Engineering topics

Dam, M.

Publications and source records attributed to Dam, M..

3 records

DOE OSTI2022

Promising Technologies and R&D Directions for the Future Muon Collider Detectors

Among the post-LHC generation of particle accelerators, the muon collider represents a unique machine with capability to provide very high energy leptonic collisions and to open the path to a vast and mostly unexplored physics programme. However, on the experimental side, such great physics potential is accompanied by unprecedented technological challenges, due to the fact that muons are unstable particles. Their decay products interact with the machine elements and produce an intense flux of background particles that eventually reach the detector and may degrade its performance. In this paper, we present technologies that have a potential to match the challenging specifications of a muon collider detector and outline a path forward for the future R&D efforts.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2020

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.

47 OTHER INSTRUMENTATION↗

DOE OSTI2020

FCC-ee interaction region backgrounds

The FCC-ee machine induced backgrounds on the two proposed detectors (CLD and IDEA) have been studied in detail. Synchrotron Radiation (SR) considerations dictate the Interaction Region (IR) optimization. An asymmetric IR design limits the final bend critical energy to 100 keV. Masks placed before the final focus quadrupole protect the detector from direct hits, and a shield placed around the beam pipe from secondary particles, keeping the effect of SR on the detector to negligible levels. The most important source of background is expected to be the Incoherent Pair Creation (IPC). Its effect has been studied in full simulation and reconstruction, and it was shown that it will not pose a problem for the detector, even if conservative estimations for the time resolution of the detector sensors are assumed. Moreover, the γγ → hadrons, radiative Bhabhas and beam-gas interaction induced backgrounds were studied. All were found to have small to negligible effect on the detector. Finally overall, the FCC–ee interaction region backgrounds are not expected to compromise the detector performance.

47 OTHER INSTRUMENTATION↗