting and coupling applications. Provides rapid heating, operates on low power, lightweight and portable. Safe for use around aircraft fuel and has no detrimental effects on surrounding surfaces or objects. Reliable in any environment and under all weather conditions. Gun logical device for taking full advantage of capabilities of new metal heat-to-shrink couplings and fittings.

Fox, Robert L.↗

NASA NTRS1992

A cryogenic multichannel electronically scanned pressure module

Consideration is given to a cryogenic multichannel electronically scanned pressure (ESP) module developed and tested over an extended temperature span from -184 to +50 C and a pressure range of 0 to 5 psig. The ESP module consists of 32 pressure sensor dice, four analog 8 differential-input multiplexers, and an amplifier circuit, all of which are packaged in a physical volume of 2 x 1 x 5/8 in with 32 pressure and two reference ports. Maximum nonrepeatability is measured at 0.21 percent of full-scale output. The ESP modules have performed consistently well over 15 times over the above temperature range and continue to work without any sign of degradation. These sensors are also immune to repeated thermal shock tests over a temperature change of 220 C/sec.

Shams, Qamar A.↗

NASA NTRS1991

Ceramic susceptor for induction bonding of metals, ceramics, and plastics

A thin (.005) flexible ceramic susceptor (carbon) was discovered. It was developed to join ceramics, plastics, metals, and combinations of these materials using a unique induction heating process. Bonding times for laboratory specimens comparing state of the art technology to induction bonding were cut by a factor of 10 to 100 times. This novel type of carbon susceptor allows for applying heat directly and only to the bondline without heating the entire structure, supports, and fixtures of a bonding assembly. The ceramic (carbon film) susceptor produces molten adhesive or matrix material at the bond interface. This molten material flows through the perforated susceptor producing a fusion between the two parts to be joined, which in many instances has proven to be stronger than the parent material. Bonding can be accomplished in 2 minutes on areas submitted to the inductive heating. Because a carbon susceptor is used in bonding carbon fiber reinforced plastics and ceramics, there is no radar signature or return making it an ideal process for joining advanced aerospace composite structures.

Fox, Robert L.↗

NASA NTRS1991

Rapid induction bonding of composites, plastics, and metals

The Toroid Bonding Gun is and induction heating device. It is a self contained, portable, low powered induction welding system developed for bonding or joining plastic, ceramic, or metallic parts. Structures can be bonded in a factory or in a the field. This type of equipment allows for applying heat directly to the bond lines and/or to the adhesives without heating the entire structure, supports, and fixtures of a bonding assembly. The induction heating gun originally developed for use in the fabrication of space Gangs of bonders are now used to rapidly join composite sheet and structural components. Other NASA-developed applications of this bonding technique include the joining of thermoplastic composites, thermosetting composites, metals, and combinations of these materials.

Buckley, John D.↗

NASA NTRS1990

Nonintrusive method and apparatus for monitoring the cure of polymeric materials

The invention is a nonintrusive method of monitoring the cure of a polymeric material using an electromagnetic field to sense a change of resistance of the polymeric material in the electromagnetic field that occurs during curing. This change of resistance is used to vary the impedance of an alternating voltage power supply that produces the electromagnetic field and which change of impedance is measured periodically or continuously to monitor the cure of said polymeric material. The apparatus for practicing the method of this invention may include a nonintrusive sensing head providing an inner, electromagnetic core within an open ended outer pot formed of magnet material. The open end of the pot core is positioned from a selected area of the surface of a sheet of the polymeric material. An alternating voltage supply circuit includes an inductance coil around the electromagnetic core and capacitor connected in parallel with the inductance coil forms a resonant tank circuit when energized. The resulting change in resistance of the polymeric material opposite the open end, a function of the curing, is measured as a corresponding change in the impedance of the power supply circuit to thereby monitor the cure of the polymeric material in the selected area.

Johnston, David F.↗

NASA NTRS1988

Method of Attaching Strain Gauges to Various Materials

A method is provided to bond strain gauges to various materials. First, a tape with an adhesive backing is placed across the inside of the fixture frame. The strain gauge is flatly placed against the adhesive backing and coated with a thin, uniform layer of adhesive. The tape is then removed from the fixture frame and placed, strain gauge side down, on the material to be tested. If the material is a high reluctance material, the induction heating source is placed on the tape. If the material is a low reluctance material, a plate with a ferric side and a rubber side is placed, ferric side down, onto the tape. The induction heating source is then placed upon the rubber side. If the material is an insulator material, a ferric plate is placed on the tape. The induction heating source is then placed on the ferric plate. The inductive heating source then generates frequenty from 60 to 70 kilocycles to inductively heat either low reluctance material, ferric side, of ferric plate and provides incidental pressure of approximately five pounds per square inch to the tape for two minutes, thoroughly curing the adhesive. The induction heating source, and, if necessary, the plate or ferric plate, are then removed from the tape after one minute. The tape is then removed from the bonded strain gauge.

Schott, Timothy D.↗

NASA NTRS1988

Field Repair Of Thermoplastic Windows And Canopies

Toroid bonding techniques further developed to meet typical field-repair requirements. Induction-heating power supply engineered into "ruggedized" solid-state unit, in a 1-ft to the third power package weighing 20 lb. Hand-held bonding gun weighing 3 lb plugs into this power supply on long cord. Maximum power required is 300 W. Lightly loaded repair bonds made in several minutes at average power input of 150 W on metallic, polymeric, or polymermatrix materials.

Fox, Robert L.↗

NASA NTRS1986

Seam bonding of graphite reinforced composite panels

An account is given of the design features and operating characteristics of a method for the joining of composite parts, at a rate of 2 to 6 inches/min, in which the heating process responsible for adhesive flow at 800 F is focused upon the overlapped seam. The heating element is a self-tuning solid state power oscillator whose ferrite's toroid geometry generates a uniform, concentrated magnetic flux in the component to be bonded. Specimens cut from graphite/epoxy panels bonded with epoxy-phenolic adhesive by this process have exhibited average lap-shear strengths of the order of 3400 lbs/sq in.

Buckley, John D.↗

NASA NTRS1985

Equipment and techniques for rapid bonding of composites

Rapid adhesive bonding concepts have been developed at NASA Langley which employ induction heating of thermoplastic composite matrices directly along the bond line and/or adherends without heating the entire structure, the supports, and the fixtures of the bonding assembly. Short term thermal cycling and water boil exposures have shown encouraging environmental stability for these rapid bonds. These bonding techniques have been extended to continuous seam bonding of metallic and composite panels with promising results for the bonding of both like and unlike adherends; the portability of the apparatus suggests that field repairs of damaged structures are possible.

Buckley, John D.↗