Low temperature thermal cycle survivability and reliability study for brushless motor drive electronics (#1360)
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solder↗
Engineering topics
Cozy, Scott
Publications and source records attributed to Cozy, Scott.
Design for ASIC reliability for low-temperature applications
In this paper, we present a methodology to design for reliability for low temperature applications without requiring process improvement. The developed hot carrier aging lifetime projection model takes into account both the transistor substrate current profile and temperature profile to determine the minimum transistor size needed in order to meet reliability requirements. The methodology is applicable for automotive, military, and space applications, where there can be varying temperature ranges. A case study utilizing this methodology is given to design for reliability into a custom application-specific integrated circuit (ASIC) for a Mars exploration mission.
reliability↗
Operation of FPGAs at Extremely Low Temperatures
This paper describes the operation of FPGAs at very low temperatures eg -160(deg)C. Both Actel and Xilinx parts are tested It was found that low temperature operations is not a problem with the parts tested, but there is a problem with powering on an FPGA at cold temperatures.
Field-Programmable Gate Array (FPGA)↗