Engineering topics
Publications and source records attributed to Chun, Donghoon.
The paper demonstrates a nearly square patch antenna integrated with a novel microelectromechanical systems (MEMS) actuator for reconfiguring the polarization. Experimental results demonstrate that at a fixed frequency, the polarization can be reconfigured, from circular to linear.
The paper demonstrates a patch antenna integrated with a novel microelectromechanical systems (MEMS) actuator for reconfiguring the operating frequency. Experimental results demonstrate that the center frequency can be reconfigured by as much as 1.6 percent of the nominal operating frequency at K-Band In addition, a novel on-wafer antenna pattern measurement technique is demonstrated.
A novel microelectromechanical systems (MEMS) actuator for patch antenna reconfiguration, is presented for the first time. A key feature is the capability of multi-band operation without greatly increasing the antenna element dimensions. Experimental results demonstrate that the center frequency can be reconfigured from few hundred MHz to few GHz away from the nominal operating frequency.
Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior three-dimensional-finite element method (3-D-FEM) electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually Increases coupling between the lines: however, if the top of the via posts are connected by a metal strip, coupling is reduced. In this paper, experimental verification of the 3-D-FEM simulations is demonstrated for commercially fabricated low temperature cofired ceramic (LTCC) packages. In addition, measured attenuation of microstrip lines surrounded by the shielding structures is presented and shows that shielding structures do not change the attenuation characteristics of the line.
The paper presents the numerically simulated input impedance of a cavity backed circular aperture antenna with suspended substrate stripline probe feed. The simulation is based on the finite element method. The results show the input impedance or the return loss as a function of the frequency with the probe dimensions as parameters. The simulated results are validated by measurements at millimeter-wave frequencies.
Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior 3D-FEM electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually increases coupling between the lines; however, if the top of the via posts are connected by a metal Strip, coupling is reduced. In this paper, experimental verification of the 3D-FEM simulations Is demonstrated for commercially fabricated LTCC packages.
LTCC MCMs (Low Temperature Cofired Ceramic MultiChip Module) for RF and wireless systems often use metal filled via holes to improve isolation between the stripline and microstrip interconnects. In this paper, results from a 3D-FEM electromagnetic characterization of microstrip and stripline interconnects with metal filled via fences for isolation are presented. It is shown that placement of a via hole fence closer than three times the substrate height to the transmission lines increases radiation and coupling. Radiation loss and reflections are increased when a short via fence is used in areas suspected of having high radiation. Also, via posts should not be separated by more than three times the substrate height for low radiation loss, coupling, and suppression of higher order modes in a package.