Engineering topics

Burks, H. D.

Publications and source records attributed to Burks, H. D..

At least 19 records

NASA NTRS1992

Melt flow properties of LARC-TPI 1500 series mixtures

This study examines the melt-flow properties of 50/50 mixtures of high flow grade/medium flow grade LARC-TPI 1500 series pellets and a new form (94/6), of medium flow grade material which contains 6 percent of a low molecular weight imide additive. The flow properties are compared with previously reported flow properties of mixtures of earlier batches of high and medium flow grade TPI 1500 materials. Unlike the earlier batches of materials, the later materials were synthesized and mixed at Mitsui Toatsu Chemicals, Inc., Japan, and made into pellets before NASA received them for characterization. They exhibited a lower melt viscosity as well as improved melt stability.

Burks, H. D.↗

NASA NTRS1990

Characterization of medium and high flow series 1500 LARC-TPI

An imidized version of LARC-TPI was developed on NASA's request for use by both aerospace and electronic industries. Two batches of LARC-TPI 1500 Series, consisting of medium-flow and high-flow pellets with different inherent viscosities, are characterized for their dynamic and isothermal melt flow properties at 340 C, mechanical properties of extrudates, extrudate porosity, and degree of crystallinity. The Series shows significantly better melt flow properties than previosly examimed forms of this polymer.

Burks, H. D.↗

NASA NTRS1987

Polyimide processing additives

A method has been found for enhancing the melt flow of thermoplastic polyimides during processing. A high molecular weight 422 copoly(amic acid) or copolyimide was fused with approximately 0.05 to 5 pct by weight of a low molecular weight amic acid or imide additive, and this melt was studied by capillary rheometry. Excellent flow and improved composite properties on graphite resulted from the addition of a PMDA-aniline additive to LARC-TPI. Solution viscosity studies imply that amic acid additives temporarily lower molecular weight and, hence, enlarge the processing window. Thus, compositions containing the additive have a lower melt viscosity for a longer time than those unmodified.

Pratt, J. R.↗

NASA NTRS1986

Polyimide of Modified Melt Flow and Toughness

Linear aromatic polyphenylene ether sulfideimide (BDSDA/APB) polymer molded, used as resin, and cast into thin films. In effort to improve further both use properties and amenability to process BDSDA/APB, molecular weight of polymer varied by variations in percentage of end capping. Effect of end capping BDSDA/APB determined by measurement of polymer melt viscosity and fracture-energy values for different number average synthesized molecular weights.

St. Clair, T. L.↗

NASA NTRS1985

Process of end-capping a polyimide system

A process of endcapping a polyimide system with an endcapping agent in order to achieve a controlled decrease in molecular weight and melt viscosity along with predictable fracture resistance of the molded products is disclosed. The uncapped system is formed by combining an equimolar ratio of 4,4'-bis (3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA) and 1,-bis (aminophenoxy) benzene (APB) dissolved in bis (2-methoxyethyl)ether. The endcapped system is formed by dissolving APB in bis-(2-methoxyethyl)ether, adding the BDSDA. By varying the amount of endcapping from 0 to 4%, molecular weight is decreased from 13,900 to 8660. At a processing temperature of 250 C, there is a linear relationship between molecular weight and viscosity, with the viscosity decreasing by two orders of magnitude as the molecular weight decreased from 13,900 to 8660.

Stclair, T. L.↗

NASA NTRS1985

Synthesis and Characterization of Copolyimides with Varying Flexibilizing Groups

A series of polyimides and copolyimides with varying flexibilizing groups in their backbone were prepared. They were characterized in order to evaluate the effect of these groups on their rheological, mechanical, adhesive, and thermal properties. A copolymer with equimolar amounts of m-PDA and 4,4'-ODA exhibited the lowest viscosity at all strain rates studied. Since this particular polymer exhibited the best flow properties, it was also evaluated as an adhesive and was found to have exceptional characteristics for this application.

Burks, H. D.↗

NASA NTRS1985

Processable aromatic polyimides

Two similar polyimide systems were synthesized and characterized. The only structural difference was a sulfide linkage in the anhydride-derived portion of the first system vs. a sulfone linkage in the second. Their physical, mechanical, melt-flow and thermal properties, and their resistance to some of the more common solvents were determined. The flow properties of these polyimides indicate a potential for melt processability.

Burks, H. D.↗

NASA NTRS1984

Thermoplastic/Melt-Processable Polyimides

Several polyimides were prepared which show promise for aircraft composite applications. This was achieved through a systematic polymer synthesis program where the glass transition temperatures were greatly lowered when compared to the older polyimide systems. Several of the materials were shown to be hot-melt processable and are attractive matrix resin candidates especially in light of their high g(sub Ic) values. At least two of these polyimides are available for evaluation and others are on the research horizon.

St.clair, T. L.↗

NASA NTRS1984

Polyphenylene ethers with imide linking groups

Novel polyphenylene ethers with imide linking units are disclosed. These polymers incorporate the solvent and thermal resistance of polyimides and the processability of polyphenylene ethers. Improved physical properties over those of the prior art are obtained by incorporating meta linked ethers and/or polyphenylene oxides into the polymer backbone. A novel process for making polymers of this type is also disclosed. The process is unique in that the expected need of high process temperatures and/or special atmospheres are eliminated.

