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Fang, Lu

Publications and source records attributed to Fang, Lu.

At least 19 records
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DOE OSTI2020

Mathematics of Gas Ingress of Hermetic Packages

Herein, we have derived a gas ingress and egress equation from the first principles of ideal gases. This work is intended to benefit the hermetic microelectronics packaging community, but it may be applied to other fields that require a deep understanding of gas ingress and egress dynamics. The equation outlined herein encompasses package material properties, package characteristics, hermetic testing conditions, and service conditions. It serves as a practical utility for calculating package pressure changes due to gas ingress and egress and, therefore, a power tool for component and system service life predictions.

42 ENGINEERING↗
DOE OSTI2019

Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices

Hermetic microcircuit packaging was the dominant method of protecting semiconductor devices in the 1960s and 1970s. After losing majority market sectors to plastic encapsulated microelectronics over the last a few decades, hermetic packaging remains the preferred method of protecting semiconductor devices for critical applications such as in military, space, and medical fields, where components and systems are required to serve for several decades. MEMS devices impose additional challenges to packaging by requiring specific internal cavity pressures to function properly or deliver the needed quality (Q) factors. In MEMS multichip modules, internal pressure requirement conflicts arise when different MEMS devices require different internal gases and pressures. The authors developed a closed-formed equation to model pressure changes of hermetic enclosures due to gas ingression. This article expands the authors mathematical model to calculate gas pressure of a MEMS multichip module package as well as those of MEMS devices inside the multichip module package. These equations are not only capable of calculating service lifetimes of MEMS devices and multi-chip modules but can also help develop MEMS device packaging strategies to extend the service life of MEMS multi-chip modules.

36 MATERIALS SCIENCE↗
DOE OSTI2019

On Gas Ingression of Hermetic Packages

In this paper, a closed-form mathematic equation that governs gas ingression of hermetic packages is derived from first principles and applied to moist air and water vapor ingression conditions. The equation models internal gas partial pressure change as a function of time, external conditions, and package characteristics. The equation provides the theoretical basis for direct comparisons of ingression behaviors of different gases into hermetic packages. Comparing the rates of internal air pressure increase due to air ingression and water vapor partial pressure buildup due to water vapor ingression, the authors theorize that vacuum decay may present a greater challenge to the performance of microelectromechanical systems (MEMS) devices within hermetic packages than that of water vapor content induced corrosion failures. Furthermore, this paper also examines gas ingression of hermetic enclosures with multiple layers of seals.

42 ENGINEERING↗
DOE OSTI2018

Packaging system with cleaning channel and method of making the same

A packaging structure and method for surface mount integrated circuits reduces electrochemical migration (ECM) problems by including one or more cleaning channels to effectively and efficiently remove flux residue that may otherwise remain lodged in gaps between the surface mount package and the printed circuit board. A cleaning channel may be formed along a bottom surface of the surface mount package (i.e., the surface facing the printed circuit board), or along a portion of a top surface of the printed circuit board. In either case, the inclusion of a cleaning channel enlarges the gap between the bottom surface of the surface mount package and the printed circuit board and creates a path for contaminants to be flushed out during a cleaning process.

42 ENGINEERING↗
DOE OSTI2015

Soliton production with nonlinear homogeneous lines

Low- and high-voltage Soliton waves were produced and used to demonstrate collision and compression using diode-based nonlinear transmission lines. Experiments demonstrate soliton addition and compression using homogeneous nonlinear lines. We built the nonlinear lines using commercially available diodes. These diodes are chosen after their capacitance versus voltage dependence is used in a model and the line design characteristics are calculated and simulated. Nonlinear ceramic capacitors are then used to demonstrate high-voltage pulse amplification and compression. The line is designed such that a simple capacitor discharge, input signal, develops soliton trains in as few as 12 stages. We also demonstrated output voltages in excess of 40 kV using Y5V-based commercial capacitors. The results show some key features that determine efficient production of trains of solitons in the kilovolt range.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
DOE OSTI2015

Implementing and diagnosing magnetic flux compression on the Z pulsed power accelerator

We report on the progress made to date for a Laboratory Directed Research and Development (LDRD) project aimed at diagnosing magnetic flux compression on the Z pulsed-power accelerator (0-20 MA in 100 ns). Each experiment consisted of an initially solid Be or Al liner (cylindrical tube), which was imploded using the Z accelerator's drive current (0-20 MA in 100 ns). The imploding liner compresses a 10-T axial seed field, B z ( 0 ) , supplied by an independently driven Helmholtz coil pair. Assuming perfect flux conservation, the axial field amplification should be well described by B z ( t ) = B z ( 0 ) x [ R ( 0 ) / R ( t )] 2 , where R is the liner's inner surface radius. With perfect flux conservation, B z ( t ) and dB z / dt values exceeding 10 4 T and 10 12 T/s, respectively, are expected. These large values, the diminishing liner volume, and the harsh environment on Z, make it particularly challenging to measure these fields. We report on our latest efforts to do so using three primary techniques: (1) micro B-dot probes to measure the fringe fields associated with flux compression, (2) streaked visible Zeeman absorption spectroscopy, and (3) fiber-based Faraday rotation. We also mention two new techniques that make use of the neutron diagnostics suite on Z. These techniques were not developed under this LDRD, but they could influence how we prioritize our efforts to diagnose magnetic flux compression on Z in the future. The first technique is based on the yield ratio of secondary DT to primary DD reactions. The second technique makes use of the secondary DT neutron time-of-flight energy spectra. Both of these techniques have been used successfully to infer the degree of magnetization at stagnation in fully integrated Magnetized Liner Inertial Fusion (MagLIF) experiments on Z [P. F. Schmit et al. , Phys. Rev. Lett. 113 , 155004 (2014); P. F. Knapp et al. , Phys. Plasmas, 22 , 056312 (2015)]. Finally, we present some recent developments for designing and fabricating novel micro B-dot probes to measure B z ( t ) inside of an imploding liner. In one approach, the micro B-dot loops were fabricated on a printed circuit board (PCB). The PCB was then soldered to off-the-shelf 0.020- inch-diameter semi-rigid coaxial cables, which were terminated with standard SMA connectors. These probes were recently tested using the COBRA pulsed power generator (0-1 MA in 100 ns) at Cornell University. In another approach, we are planning to use new multi-material 3D printing capabilities to fabricate novel micro B-dot packages. In the near future, we plan to 3D print these probes and then test them on the COBRA generator. With successful operation demonstrated at 1-MA, we will then make plans to use these probes on a 20-MA Z experiment.

47 OTHER INSTRUMENTATION↗