Submounts For Laser-Diode Chips
Universal method of bonding laser-diode chip to mount developed. New technique applicable to almost all different types of mounts used in production of laser diodes. Submounts etched, then cut from metal foil. Advantage of this type of submount is edge on which diode mounted is very sharp, eliminating costly need for sharp edge on mount itself.
Dholakia, Anil Ramniklal↗