Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints
Highlights: • The number density of Ag{sub 3}Sn grains precipitated upon Cu{sub 6}Sn{sub 5}, increases with Ag content and reflow temperature (T). • Raising of wt. % of Ag in solder and lowering of T can cause an increase in grain diameter of Ag{sub 3}Sn nanoparticles. • The blockading effect of Ag{sub 3}Sn particles on Cu{sub 6}Sn{sub 5} IMC growth is more pronounced in Sn-3Ag and Sn-3.5Ag alloys. • IMC suppressing nanoparticles can be utilized for solder materials design. - Abstract: The growing importance of Pb-free Sn-xAg solders and high cost of Ag has attracted the attention of researchers to perform experiment with solders with varied content of Ag element. In this study, Sn-xAg(0,1,2,3.5) solder balls on Cu substrate have been reflowed at 250/275/300 °C for 60 s and air cooled. Finite element method has been utilized to simulate the concentration and temperature during cooling. The experimental results suggest that the Cu flux through grain boundary diffusion is the dominant mechanism for Cu{sub 6}Sn{sub 5} intermetallic compound growth in Pure Sn and Sn-1Ag solders. When the Ag content is increased, as in case of Sn-3Ag and Sn-3.5Ag alloys; the shielding effect of Ag{sub 3}Sn nanoparticles is the determinant factor for affecting the thickness of Cu{sub 6}Sn{sub 5} IMC. Both Cu influx rate and shielding effect of Ag{sub 3}Sn nanoparticles are enhanced with the raise in pre-cooled isothermal reflow temperature. Sn-1Ag solder is observed to have the thickest Cu{sub 6}Sn{sub 5} IMC.