Measurement of spallation cross-sections for 590 MeV protons on thick and thin targets of iron and nickel
Proton irradiation on Fe and Ni targets, measuring spallation cross sections
Cline, J. E.↗
Engineering topics
Cline, J. E.
Publications and source records attributed to Cline, J. E..
Scanning electron mirror microscopy and scanning electron microscopy of integrated circuits.
Scanning electron mirror microscope advantages over electron mirror and scanning electron microscopes for examining integrated circuits
Cline, J. E.↗
X-ray fluorescence and electron microprobe techniques for determination of thin-film thicknesses.
X ray fluorescence and electron microprobe for determining thin film thickness
Cline, J. E.↗
Electron microprobe techniques for failure analysis of silicon planar devices.
Electron microprobe analyzer for failure analysis of silicon planar devices, discussing integrated circuit metallization
Cline, J. E.↗
Study of metallurgical problems related to microelectronic reliability
Metallurgical methods for detection and analysis of failure mechanisms in microelectronic devices
COMPONENT RELIABILITY↗
Determination of the thickness of aluminum on silicon by X-ray fluorescence.
Deposited Al layer thickness on Si determined using X-ray spectrometric technique
SURFACE LAYER↗
Electron-beam instrumentation.
Use of controlled flow of electrons for analyzing and processing integrated circuits and focused electron beam as heat source for microwelding
INTEGRATED CIRCUIT↗