Engineering topics

DelCastillo, Linda

Publications and source records attributed to DelCastillo, Linda.

7 records

NASA NTRS2013

Extreme Environment Capable, Modular and Scalable Power Processing Unit for Solar Electric Propulsion

This paper is to present a concept of a modular and scalable High Temperature Boost (HTB) Power Processing Unit (PPU) capable of operating at temperatures beyond the standard military temperature range. The various extreme environments technologies are also described as the fundamental technology path to this concept. The proposed HTB PPU is intended for power processing in the area of space solar electric propulsion, where reduction of in-space mass and volume are desired, and sometimes even critical, to achieve the goals of future space flight missions. The concept of the HTB PPU can also be applied to other extreme environment applications, such as geothermal and petroleum deep-well drilling, where higher temperature operation is required.

Carr, Gregory A.↗

NASA NTRS2013

High Temperature Boost (HTB) Power Processing Unit (PPU) Formulation Study

This technical memorandum is to summarize the Formulation Study conducted during fiscal year 2012 on the High Temperature Boost (HTB) Power Processing Unit (PPU). The effort is authorized and supported by the Game Changing Technology Division, NASA Office of the Chief Technologist. NASA center participation during the formulation includes LaRC, KSC and JPL. The Formulation Study continues into fiscal year 2013. The formulation study has focused on the power processing unit. The team has proposed a modular, power scalable, and new technology enabled High Temperature Boost (HTB) PPU, which has 5-10X improvement in PPU specific power/mass and over 30% in-space solar electric system mass saving.

Chen, Yuan↗

NASA NTRS2011

Large Aperture, Scanning, L-Band SAR

We have developed the first L-band membrane-based active phased array. The antenna is a 16x16 element patch array with dimensions of 2.3mx2.6m. The array uses membrane-compatible Transmit/Receive (T/R) modules for electronic beam steering. We will discuss the antenna design, the fabrication of this large array, the T/R module development, the signal distribution approach and the measured results of the array

phased array↗

NASA NTRS2011

Thermally Stabilized Transmit/Receive Modules

RF-hybrid technologies enable smaller packaging and mass reduction in radar instruments, especially for subsystems with dense electronics, such as electronically steered arrays. We are designing thermally stabilized RF-hybrid T/R modules using new materials for improved thermal performance of electronics. We are combining advanced substrate and housing materials with a thermal reservoir material, and develop new packaging techniques to significantly improve thermal-cycling reliability and performance stability over temperature.

thermal cycling stress↗

NASA NTRS2009

NiF2/NaF:CaF2/Ca Solid-State High-Temperature Battery Cells

Experiments and theoretical study have demonstrated the promise of all-solid-state, high-temperature electrochemical battery cells based on NiF2 as the active cathode material, CaF2 doped with NaF as the electrolyte material, and Ca as the active anode material. These and other all-solid-state cells have been investigated in a continuing effort to develop batteries for instruments that must operate in environments much hotter than can be withstood by ordinary commercially available batteries. Batteries of this type are needed for exploration of Venus (where the mean surface temperature is about 450 C), and could be used on Earth for such applications as measuring physical and chemical conditions in geothermal wells and oil wells. All-solid-state high-temperature power cells are sought as alternatives to other high-temperature power cells based, variously, on molten anodes and cathodes or molten eutectic salt electrolytes. Among the all-solid-state predecessors of the present NiF2/NaF:CaF2/Ca cells are those described in "Solid-State High-Temperature Power Cells" (NPO-44396), NASA Tech Briefs, Vol. 32, No. 5 (May 2008), page 40. In those cells, the active cathode material is FeS2, the electrolyte material is a crystalline solid solution of equimolar amounts of Li3PO4 and LiSiO4, and the active anode material is Li contained within an alloy that remains solid in the intended high operational temperature range.

West, William↗

NASA NTRS2009

Advanced Embedded Active Assemblies for Extreme Space Applications

This work describes the development and evaluation of advanced technologies for the integration of electronic die within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible liquid crystal polymer (LCP), using gold thermo-compression flip chip bonding, and embedding them within the material. Daisy chain LCP assemblies were thermal cycled from -135 to +85degC (Mars surface conditions for motor control electronics). The LCP assembly method was further utilized to embed an operational amplifier designed for operation within the Mars surface ambient. The embedded op-amp assembly was evaluated with respect to the influence of temperature on the operational characteristics of the device. Applications for this technology range from multifunctional, large area, flexible membrane structures to small-scale, flexible circuits that can be fit into tight spaces for flex to fit applications.

lead bonding↗

NASA NTRS2008

Ultra-Thin, Flexible Electronics

Thinned die can be used to realize ultra-thin flexible electronics for applications such as conformal and wearable electronics. Three techniques have been developed to achieve this goal using thinned die: die flip chip bonded onto flexible substrates, die laminated onto LCP films, and die embedded in polyimide. A key to achieving each of these techniques is the thinning of die to a thickness of 50 microns or thinner. Conventional CMP processing can be used to thin to 50 microns. At 50 microns, the active die become flexible and must be handled by temporarily bonding them to a holder die, for further processing. Once bonded face down to the holder die, the active die can be further thinned by DRIE etching the exposed backside. The thinned die can then been packaged in or on the flexible substrate.

electronics packaging↗