Engineering PapersSearch

Engineering topics

Cheng, Ben

Publications and source records attributed to Cheng, Ben.

Cold Survivable Electronics Motor Control Law Implementation

For the last seven years JPL has been developing motor control electronics for use on future missions to extreme environments such as Europa and Mars. The packaging technology developed will allow the electronics to survive the extremes seen on the surface. This packaging technology allows us to package everything to control a number of motors on a single card including the closed loop control. In order to improve the performance of the motor control we have developed FPGA code to close the position, velocity and current control loops of the motor controller. This code allowed for a significant improvement in loop rate allowing the control of the motors to be more accurate. This allows for more accurate control of descent engines, more precise control of robotic arm motors. In this paper we will present the design of the control algorithm, the performance of the sensors and the test results of the resulting system.

Cheng, Ben

Power Converter Design for the Europa Lander Motor Controller

This paper will outline the design and test results for the Europa Lander motor controller’s Power Conversion Slice. Europa Lander is a proposed NASA mission concept to send a stationary spacecraft to Jupiter’s Icy Moon, Europa, to search for subsurface biosignatures. The Power Conversion Card is one of the many technologies designed for this mission. The Power Conversion Card’s primary function is to convert the power supplied by the spacecraft battery to usable power for use within the motor controller. In addition, this card provides power system telemetry to the spacecraft computer. This card tolerates Europa’s harsh radiation environment within a protected vault to enable it to survive the external temperatures which can be as low as -184°C during the three-week mission. This design makes use of multiple commercially available radiation hardened electronics, including Cobham’s UT32M0R500 Arm Microcontroller along with VPT’s DC-DC Converters for power conversion. The microcontroller is used to collect local power system telemetry and assess card health autonomously without intervention from the spacecraft’s main computer. This paper will showcase the design behind the prototype and electrical testing results.

Lias, Malcolm

An evaluation of the CAN bus for use on the Europa Lander motor controller

This paper will present the application of the Controller Area Network (CAN) for communication between the Motor Control Processor and the Europa Lander Motor Control Cards. The Europa Lander preproject team is concerned about lowering the estimated mass, volume, and power of the mission concept so that it could maximize its science return. The motor controller uses multiple Motor Control Cards to control the 24 motors that will be operating in the extremes of the Europa environment. The CAN bus was considered because of its multi-drop nature, low power interface, and simple communication protocol.

Lias, Malcolm

An Evaluation of the CAN bus for Use on the Europa Lander Motor Controller

This paper will present the application of the Controller Area Network (CAN) for communication between the Motor Control Processor and the Europa Lander Motor Control Cards. The Europa Lander mission is concerned about lowering the mass, volume, and power so that it can maximize its science return. The motor controller uses multiple Motor Control Cards to control the 24 motors that will be operating in the extremes of the Europa environment. The CAN bus was considered because of its multi-drop nature, low power interface, and simple communication protocol. Beyond communication with the motor controller cards we also use the CAN bus interface to gather telemetry from the Power Conversion Card. Our system requires the collection of telemetry at a rate of 64Hz from the Power Conversion Card and all active motor controllers along with the sending of control packets and the receipt of control parameters at 512 Hz. In the paper we will address the ability of the CAN bus to meet these requirements along with our Arduino based test system used to learn about the CAN bus standard and verify our analysis.

Lias, Malcolm

Cold Survivable Current Sense Multi-Chip Module

This paper will present the design of a Current Sense Module (CSM) used to measure motor phase currents that is capable of surviving the harsh ambient environment of ocean worlds, such as Europa and Enceladus. The CSM module is fabricated by i3 Electronics using their Multi-Chip Module (MCM) technology with techniques developed by JPL to allow this module to survive temperatures down to -184°C. This module greatly improves the ability to measure phase and bridge current which can be problematic in extreme environments. In addition, by packaging these electronics at the die level, we achieve significant weight and size savings. This module is one of several modules that employ similar techniques that are integrated into a distributed or centralized motor controller. This paper will discuss the module’s design along with a summary of our test results.

Cheng, Ben

An embedded planar-foil capacitor material, FPGA based interposer, aimed at improving system performance and reduced board size for space based electronics

This paper presents work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuits (ASIC). FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. The developed interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry.

Cheng, Ben

An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduced Board Size for Space Based Electronics

This paper presents our work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuit (ASIC) applications. FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. Our interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry. Our Interposer focuses on the needs of Micro Semi’s RTG4 FPGA. We developed the interposer using COTS embedded foil capacitors. The Interposer is customized to the capacitance requirements for each of the FPGA banks. We evaluated three foil manufactures Oak Mitsui, 3M and TDK. The three different designs were evaluated, but we will focus on the Oak-Mitsui based Interposer that we constructed and tested. Through simulations, we validate the horizontal and vertical interconnect inductances, that FPGA decoupling requirements are met. The use of the interposer results in an overall reduction in our Printed Wiring Board (PWB) area.

Hunter, Don J