Choi, Won Mook | Engineering Papers

DOE OSTI2019

Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

36 MATERIALS SCIENCE↗

DOE OSTI2019

Stretchable and foldable electronic devices

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

Rogers, John A.↗

DOE OSTI2018

Stretchable and foldable electronic devices

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

36 MATERIALS SCIENCE↗

DOE OSTI2016

Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

The present invention relates to novel diacylglycerol acyltransferase genes and proteins, and methods of their use. In particular, the invention describes genes encoding proteins having diacylglycerol acetyltransferase activity, specifically for transferring an acetyl group to a diacylglycerol substrate to form acetyl-Triacylglycerols (ac-TAGS), for example, a 3-acetyl-1,2-diacyl-sn-glycerol. The present invention encompasses both native and recombinant wild-type forms of the transferase, as well as mutants and variant forms. The present invention also relates to methods of using novel diacylglycerol acyltransferase genes and proteins, including their expression in transgenic organisms at commercially viable levels, for increasing production of 3-acetyl-1,2-diacyl-sn-glycerols in plant oils and altering the composition of oils produced by microorganisms, such as yeast, by increasing ac-TAG production. Additionally, oils produced by methods of the present inventions comprising genes and proteins are contemplated for use as biodiesel fuel, in polymer production and as naturally produced food oils with reduced calories.

36 MATERIALS SCIENCE↗

DOE OSTI2014

Sonochemical fabrication of Cu{sub 2}O@C/graphene nanohybrid with a hierarchical architecture

A three-dimensional Cu{sub 2}O@C/graphene nanohybrid hierarchical sphere-like architecture has been successfully synthesized by a sonochemical method. The as-prepared nanocomposite has been characterized using various techniques including powder X-ray diffraction, scanning electron microscopy, field emission transmission electron microscopy, thermogravimetric analysis, X-ray photoelectron spectroscopy and Fourier transmission infrared spectrometry. Secondary big hierarchical Cu{sub 2}O@C spheres (diameter of ∼200 nm) consist of primary small Cu{sub 2}O@C spheres (diameter of 5–10 nm), which are uniformly distributed on the graphene surface. In the primary small Cu{sub 2}O@C sphere, amorphous carbon is formed by the oxidation–reduction reaction between 1-aminopyrene and copper(II) acetate in the sonochemical process. Our facile sonochemical method may apply to the preparation of other metal oxide/graphene hierarchical nanohybrids. - Highlights: • The Cu{sub 2}O@C/graphene nanohybrid hierarchical architecture was obtained. • Secondary big hierarchical Cu{sub 2}O@C spheres (diameter of ∼200 nm) consist of primary small Cu{sub 2}O@C spheres (diameter of 5–10 nm). • 1-Aminopyrene serves as a “binding agent” operating through the π–π interactions.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2014

Stretchable and foldable electronic devices

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

36 MATERIALS SCIENCE↗

DOE OSTI2014

Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

77 NANOSCIENCE AND NANOTECHNOLOGY↗

DOE OSTI2013

Stretchable and foldable electronic devices

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

42 ENGINEERING↗

DOE OSTI2013

Printable, flexible and stretchable diamond for thermal management

Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