Engineering topics
Chattopadhyay, Goutam
Publications and source records attributed to Chattopadhyay, Goutam.
Wafer-To-Wafer Alignment Method
A silicon alignment pin is used to align successive layer of component made in semiconductor chips and/or metallic components to make easier the assembly of devices having a layered structure. The pin is made as a compressible structure which can be squeezed to reduce its outer diameter, have one end fit into a corresponding alignment pocket or cavity defined in a layer of material to be assembled into a layered structure, and then allowed to expand to produce an interference fit with the cavity. The other end can then be inserted into a corresponding cavity defined in a surface of a second layer of material that mates with the first layer. The two layers are in registry when the pin is mated to both. Multiple layers can be assembled to create a multilayer structure. Examples of such devices are presented.
High Power W-Band/F-Band Schottky Diode Based Frequency Multipliers
A solid state device chip including diodes (generating a higher frequency output through frequency multiplication of the input frequency) and a novel on-chip power combining design. Together with the on-chip power combining, the chip has increased efficiency because the diodes' anodes, being micro-fabricated simultaneously on the same patch of a GaAs wafer under identical conditions, are very well balanced. The diodes' GaAs heterostructure and the overall chip geometry are designed to be optimized for high power operation. As a result of all these features, the device can generate record-setting power having a signal frequency in the F-band and W-band (30% conversion efficiency).
Antennas for Space Instruments from GHz to THz
In this paper we present an overview of different antenna technologies for space-based instruments. We show that some of the designs that work well at gigahertz frequencies are difficult to implement at terahertz frequencies due to tight tolerance and rms surface finish requirements. We also show that antenna designs are dictated not only by the frequency of operations but also by the space platform of choice. In this paper, we also present ideas for low-profile terahertz antennas for implementation on SmallSat and CubeSat platforms.
Terahertz Instruments for CubeSats
We have been developing terahertz high resolution spectrometers and radiometers on CubeSat platforms for astrophysics, planetary science, and Earth science applications. We are also developing millimeter-wave communications systems on CubeSat platforms to provide communication links during the entry-descent-landing (EDL) phase of Mars and other planetary missions. In this paper, we present an overview of the state of the millimeter-wave and terahertz instrumentation development for CubeSat platforms. We discuss the design and implementation challenges for these instrument developments. We also look into innovative packaging solutions, antenna technology, and low-power backend options for these instruments. We show that CubeSats and SmallSats will play a key role in future scientific space missions and also they will find increasing applications in commercial communication and other endeavors.
340 Ghz Multipixel Transceiver
A multi-pixel terahertz transceiver is constructed using a stack of semiconductor layers that communicate using vias defined within the semiconductor layers. By using a stack of semiconductor layers, the various electrical functions of each layer can be tested easily without having to assemble the entire transceiver. In addition, the design allows the production of a transceiver having pixels set 10 mm apart.
Interconnect and Packaging Technologies for Terahertz Communication Systems
Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies.
Shared Aperture Metasurface Antennas for Multibeam Patterns
This paper describes various possibilities for designing multibeam antennas using a single metasurface (MTS) aperture. Both single-source and multi-source feeding schemes are considered. For the single-source case, two approaches are investigated: i) division of the aperture in several angular sectors (one per beam) and ii) superposition of the individual modulations required to obtain the beams in the desired directions. A configuration based on a multi-source feeding scheme is also tailored by a superposition of modulation patterns. Numerical results based on the Method of Moments are presented for validation.
Silicon Alignment Pins: An Easy Way to Realize a Wafer-To-Wafer Alignment
A silicon alignment pin is used to align successive layers of components made in semiconductor chips and/or metallic components to make easier the assembly of devices having a layered structure. The pin is made as a compressible structure which can be squeezed to reduce its outer diameter, have one end fit into a corresponding alignment pocket or cavity defined in a layer of material to be assembled into a layered structure, and then allowed to expand to produce an interference fit with the cavity. The other end can then be inserted into a corresponding cavity defined in a surface of a second layer of material that mates with the first layer. The two layers are in registry when the pin is mated to both. Multiple layers can be assembled to create a multilayer structure. Examples of such devices are presented.
Interconnect Between a Waveguide and a Dielectric Waveguide Comprising an Impedance Matched Dielectric Lens
A lens for interconnecting a metallic waveguide with a dielectric waveguide is provided. The lens may be coupled a metallic waveguide and a dielectric waveguide, and minimize a signal loss between the metallic waveguide and the dielectric waveguide.
Dielectric Waveguides Splitter and Hybrid/Isolator for Bidirectional Link
A system, method, device, and apparatus provide a dielectric waveguide splitter/bi-directional link. A dielectric substrate fabricated into a first Y-junction waveguide with a first port splitting into a first branch leading to a second port and a second branch leading to a third port. An angle between the first branch and the second branch is below ninety degrees (90.degree.). The dielectric waveguide splitter enables millimeter-wave (mmWave) transmission between the first port and the second port while reducing feedback of the mmWave between the second and third port. Two Y-junction waveguides may be fabricated back-to-back to provide simultaneous bidirectional mmWave transmission at a single frequency.
Multi-Step Deep Reactive Ion Etching Fabrication Process for Silicon-Based Terahertz Components
A multi-step silicon etching process has been developed to fabricate silicon-based terahertz (THz) waveguide components. This technique provides precise dimensional control across multiple etch depths with batch processing capabilities. Nonlinear and passive components such as mixers and multipliers waveguides, hybrids, OMTs and twists have been fabricated and integrated into a small silicon package. This fabrication technique enables a wafer-stacking architecture to provide ultra-compact multi-pixel receiver front-ends in the THz range.