Electrically Driven Liquid Film Flow Boiling in the Absence of Gravity
No abstract available
Engineering topics
Publications and source records attributed to Didion, Jeffrey R..
No abstract available
Electrically Driven Thermal Management is an active research and technology development initiative incorporating ISS technology flight demonstrations (STP-H5), development of Microgravity Science Glovebox (MSG) flight experiment, and laboratory-based investigations of electrically based thermal management techniques. The program targets integrated thermal management for future generations of RF electronics and power electronic devices. This presentation reviews four program elements: i.) results from the Electrohydrodynamic (EHD) Long Term Flight Demonstration launched in February 2017 ii.) development of the Electrically Driven Liquid Film Boiling Experiment iii.) two University based research efforts iv.) development of Oscillating Heat Pipe evaluation at Goddard Space Flight Center.
Electrically Driven Thermal Management is a vibrant technology development initiative incorporating ISS based technology demonstrations, development of innovative fluid management techniques and fundamental research efforts. The program emphasizes high temperature high heat flux thermal management required for future generations of RF electronics and power electronic devices. This presentation reviews i.) preliminary results from the Electrohydrodynamic (EHD) Long Term Flight Demonstration launched on STP-H5 payload in February 2017 ii.) advances in liquid phase flow distribution control iii.) development of the Electrically Driven Liquid Film Boiling Experiment under the NASA Microgravity Fluid Physics Program.
This presentation presents the science background and ground based results that form the basis of the Electrically Driven Liquid Film Boiling Experiment. This is an ISS experiment that is manifested for 2021. Objective: Characterize the effects of gravity on the interaction of electric and flow fields in the presence of phase change specifically pertaining to: a) The effects of microgravity on the electrically generated two-phase flow. b) The effects of microgravity on electrically driven liquid film boiling (includes extreme heat fluxes). Electro-wetting of the boiling section will repel the bubbles away from the heated surface in microgravity environment. Relevance/Impact: Provides phenomenological foundation for the development of electric field based two-phase thermal management systems leveraging EHD, permitting optimization of heat transfer surface area to volume ratios as well as achievement of high heat transfer coefficients thus resulting in system mass and volume savings. EHD replaces buoyancy or flow driven bubble removal from heated surface. Development Approach: Conduct preliminary experiments in low gravity and ground-based facilities to refine technique and obtain preliminary data for model development. ISS environment required to characterize electro-wetting effect on nucleate boiling and CHF in the absence of gravity. Will operate in the FIR - designed for autonomous operation.
This presentation discusses ground based proof of concept hardware under development at NASA GSFC to address high heat flux thermal management in silicon substrates and embedded thermal management systems. The goal is to develop proof of concept hardware for space flight validation. The space flight hardware will provide gravity insensitive thermal management for electronics applications such as transmit/receive modules that are severely limited by thermal concerns.
The Electrically Driven Single Phase Thermal Management: STP-H5 iEHDS Experiment is a technology demonstration of prototype proof of concept hardware to establish the feasilibilty and long term operation of this hardware. This is a structural thermal plate that will operate continuous as part of the STP-H5 ISEM experiment for up to 18 months. This presentation discusses the design, fabrication and environmental operational paramertes of the experiment hardware.
This presentation discusses ground based proof of concept hardware under development at NASA GSFC to address high heat flux thermal management in silicon substrates. The goal is to develop proof of concept hardware for space flight validation. The space flight hardware will provide gravity insensitive thermal management for electronics applications such as transmit receive modules that are severely limited by thermal concerns.
Thermal Fluids and Analysis Workshop, Silver Spring MD NCTS 21070-15. NASA, the Defense Department and commercial interests are actively engaged in developing miniaturized spacecraft systems and scientific instruments to leverage smaller cheaper spacecraft form factors such as CubeSats. This paper outlines research and development efforts among Goddard Space Flight Center personnel and its several partners to develop innovative embedded thermal control subsystems. Embedded thermal control subsystems is a cross cutting enabling technology integrating advanced manufacturing techniques to develop multifunctional intelligent structures to reduce Size, Weight and Power (SWaP) consumption of both the thermal control subsystem and overall spacecraft. Embedded thermal control subsystems permit heat acquisition and rejection at higher temperatures than state of the art systems by employing both advanced heat transfer equipment (integrated heat exchangers) and high heat transfer phenomena. The Goddard Space Flight Center Thermal Engineering Branch has active investigations seeking to characterize advanced thermal control systems for near term spacecraft missions. The embedded thermal control subsystem development effort consists of fundamental research as well as development of breadboard and prototype hardware and spaceflight validation efforts. This paper will outline relevant fundamental investigations of micro-scale heat transfer and electrically driven liquid film boiling. The hardware development efforts focus upon silicon based high heat flux applications (electronic chips, power electronics etc.) and multifunctional structures. Flight validation efforts include variable gravity campaigns and a proposed CubeSat based flight demonstration of a breadboard embedded thermal control system. The CubeSat investigation is technology demonstration will characterize in long-term low earth orbit a breadboard embedded thermal subsystem and its individual components to develop optimized operational schema.