St.clair, T. L.↗

NASA NTRS1984

Synthesis and characterization of a melt processable polyimide

A melt processable polyimide which contains sulfur and oxygen bridges between the aromatic rings (BDSDA/APB) was synthesized and characterized. Its physical, mechanical, thermal and flow properties were determined as was its resistance to some of the more commonly used solvents. The melt flow properties were measured for the temperature range 250 C - 350 C and under the conditions (stress/strain) encountered in commercial processes.

Burks, H. D.↗

NASA NTRS1983

Aromatic Polyimides With Group VI Linkages

New polymer system combines thermal and solvent resistant properties of aromatic polyimides with processability of PPX polymers. PPX polymers include polyphenylene oxide, polyphenylene sulfide, and polyphenylene sulfone classes. Generally more processable by hot melt or thermoplastic techniques than aromatic polyimides. PPX systems more susceptible to attack by solvents and have lower glass transition temperatures than PI group.

St. Clair, T. L.↗

NASA NTRS1983

Synthesis and characterization of a polyethersulfoneimide

Two similar polyimide systems were synthesized and characterized. The only structural difference was a sulfide linkage in the anhydride derived portion of the first system versus a sulfone linkage in the second. Their physical, mechanical, melt-flow and thermal properties were determined and also their resistance to some of the more common solvents. The flow properties of these polyimides indicate them to have potential for melt processability.

Burks, H. D.↗

NASA NTRS1982

Synthesis and characterization of a melt processable polyimide

Burks, H. D.↗

NASA NTRS1981

Flow properties of a series of experimental thermoplastic polymides

The softening temperature to degradation temperature range of the polymers was about 440 to 650 K. All of the polymers retained small amounts of solvent as indicated by an increase in T(sub g) as the polymers were dried. The flow properties showed that all three polymers had very high apparent viscosities and would require high pressures and/or high temperatures and/or long times to obtain adequate flow in prepregging and molding. Although none was intended for such application, two of the polymers were combined with carbon fibers by solution prepregging. The prepregs were molded into laminates at temperatures and times, the selection of which was guided by the results from the flow measurements. These laminates had room temperature short beam shear strength similar to that of carbon fiber laminates with a thermosetting polyimide matrix. However, the strength had considerable scatter, and given the difficult processing, these polymides probably would not be suitable for continuous fiber composites.

Burks, H. D.↗

NASA NTRS1978

Rapid viscosity measurements of powdered thermosetting resins

A rapid and inexpensive method of obtaining processing-related data on powdered thermosetting resins has been investigated. The method involved viscosity measurements obtained with a small specimen (less than 100 mg) parallel plate plastometer. A data acquisition and reduction system was developed which provided a value of viscosity and strain rate about 12-13 second intervals during a test. The effects of specimen compaction pressure and reduction of adhesion between specimen and parallel plates were examined. The plastometer was used to measure some processing-related viscosity changes of an addition polyimide resin, including changes caused by pre-test heat treatment, test temperature, and strain rate.

Price, H. L.↗

NASA NTRS1977

Thermal expansion of an epoxy-glass microsphere composite

The thermal expansion of a composite of epoxy (diglycidyl ether of bisphenol A) and solid glass microspheres was investigated. The microspheres had surfaces which were either untreated or treated with a silicone release agent, an epoxy coupling agent, or a general purpose silane coupling agent. Both room temperature (about 300 K) and elevated temperature (about 475 K) cures were used for the epoxy. Two microsphere size ranges were used, about 50 microns, which is applicable in filled moldings, and about 125 microns, which is applicable as bond line spacers. The thermal expansion of the composites was measured from 300 to 350 K or from 300 to 500 K, depending on the epoxy cure temperature. Measurements were made on composites containing up to .6 volume fraction microspheres. Two predictive models, which required only the values of thermal expansion of the polymer and glass and their specific gravities, were tested against the experimental data. A finite element analysis was made of the thermal strain of a composite cell containing a single microsphere surrounded by a finite-thickness interface.

Price, H. L.↗

NASA NTRS1977

The effect of moisture on the dynamic thermomechanical properties of a graphite/epoxy composite

A study has been made of the effect of moisture absorption on the dynamic thermomechanical properties of a graphite/epoxy composite recently considered for building primary aircraft structures. Torsional braid analysis (TBA) and thermomechanical analysis (TMA) techniques were used to measure changes in the glass transition temperature (Tg) and the initial softening temperature (heat distortion temperature, HDT) of T-300/5209 graphite/epoxy composites exposed to room temperature water soak.

Sykes, G. F.↗

NASA NTRS1975

Film mounting method for thermomechanical analysis

Mounting clamps attach polymeric film sample to thermomechanical analyzer. Using this technique, temperature at which polymer passes from relatively nonflexible or glasslike state to rubbery condition where it exhibits marked increase in flow properties is readily determined.

Burks, H. D.↗