Optimization of spacecraft size, weight and power (SWaP) resources is an explicit technical priority at Goddard Space Flight Center. Embedded Thermal Control Subsystems are a promising technology with many cross cutting NSAA, DoD and commercial applications: 1.) CubeSatSmallSat spacecraft architecture, 2.) high performance computing, 3.) On-board spacecraft electronics, 4.) Power electronics and RF arrays. The Embedded Thermal Control Subsystem technology development efforts focus on component, board and enclosure level devices that will ultimately include intelligent capabilities. The presentation will discuss electric, capillary and hybrid based hardware research and development efforts at Goddard Space Flight Center. The Embedded Thermal Control Subsystem development program consists of interrelated sub-initiatives, e.g., chip component level thermal control devices, self-sensing thermal management, advanced manufactured structures. This presentation includes technical status and progress on each of these investigations. Future sub-initiatives, technical milestones and program goals will be presented.
Three promising thermal technology development initiatives, vapor compression thermal control system, electronics cooling, and electrohydrodynamics applications are outlined herein. These technologies will provide thermal engineers with additional tools to meet the thermal challenges presented by increased power densities and reduced architectural options that will be available in future spacecraft. Goddard Space Flight Center and the University of Maryland are fabricating and testing a 'proto- flight' vapor compression based thermal control system for the Ultra Long Duration Balloon (ULDB) Program. The vapor compression system will be capable of transporting approximately 400 W of heat while providing a temperature lift of 60C. The system is constructed of 'commercial off-the-shelf' hardware that is modified to meet the unique environmental requirements of the ULDB. A demonstration flight is planned for 1999 or early 2000. Goddard Space Flight Center has embarked upon a multi-discipline effort to address a number of design issues regarding spacecraft electronics. The program addressed the high priority design issues concerning the total mass of standard spacecraft electronics enclosures and the impact of design changes on thermal performance. This presentation reviews the pertinent results of the Lightweight Electronics Enclosure Program. Electronics cooling is a growing challenge to thermal engineers due to increasing power densities and spacecraft architecture. The space-flight qualification program and preliminary results of thermal performance tests of copper-water heat pipes are presented. Electrohydrodynamics (EHD) is an emerging technology that uses the secondary forces that result from the application of an electric field to a flowing fluid to enhance heat transfer and manage fluid flow. A brief review of current EHD capabilities regarding heat transfer enhancement of commercial heat exchangers and capillary pumped loops is presented. Goddard Space Flight Center research efforts applying this technique to fluid management and fluid pumping are discussed.
This paper outlines the end to end effort to produce lightweight electronics enclosures for NASA GSFC electronics applications with the end goal of presenting an array of lightweight box options for a flight opportunity. Topics including the development of requirements, design of three different boxes, utilization of advanced materials and processes, and analysis and test will be discussed. Three different boxes were developed independently and in parallel. A lightweight machined Aluminum box, a cast Aluminum box and a composite box were designed, fabricated, and tested both mechanically and thermally. There were many challenges encountered in meeting the requirements with a non-metallic enclosure and the development of the composite box employed several innovative techniques.
This paper outlines the end to end effort to produce lightweight electronics enclosures for NASA GSFC electronics applications with the end goal of presenting an array of lightweight box options for a flight opportunity. Topics including the development of requirements, design of three different boxes, utilization of advanced materials and processes, and analysis and test will be discussed. Three different boxes were developed independently and in parallel. A lightweight machined Aluminum box, a cast Aluminum box and a composite box were designed, fabricated, and tested both mechanically and thermally. There were many challenges encountered in meeting the requirements with a non-metallic enclosure and the development of the composite box employed several innovative techniques.
An experimental study of the thermal performance of two evaporators installed in the Instrument Thermal Test Bed (ITTB) was conducted. The ITTB was operated as a capillary pumped loop (CPL) with a transport length of approximately 12 meters. Empirical determinations of a general start up procedure, overall heat transfer coefficient, and minimum operating power were accomplished for each evaporator. Additionally, a detailed thermal model was developed for the High Power Spacecraft Thermal Management (HPSTM) evaporator and validated.